• 한국정밀공학회지
• /
• 제27권12호
• /
• pp.99-106
• /
• 2010

Gas turbines operation for power generation increased rapidly since 1990 due to the high efficiency in combined cycle, relatively low construction cost and low emission. But the operation and maintenance cost for gas turbine is high because the expensive superalloy hot gas path parts should be repaired and replaced periodically This study analyzed the initiation and propagation of the crack at the gas turbine blades which are coated with MCrAIY as a bond coat and TBC as a top coat. The sample blades had been serviced at the actual gas turbines for power generation. Total 7 sets of blades were analyzed and they have different EOH(equivalent operation hour). Blades were sectioned and the cracking distribution were measured and analyzed utilizing SEM(scanning electron microscope) and optical microscope. The blades which had 52,000 EOH of operation had cracks at the substrate and the maximum depth was 0.2 mm. Most of the cracks initiated at the boundary layer between TBC and bond coat and propagated down to the bond coat. Once bond coat is cracked, the base metal is exposed to the oxidation condition and undergoes notch effect. Under this environment, the crack branched at the inter-diffusion layer and propagated to the substrate. Critical cracks affecting the blade life were analyzed as those on suction side and platform.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
• /
• pp.145-145
• /
• 2012

반도체 집적회로의 집적도가 증가함에 따라 RC delay가 증가하며, 금속 배선의 spiking, electromigration 등의 문제로 인해 기존의 알루미늄 금속을 대체하기 위하여 구리를 배선재료로 사용하게 되었다. 하지만 구리는 실리콘 및 산화물 내에서 매우 빠른 확산도를 가지고 있으므로, 구리의 확산을 막아 줄 확산방지막이 필요로 하다. 이러한 확산방지막의 증착은, 소자의 크기가 작아짐에 따라 via/contact과 같은 고단차 구조에도 적용이 가능하도록 기존의 sputtering 증착 방법에서 이를 개선한 collimated sputter, long-throw sputter, ion-metal plasma 등의 방법으로 물리적인 증착법이 지속되어 왔지만, 근본적인 증착방법을 바꾸지 않는 한 한계에 도달하게 될 것이다. 원자층 증착법(ALD)은 CVD 증착법의 하나로, 소스와 반응물질을 주입하는 시간을 분리함으로써 증착하고자 하는 표면에서의 반응을 유도하여 원자층 단위로 원하는 박막을 얻을 수 있는 증착방법이다. 이를 이용하여 물리적 증기 증착법(PVD)보다 우수한 단차피복성과 함께 정교하게 증착두께를 컨트롤을 할 수 있다. 본 연구에서는 이러한 원자층 증착법을 이용하여 구리 배선을 위한 확산방지막으로 텅스텐질화막을 형성하였다. 텅스텐 질화막을 형성하기 위하여 금속-유기물 전구체와 함께 할라이드 계열인 WF6를 텅스텐 소스로 이용하였으며, 이에 대한 원자층 증착방법으로 이루어진 박막의 물성을 비교 평가하여 분석하였다.

• Corrosion Science and Technology
• /
• 제7권3호
• /
• pp.168-172
• /
• 2008

A new type of electrochemical random signal (electrochemical noise) analysis technique was applied to localized corrosion of anodic oxide film formed 1100 aluminum alloy in $0.5kmol/m^3$ $H_3BO_4/0.05kmol/m^3$ $Na_2B_4O_7$ with $0.01kmol/m^3$ NaCl. The effect of anodic oxide film structure, barrier type, porous type, and composite type on galvanic corrosion resistance was also examined. Before localized corrosion started, incubation period for pitting corrosion, both current and potential slightly change as initial value with time. The incubation period of porous type anodic oxide specimens are longer than that of barrier type anodic oxide specimens. While pitting corrosion, the current and potential were changed with fluctuations and the potential and the current fluctuations show a good correlation. The records of the current and potential were processed by calculating the power spectrum density (PSD) by the Fast Fourier Transform (FFT) method. The potential and current PSD decrease with increasing frequency, and the slopes are steeper than or equal to minus one (-1). This technique allows observation of electrochemical impedance changes during localized corrosion.

