• 한국생산제조학회지
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• 제20권6호
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• pp.685-691
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• 2011

The Bearing preload units are used for stable rotational movements of high speed spindles. The feeding mechanism of the preload unit is important to prevent overheat of bearings and to keep constant bearing load under thermal deformation of spindle unit. In this study, ball slide guide and ball bush as feeding mechanism of preload unit are selected. The maximum static friction force, radial stiffness and damping ratio of ball slide guide with ball load, ball number and ball size are widely investigated. In conclusion, the surface of ball slide guide must be heat treated to reduce static friction force. The number and size of ball are increased to control sensitive bearing preload force.

• 시멘트
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• 통권60호
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• pp.47-56
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• 1975

ball mill로 최적의 능률을 달성하고 생산의 최대 Blaine을 얻기 위하여 ball을 최적으로 배열 선택하여야 한다. 이 논문에서는 분쇄기 직경과 분쇄도를 고려하여 피분쇄 물질의 입도에 따르는 최적의 ball size 계산법이 전개되었다. 나아가 분쇄물의 Blaine으로부터 입도 계산에 대한 단순한 관계가 명시되었다. Blaine은 분쇄기의 길이를 직선적으로 증가시키기 때문에 chamber의 길이와 수 그리고 필요한 구의 직경이 graph의 방법으로 쉽게 규정된다. 보다 큰 구의 사용으로 손해는 분쇄기의 원료(피분쇄물)를 사전에 파쇄시킴으로써 제거될 수 있다. 그 발전 경향은 보다 작은 분쇄 매체(grinding media)의 사용에로 진전되었으며 그 이유는 다음과 같다. (1) 증대된 분쇄기 직경 (2) 피분쇄물의 사전 파쇄 (3) 분쇄 법칙에 대한 지식 향상

• 한국재료학회지
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• 제17권10호
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• pp.532-537
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• 2007

A series of wet grinding experiments have been carried out using a stirred ball mill to systematically investigate consideration of grinding characteristics. The particle size distribution and median diameter of the grinding consumption power for a given grinding time were considered. Also, the effect of grinding aids on particle size and grinding consumption energy defined as the summation of grinding power was investigated. The grinding aids had influence on the smaller products size and decrease grinding consumption energy because the function of grinding aids were to be attribute to the prevention of agglomeration and ball and grinding chamber wall coating of sample powder. The grinding process seemed to be controlled by the force of agglomeration of the ground products. It was demonstrated that the particle size and grinding consumption energy could be more decreased by the addition of grinding aids.

• 마이크로전자및패키징학회지
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• 제27권3호
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• pp.35-39
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• 2020

Nonwet (Head in Pillow) 불량은 SMT(surface mount technology) 공정 불량 유형 중 하나로 이 불량은 solder paste misalign, reflow 조건, package warpage, package ball size 등과 같은 인자에 따라 불량이 발생을 한다. 이에 본 논문은 Nonwet 발생 인자 중 ① reflow 조건 ② package ball & solder paste misalign ③ package ball 크기 type에 대한 인자를 선정하여 nonwet 실험을 진행하였다. 먼저 reflow 조건의 경우 soldering 시간이 길 경우 nonwet risk가 증가를 하나, reflow 공정에 N₂를 적용할 시 solder ball 산화 억제에 따른 nonwet 개선을 확인 할 수 있었다. 또한 package ball과 solder paste misalign 발생 시 ball과 paste의 접촉 깊이가 20 ㎛ 이하의 경우 nonwet에 취약 했으며, package ball 체면적이 작을수록 nonwet 관점 개선됨을 확인 할 수 있었다.

• 한국세라믹학회지
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• 제35권1호
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• pp.66-78
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• 1998

the microstructure and mechanical properties of seeded and ball-milled dry gels prepared by boehmite sol-gel method were discussed. The densification of seeded gels was improved with increasing seed content namely the number of seed The number of seed was 1.09, 3.35, 5.72${\times}$1012/cm3 boehmite when seeded with 1, 3, 5wt% respectively The ball milled gel contained about 0.5wt% seed and the number of seed was 4.72${\times}$1012/cm3 boehmite. The sintered density of 5wt% seeded gel was below 80% when sintered at 1300$^{\circ}C$ for 1h. On the other hand that of ball milled gel was very improved and reached to 97% In the case of 3wt% seeded gels the density over 97% was attained when sintered at 1500$^{\circ}C$for 1h. and the grain of the sintered body was several micrometers in size. However the sintered body of ball milled gel showed grain size of submicrometer when sintered at 1300$^{\circ}C$ for 1h. And this specimen showed highest harness value of 1900kg/mm2 The fracture toughness increased with increasing sintering temperature. The sintered body of ball milled gel showed the largest grain size and the highest fracture toughness without regard to sint-ering temperature.

