• Restorative Dentistry and Endodontics
• /
• v.24 no.1
• /
• pp.26-39
• /
• 1999

Bis-GMA, the representative monomer of bonding resin, contributes to the rigidity of bonding layer. Hydrophilic monomer contributes to the permeability into dentin substrates while weaken the bonding layer due to its small molecular weight. The degree of conversion also contributes to the ultimate strength of the bonding layer. This study was performed for the correlation analysis of monomer ratio and dentin bonding strength via degree of conversion. 7 experimental bonding resins were prepared with Bis-GMA, ratio from 20% to 80% by 10% increment, and hydrophilic HEMA monomer. Their degree of conversion and shear bond strength to dentin were compared with Scotchbond Multi-Purpose adhesive, and the fractured surfaces were examined microscopically. The results were as follows; 1. The degree of conversion increased when, the ratio of Bis-GMA increased from 20% to 70%, whereas it decreased when the ratio of Bis-GMA was 80%. 2. Shear bond strengths of the experimental bonding resins of 80%, 70%, 60% ratio of Bis-GMA were significantly higher than those of the experimental bonding resin of 50% ratio of Bis-GMA and Scotchbond Multi-Purpose adhesive. Lower shear bond strengths were obtained with the experimental bonding resins of 40%, 30%, 20% ratio of Bis-GMA (p<0.05). 3. Adhesive fractures were associated with the bonding resins of the lower bond strength, while cohesive fractures within the bonding resin layer were associated with the bonding resins of higher bond strength. Bonding resins with shear bond strength higher than 18MPa showed some cohesive fractures within the composite resin or within the dentin. 4. Correlations between Bis-GMA ratio and the degree of conversion (r=0.826), between Bis-GMA ratio and shear bond strength (r=0.853), and between the degree of conversion and shear bond strength (r=0.786) were significant (p<0.05).

• Korean Journal of Materials Research
• /
• v.5 no.2
• /
• pp.191-196
• /
• 1995

Self-bonding strength developed at the interface of amorphous PEEK films is highly sensitive to the processing variables(time, temperature, and pressure) during the bonding process. In order to examine the effects of these processing variables, amorphous PEEK films were bonded at various bonding conditions and the resultant interfacial bond strengths were measured using a modified single lap-shear test. Experimental results showed that the developed self-bonding strength increases with increase in bonding temperature and is directly proportional to the bonding time raised to the 1/4 power. The applied pressure seems only to produce better wetting at the beginning stage of the bonding process. Conclusively, the self-bonding of amorphous PEEK films provides a great potential for developing excellent bond strength approaching the strength of the parent material without any adhesives in structural applications.

• Journal of Welding and Joining
• /
• v.10 no.3
• /
• pp.63-72
• /
• 1992

The joining methods of ceramics to metals which can be expected to obtain high temperature strength are mainly classified into the solid-state diffusion bonding method and the active brazing method. Between these two, the solid-state diffusion bonding method is given attentions as substituting method for active brazing method due to being capable of obtaining higher bonding strength at high temperature and accurate bonding. In this paper, the solid-state diffusion bonding of $Al_{2}$O$_{3}$ ceramics to Ni-Cr-Mo alloy steel (SNCM21) using insert metal was carried out. The insert metal employed in this study was experimentally home-made, Ag-Cu-Ti alloy. Influence of several bonding parameters of $Al_{2}$O$_{3}$SNCM21 joint was quantitatively evaluated by bonding strength test, and microstructural analyses at the interlayer were performed by SEM/EDX. From above experiments, the optimum bonding condition of the solid-state diffusion bonding of $Al_{2}$O$_{3}$/SNCM21 using Ag-Cu-Ti insert metal was determined. Futhermore, high temperature strength and thermal-shock properties of $Al_{2}$O$_{3}$/SNCM21 joint were also examined. The results obtained are as follows. 1. The maximum bonding strength was obtained at the temperature of 95% melting point of insert metal. 2. The high temperature strength of $Al_{2}$O$_{3}$/SNCM21 joint appeared to bemaximum value at test temperature 500.deg.C and the bonding strength with increasingtemperature showed parabolic curve. 3. The strength of thermal-shocked specimens was far deteriorated than those of as-bonded specimens. Especially, water-quenched specimen after heated up to 600.deg. C was directly fractured in quenching.

• Journal of the Microelectronics and Packaging Society
• /
• v.20 no.2
• /
• pp.11-15
• /
• 2013

The wafer bonding process becomes a flexible approach to material and device integration. The bonding strength in 3-dimensional process is crucial factor in various interface bonding process such as silicon to silicon, silicon to metals such as oxides to adhesive intermediates. A measurement method of bonding strength was proposed by utilizing AFM applied CNT probe tip which indicated the relative simplicity in preparation of sample and to have merit capable to measure regardless type of films. Also, New Tool was utilized to measure of tip radius. The cleaned $SiO_2$-Si bonding strength of SPFM indicated 0.089 $J/m^2$, and the cleaning result by RCA 1($NH_4OH:H_2O:H_2O_2$) measured 0.044 $J/m^2$, indicated negligible tolerance which verified the possibility capable to measure accurate bonding strength. And it could be confirmed the effective bonding is possible through SPFM cleaning.