• 한국재료학회지
• /
• 제11권9호
• /
• pp.802-809
• /
• 2001

Electroplating is an attractive alternative deposition method for copper with the need for a conformal and conductive seed layer In addition, the Cu seed layer should be highly pure so as not to compromise the effective resistivity of the filled copper interconnect structure. This seed layer requires low electrical resistivity, low levels of impurities, smooth interface, good adhesion to the barrier metal and low thickness concurrent with coherence for ensuring void-free fill. The electrical conductivity of the surface plays an important role in formation of initial Cu nuclei, Cu nucleation is much easier on the substrate with higher electrical conductivities. It is also known that the nucleation processes of Cu are very sensitive to surface condition. In this study, copper seed layers deposited by magnetron sputtering onto a tantalum nitride barrier layer were used for electroplating copper in the forward pulsed mode. Prior to electroplating a copper film, the Cu seed layer was cleaned by plasma H$_2$ and $N_2$. In the plasma treatment exposure tome was varied from 1 to 20 min and plasma power from 20 to 140W. Effects of plasma pretreatment to Cu seed/Tantalum nitride (TaN)/borophosphosilicate glass (BPSG) samples on electroplating of copper (Cu) films were investigated.

• JSTS:Journal of Semiconductor Technology and Science
• /
• 제5권3호
• /
• pp.173-181
• /
• 2005

A new two dimensional (2-D) model for the potential distribution of fully depleted short-channel ion-implanted silicon MESFET's has been presented in this paper. The solution of the 2-D Poisson's equation has been considered as the superposition of the solutions of 1-D Poisson's equation in the lateral direction and the 2-D homogeneous Laplace equation with suitable boundary conditions. The minimum bottom potential at the interface of the depletion region due to the metal-semiconductor junction at the Schottky gate and depletion region due to the substrate-channel junction has been used to investigate the drain-induced barrier lowering (DIBL) and its effects on the threshold voltage of the device. Numerical results have been presented for the potential distribution and threshold voltage for different parameters such as the channel length, drain-source voltage, and implanted-dose and silicon film thickness.

• Corrosion Science and Technology
• /
• 제15권6호
• /
• pp.314-319
• /
• 2016

Reduced activation ferritic-martensitic steels (RAFM) are envisaged in future fusion technology as structural material which will be in direct contact with a flowing liquid lead-lithium melt, serving as breeder material. Aluminium-based coatings had proven their ability to protect the structural material from corrosion attack in flowing Pb-15.7Li and to reduce tritium permeation into the coolant, significantly. Coming from scales produced by hot dipping aluminization (HDA), the development of electrochemical-based processes to produce well-defined aluminium-based coatings on RAFM steels gained increased attention in research during the last years. Two different electrochemical processes are described in this paper: The first one, referred to as ECA, is based on the electrodeposition of aluminium from volatile, metal-organic electrolytes. The other process called ECX is based on ionic liquids. All three processes exhibit specific characteristics, for example in the field of processability, control of coating thicknesses (low activation criteria) and heat treatment behavior. The aim of this article is to compare these different coating processes critically, whereby the focus is on the comparison of ECA and ECX processes. New results for ECX will be presented and occurring development needs for the future will be discussed.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
• /
• pp.120-122
• /
• 2005

An alumina membrane with nano-sized pore array by anodic oxidation using thin film aluminum deposited on silicon wafer was fabricated. It is important that the sample prepared by metal deposition method has a flat aluminum surface and a good adhesion between the silicon wafer and the thin film aluminum. The oxidation time was controlled by observation of current variation. While the oxalic acid with 0.2M was used for low voltage anodization under 100V, the chromic acid with 0.1M was used for high voltage anodization over 100V. The nano-sized pores with diameter of 60~120nm was obtained by low voltage anodization of 40~90V and those of 200~300nm was obtained by high voltage anodization of 120~160V. Finally, the sample was immersed to the phosphoric acid with 0.1M concentration to etching the barrier layer. The sample will be applied to electronic sensors, field emission display, and template for nano-structure.

