• Korean Journal of Metals and Materials
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• v.56 no.12
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• pp.915-920
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• 2018

With the development of modern microelectronics technologies, the power density of electronic devices is rapidly increasing, due to the miniaturization or integration of device elements which operate at high frequency, high power conditions. Resulting thermal problems are known to cause power leakage, device failure and deteriorated performance. To relieve heat accumulation at the interface between chips and heat sinks, thermal interface materials (TIMs) must provide efficient heat transport in the through-plane direction. We report on the enhanced thermal conduction of $Al_2O_3-based$ polymer composites, fabricated by the surface wetting and texturing of thermally conductive hexagonal boron nitride(h-BN) nanoplatelets with large anisotropy in morphology and physical properties. The thermally conductive polymer composites were prepared with hybrid fillers of $Al_2O_3$ macro beads and surface modified h-BN nanoplatelets. Hexagonal boron nitride (h-BN) has high thermal conductivity and is one of the most suitable materials for thermally conductive polymer composites, which protect electronic devices by efficient heat dissipation. In this study, we synthesized hexagonal boron nitride nanoparticles by the pyrolysis of cost effective precursors, boric acid and melamine. Through pyrolysis at $900^{\circ}C$ and subsequent annealing at $1500^{\circ}C$, hexagonal boron nitride nanoparticles with diameters of ca. 50nm were synthesized. We demonstrate that the addition of a small amount of calcium fluoride ($CaF_2$) during the preparation of the melamine borate adduct significantly enhanced the crystallinity of the h-BN and assisted the growth of nanoplatelets up to 100nm in diameters. The addition of a small amount of h-BN enhanced the thermal conductivity of the $Al_2O_3-based$ polymer composites, from 1.45W/mK to 2.33 W/mK.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.6
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• pp.633-637
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• 2023

Recently, with the development of the smart device market, the integration of high-functional devices has increased the heat density, causing overload of the device, and resulting in various problems such as shortened lifespan, performance degradation, and failure. Therefore, research on heat dissipation materials is being actively conducted to realize next-generation electronic products. The heat dissipation material is characterized in that it is easy to dissipate heat due to its high thermal conductivity and minimizes leakage current flowing through the heat dissipation material due to its low electrical conductivity. In this study, flower-shaped Al₂O₃ and BN composites were engineered with a simple hydrothermal synthesis approach, and their thermal conductivity characteristics were compared and evaluated for each synthesis condition for the application to a heat dissipation material. Spherical BN and flower-shaped Al₂O₃ were easily obtained, and SEM/EDS analyses confirmed the uniform presence of BN between the Al₂O₃, and it can be expected that these shapes can affect the thermal conductivity.

• BMB Reports
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• v.39 no.3
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• pp.297-303
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• 2006

As lipolytic enzymes, GDSL lipases play an important role in plant growth and development. In order to identify their functions and roles, the full-length cDNA of a GDSL lipase gene, designated BnLIP2, was isolated from Brassica napus L. BnLIP2 was 1,300 bp long, with 1,122 bp open reading frame (ORF) encoding 373 amino acid residues. Sequence analysis indicated that BnLIP2 belonged to GDSL family. Southern blot analysis indicated that BnLIP2 belonged to a small gene family in rapeseed genome. RT-PCR analysis revealed that BnLIP2 was a tissue-specific expressing gene during reproductive growth and strongly expressed during seed germination. BnLIP2 expression could not be detected until three days after germination, and it subsequently became stronger. The transcript of this gene was deficient in root of seedlings growing at different stages. When juvenile seedlings were treated by methyl jasmonate (MeJ), salicylic acid (SA) and naphthalene acetic acid (NAA), BnLIP2 expression could not be induced in root. Our study implicates that BnLIP2 probably plays an important role in rapeseed germination, morphogenesis, flowering, but independent of root growth and development.