• Journal of the Microelectronics and Packaging Society
• /
• v.31 no.3
• /
• pp.91-98
• /
• 2024

This study reveals the feasibility and effectiveness of sinter bonding using an Ag nano-porous sheet at the lowest "theoretically" possible temperature of 145 ℃. By uniform pressure of 10 MPa for bonding times of 5 min and 10 min at 145 and 175 ℃, we achieved bonding strengths exceeding approximately 20 MPa with a only 5 min of bonding time at 145 ℃. In particular, it is interesting to note that in the pressure sintering bonding process at 145 ℃, bonding times of 5 and 10 min had no significant difference in strength. Even with a bonding temperature of 175 ℃, the difference in average bonding strength between bonding times of 5 min (i.e., 37.6 MPa) and 10 min (i.e., 43.0 MPa) was only 5 MPa. The bonding strength was fundamentally attributed to the thickness of the Ag sintered neck in the Ag sintered layer. Microstructural analysis revealed that as the bonding temperature increased to 175 ℃, the fraction of CSL Σ3 boundaries within the Ag sintered layer increased, indicating greater coalescence of Ag particles. This study systematically investigated the mechanism of bonding strength in extremely low-temperature pressure Ag sinter bonding, considering the relationship between microstructures and mechanical behaviors.

• Journal of the Korean Ceramic Society
• /
• v.45 no.10
• /
• pp.600-604
• /
• 2008

Although titanium-ceramic systems have gained substantial interests in dental prosthetic field, bonding problem between porcelain and titanium has not been solved. Main obstacle in titanium-porcelain bonding is excessive oxidation of titanium during porcelain firing. The effects of several coating materials on the bonding strength of titanium-porcelain system were investigated in this study. RF sputtering and electroplating of platinum significantly increased the bonding strength of porcelain-titanium specimen. However, coatings of Ni-Au, Ir, and ceramics(zirconia and hydroxyapatite) did not showed a significant effect on bonding strength. Platinum might be a promising material for the protective layer of excessive oxidation of titanium during porcelain firing, resulting in increase in the bonding strength.

• Proceedings of the Korea Concrete Institute Conference
• /
• 2001.05a
• /
• pp.353-358
• /
• 2001

The cement concrete pavements are designed twenty years of performance life in Korea. At the present time, some expressways have been elapsed seventy percent of performance life which are detecting local failures. The most repair methods using to repair failures are partial depth repair and full section repair. These methods are most important bonding strength between rapid curing materials and substrate concrete pavements. This study was performed to evaluate bonding strength of the composites section made of rapid curing material and substrate concrete pavements. The pull-out tester was used to test bonding strength for the composites section made of each materials. In the results of the test, the bonding strength values of the epoxy mortar and acrylic mortar are higher than those of the other materials. The performance life of repaired section is affected by various factor. The bonding strength of bonded composites section may be affect the performance life, significantly.

• Journal of the Korean institute of surface engineering
• /
• v.49 no.6
• /
• pp.549-554
• /
• 2016

Low melting metals are difficult to weld because it is vaporized. But epoxy resin make bonding possible using low melting material and dismissal materials. This study is to improve the bonding strength of epoxy and substrate by mechanical and electrochemical methods. In case of mechanical work, bonding strength is 17.6MPa and in case of pre-work, bonding strength is 15.3MPa. When anodizing and mechanical work is applied, bonding strength is 25.3Mpa is increased 165%. When anodizing is applied, bonding strength is 27.6Mpa.

• The korean journal of orthodontics
• /
• v.3 no.1
• /
• pp.21-28
• /
• 1972

저자는 direct bonding system의 pretreatment액 처리후 Epoxy adhesive의 bonding strength의 변화를 측정하기 위해서 발거된 상악 전치 진면 법랑질 표면에 pretreatment액으로서 $65\%$ phosphoric acid를 도포한 실험군과 도포하지 않은 비교군을 비교연구하고 임상에 적용하여 다음과 같은 결과를 얻었다. 1. 법랑질 표면에 pumicing과 $65\%$ phosphoric acid를 도포했을때 joint strength는 현저히 상승했다. 2. Epoxy adhesive의 bonding strength는 plastic attachment를 치아면에 접착유지시키기에 충분하며 임상적으로 이용할 수 있다. 3. Joint area가 클 수록 bonding strength는 증가했다.

• Journal of the Korean Graphic Arts Communication Society
• /
• v.30 no.3
• /
• pp.35-43
• /
• 2012

Internal bonding strength of printing paper was increased with sea-algae pulp treatment. Spacially, 9% contents sea-algae pulp treatment in the hardwood pulp are more effective than in the softwood pulp. Most effective mixture ratio of the raw matrials for improvement of the internal bonding strength are softwood pulp 30%, hardwood pulp 70%, sea-algae pulp 9%. Internal bonding strength is effective in more sea-algae pulp contents and softwood pulp contents and wetness.