• JSTS:Journal of Semiconductor Technology and Science
• /
• 제14권5호
• /
• pp.572-578
• /
• 2014

In order to overcome small current drivability of a tunneling field-effect transistor (TFET), a TFET using Schottky barrier (SBTFET) is proposed. The proposed device has a metal source region unlike the conventional TFET. In addition, dopant segregation technology between the source and channel region is applied to reduce tunneling resistance. For TFET fabrication, spacer technique is adopted to enable self-aligned process because the SBTFET consists of source and drain with different types. Also the control device which has a doped source region is made to compare the electrical characteristics with those of the SBTFET. From the measured results, the SBTFET shows better on/off switching property than the control device. The observed drive current is larger than those of the previously reported TFET. Also, short-channel effects (SCEs) are investigated through the comparison of electrical characteristics between the long- and short-channel SBTFET.

• 센서학회지
• /
• 제20권3호
• /
• pp.156-161
• /
• 2011

We fabricated a schottky barrier metal oxide semiconductor field effect transistor(SB-MOSFET) by applying indium-tin-oxide(ITO) to the source/drain on a highly resistive GaN layer grown on a silicon substrate. The MOSFET, with 10 ${\mu}M$ gate length and 100 ${\mu}M$ gate width, exhibits a threshold gate voltage of 2.7 V, and has a sub-threshold slope of 240 mV/dec taken from the $I_{DS}-V_{GS}$ characteristics at a low drain voltage of 0.05 V. The maximum drain current is 18 mA/mm and the maximum transconductance is 6 mS/mm at $V_{DS}$=3 V. We observed that the spectral photo-response characterization exhibits that the cutoff wavelength was 365 nm, and the UV/visible rejection ratio was about 130 at $V_{DS}$ = 5 V. The MOSFET-type UV detector using ITO, has a high UV photo-responsivity and so is highly applicable to the UV image sensors.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2010년도 제39회 하계학술대회 초록집
• /
• pp.246-246
• /
• 2010

As the trench width in the interconnect technology decreases down to nano-scale below 50 nm, superconformal gap-filling process of Cu becomes very critical for Cu interconnect. Obtaining superconfomral gap-filling of Cu in the nano-scale trench or via hole using MOCVD is essential to control nucleation and growth of Cu. Therefore, nucleation of Cu must be suppressed near the entrance surface of the trench while Cu layer nucleates and grows at the bottom of the trench. In this study, suppression of Cu nucleation was achieved by treating the Ru barrier metal surface with capacitively coupled hydrogen plasma. Effect of hydrogen plasma pretreatment on Cu nucleation was investigated during MOCVD on atomic-layer deposited (ALD)-Ru barrier surface. It was found that the nucleation and growth of Cu was affected by hydrogen plasma treatment condition. In particular, as the plasma pretreatment time and electrode power increased, Cu nucleation was inhibited. Experimental data suggests that hydrogen atoms from the plasma was implanted onto the Ru surface, which resulted in suppression of Cu nucleation owing to prevention of adsorption of Cu precursor molecules. Due to the hydrogen plasma treatment of the trench on Ru barrier surface, the suppression of Cu nucleation near the entrance of the trenches was achieved and then led to the superconformal gap filling of the nano-scale trenches. In the case for without hydrogen plasma treatments, however, over-grown Cu covered the whole entrance of nano-scale trenches. Detailed mechanism of nucleation suppression and resulting in nano-scale superconformal gap-filling of Cu will be discussed in detail.