• Journal of Plant Biotechnology
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• v.43 no.1
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• pp.58-65
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• 2016

Powdery mildew is an important disease of the melon (Cucumis melo L.). Seven isolates of powdery mildew fungi were collected from five locations in Korea; Anseong (DH487), Icheon (BN103, BN625, BN968), Yeongam (YA141), Changnyeong (CN582), and Suncheon (SN102). All 7 fungi had a similar trend of conidial chain and conidiophore development as Podosphaera xanthii with fibrosin bodies in mature conidia. Among them, 2 isolates of powdery mildew fungi; CN582 and SN102 showed similar responses to resistance against powdery mildew as the previously reported race 1 and race N2. The isolates YA141 and BN103 showed similar responses as like as race A. However, three isolates of powdery mildew fungi (BN625, BN968, and DH487) showed different responses compared to the previously reported races (1, N1, N2, A, S, and 5). Therefore, these three isolates could be designated as new races in melon. Nine out of 15 commercial melon cultivars in Korea showed resistance to race 1 (CN582). However, the new race BN968 invaded all 15 cultivars. Results of the two molecular markers were consistent in response to disease development by race 1 of Podosphaera xanthii in case of the above mentioned cultivars. This study confirmed the presence of new melon powdery mildew fungi in Korea which are similarly notorious as like as the previously reported race 1. Therefore, breeders can use these two molecular markers for breeding melon in Korea that is resistant to race 1 and as well as to some other races.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.33-37
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• 2019

In this study, the graded thermal properties of composites are obtained by difference in specific gravity of fillers including Cu, h-BN and GO powders in epoxy. Relatively heavy powders such as Cu and h-BN compared to GO mostly at the bottom layer, while light GO powders were dispersed in the top layer in the composites. The thermal conductivity of composites was gradually increased from 0.55 (0.52) W/mK to 2.82 (1.37) W/mK for GO/h-BN (GO/Cu) epoxy composites from surface to bottom. On the contrary, the coefficient of thermal expansion was decreased from 51 ppm/℃ to 23 ppm/℃ and from 57 ppm/℃ to 32 ppm/℃ for GO/Cu and GO/h-BN, respectively. The variation of thermal properties in composites is attributed due to intrinsic material properties of filler including thermal conductivity, morphology and the distribution by the specific weight of fillers. This simple strategy for realizing graded thermal composites by introducing different filler materials would be effective heat transfer at interface of heterostructure with large thermal properties such as inorganic semiconductor/plastic, metal/plastic, and semiconductor/metal.

• Food Science and Preservation
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• v.30 no.3
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• pp.459-471
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• 2023

The Bayesian network (BN) model was applied to analyze the characteristic variables that affect compliance with safety inspections of farmed eel during the production stage, using the data from 30,063 cases of eel aquafarm safety inspection in the Integrated Food Safety Information Network (IFSIN) from 2012 to 2021. The dataset for establishing the BN model included 77 non-conforming cases. Relevant HACCP data, geographic information about the aquafarms, and environmental data were collected and mapped to the IFSIN data to derive explanatory variables for nonconformity. Aquafarm HACCP certification, detection history of harmful substances during the last 5 y, history of nonconformity during the last 5 y, and the suitability of the aquatic environment as determined by the levels of total coliform bacteria and total organic carbon were selected as the explanatory variables. The highest achievable eel aquafarm noncompliance rate by manipulating the derived explanatory variables was 24.5%, which was 94 times higher than the overall farmed eel noncompliance rate reported in IFSIN between 2017 and 2021. The established BN model was validated using the IFSIN eel aquafarm inspection results conducted between January and August 2022. The noncompliance rate in the validation set was 0.22% (15 nonconformances out of 6,785 cases). The precision of BN model prediction was 0.1579, which was 71.4 times higher than the non-compliance rate of the validation set.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2006.04a
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• pp.87-88
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• 2006

• Proceedings of the Korean Ceranic Society Conference
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• 2003.04a
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• pp.195.1-195
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• 2003

• Proceedings of the Korean Magnestics Society Conference
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• 2003.06a
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• pp.178-179
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• 2003

• Proceedings of the Materials Research Society of Korea Conference
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• 2005.05a
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• pp.35-35
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• 2005