• 한국생산제조학회지
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• 제20권5호
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• pp.559-563
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• 2011

Drop impact reliability assessment of solder joints on the flip chip is one of the critical issues for micro system packaging. Our previous researches have been showing that new solder ball compositions of Sn-3.0Ag-0.5Cu has better mechanical reliability than Sn-1.0Ag-0.5Cu. In this paper, dynamic reliability analysis using Finite Element Analysis (FEA) is carried out to assess the factors affecting flip chip in drop simulation. The design parameters are size and thickness of chip, and size, pitch and array of solder ball with composition of Sn1.0Ag0.5Cu. The board systems by JEDEC standard including 15 chips, solder balls and PCB are modeled with various design parameter combinations, and through these simulations, maximum yield stress and strain at each chip are shown at the solder balls. It is found that larger chip size, smaller chip array, smaller ball diameter, larger pitch, and larger chip thickness have bad effect on maximum yield stress and strain at solder ball of each chip.

• 한국세라믹학회지
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• 제35권4호
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• pp.406-412
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• 1998

The reaction bonded alumina ceramics was prepared through the addition of each SiC and ZrO2 powder to the mixture of Al metal powder and Al2O3 The mono sized (3mm) and biodal sized (3mm+5mm) balls were used in attrition milling of Al and starting powders. The milling efficiency of both cases was compared by the analysis of particle size and X-ray diffraction. After the forming and sintering of each powder batchs the weight gains dimensional changes and densities were determined. The specimens were investigated by X-ray diffraction analysis and scanning electron microscope. Bimodal sized balls had better milling effect than single ball size in the milling of Al powder. However in the milling which ceramic powders mono sized the green body during the reaction sintering at 1$600^{\circ}C$ for 5 hour was about 10% The densities attained the values of 92-98% theoretical. The SiC added specimen that was milled with 3mm ball media had 96% theoretical density and dense microstructure.

• 한국세라믹학회지
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• 제24권1호
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• pp.1-8
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• 1987

The validity of Alyavdin-Chujyo's Equation was re-examined over the broader milling conditions that those previously examined. Ordinary ball mill grinding with a laboratory scale batch mill (133mmø×144mm length) were selected as the grinding methods. The results show that in ball milling the Alyavdin-Chunjyo's Equation can be applicable over wide grinding time and size range with few exceptions. The validity of which are examined and discussed. The theoretical consideration of the relation between Alyavdin-Chujyo's Equation and size distributiion equation, such as Rosin-Rammler's law, was tried, and it is found that, under the condition of alyardin-Chujyo's relation, the Rosin-Rammler size distribution law can hold.

• 공업화학
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• 제21권3호
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• pp.311-316
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• 2010

본 연구는 높은 분산 안정성을 유지하는 antimony-doped tin oxide (ATO) 분산액을 제조하기 위하여, 습식 볼밀법으로 분쇄시간에 따른 ATO의 입자크기, 입도분포, 분산성의 변화를 고찰하였다. 또한 각각의 습식 볼밀 처리된 ATO 분산액의 pH를 변화시켜 ATO 분산액의 분산 특성을 고찰하였다. 습식 볼밀 분쇄 조건에 의하여 ATO의 입자크기 및 입도 분포 변화는 레이저회절 입도분석기와 주사전자현미경을 이용하여 평가하였고, 습식 볼밀 분쇄 시간 및 pH조건에 따른 ATO 입자의 분산성은 제타전위 측정법과 다중광산란(multiple light scattering)법을 이용하여 평가하였다. 분쇄 조건 중 60 min 동안 처리된 ATO 입자 크기는 30% 이하로 작아지고, $1{\sim}35{\mu}m$에서 $0.1{\sim}5{\mu}m$로 입도분포를 갖는 균일한 입자를 얻을 수 있었다. 그러나 분쇄조건을 60 min 이상 처리한 것은 역분쇄 및 재응집 현상의 발생으로 인하여 한계 분쇄 시간이 나타나는 것을 알 수 있었다. 이러한 결과로부터 ATO 분산액은 습식 볼밀 분쇄 시간을 증가시킬수록 입자 크기가 감소하고 표면 에너지가 증가하여 입자간의 반발력이 커지게 됨을 알 수 있었고, 또한 용액의 pH를 증가시킬수록 입자의 표면 이온화도가 커짐으로 인하여 ATO 분산액의 분산성이 향상되는 것을 알 수 있었다.

• 한국의류산업학회지
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• 제17권5호
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• pp.815-827
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• 2015

This study analyzes the characteristics by age and type for middle aged and elderly women foot shapes aged 40-69 years. ANOVA, factor, and cluster analyzed middle aged and elderly women's foot shapes. The results of the study are as follows. First, higher age groups tended to have smaller foot lengths, ball/instep circumferences, circumferences, and ball heights with larger heel height values and higher degrees of gathering of toe 1 and toe 5 toward the feet reference axis. Second, foot lengths were 220 mm-240 mm and the ball circumference's size symbol in high frequency sections were distributed from E to EEEE in the 40s and 60s groups and from D to EEEE in the 50s group. Third, eight factors were extracted through the factor analyses of middle aged and elderly women's foot measurement items. Fourth, a cluster analyses classified the subjects into four types. Type 1 is a normal foot type with medium foot length and small ball circumference and type 2 is a long and flat foot type with a type with large foot length and ball circumference values as well as small ball height values. Type 3 is a thick foot type with a medium foot length, large ball circumference, large ball height and type 4 is a toe deformation foot type with medium foot length, small ball circumference, and a high degree of toe gathering toward the center.