• Title/Summary/Keyword: B-Pillar

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Stamping of Side Panel Using the Laser Welded Tailored Blank (레이저 용접 테일러드 블랭크를 이용한 사이드 패널 성형)

  • 권재욱;명노훈;백승엽;인정제;이경돈
    • Transactions of Materials Processing
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    • v.8 no.1
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    • pp.7-13
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    • 1999
  • In this study, side panels were developed using the laser-welded tailored blank (T.B.) of both the same thickness and different thickness. At first, the formability of the same thickness T.B. was investigated to compare with one of the non-welded panel with respect to weldline movement and strain distribution in blank during the stamping process. Based on these results, we determined the weld line positions and the die step for T.B. forming of the blanks composed of different thickness combination. Then we made some stamping tryouts with selected types of blanks to investigate the formability of T.B. of the different thickness. During the tryouts, wrinkles were found in the a-pillar lower region which is under the deformation mode of the shrink flange. In the b-pillar region, fractures were also found. These defects have been reduced and corrected by controlling the blank design, the die faces and process parameters.

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Microwave Frequency Responses of Novel Chip-On-Chip Flip-Chip Bump Joint Structures (새로운 칩온칩 플립칩 범프 접합구조에 따른 초고주파 응답 특성)

  • Oh, Kwang-Sun;Lee, Sang-Kyung;Kim, Dong-Wook
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.24 no.12
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    • pp.1120-1127
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    • 2013
  • In this paper, novel chip-on-chip(CoC) flip-chip bump structures using chip-on-wafer(CoW) process technology are proposed, designed and fabricated, and their microwave frequency responses are analyzed. With conventional bumps of Cu pillar/SnAg and Cu pillar/Ni/SnAg and novel Polybenzoxazole(PBO)-passivated bumps of Cu pillar/SnAg, Cu pillar/Ni/SnAg and SnAg with the deposition option of $2^{nd}$ Polyimide(PI2) layer on the wafer, 10 kinds of CoC samples are designed and their frequency responses up to 20 GHz are investigated. The measurement results show that the bumps on the wafers with PI2 layers are better for the batch flip-chip process and have average insertion loss of 0.14 dB at 18 GHz. The developed bump structures for chips with fine-pitch pads show similar or slightly better insertion loss of 0.11~0.14 dB up to 18 GHz, compared with that of 0.13~0.17 dB of conventional bump structures in this study, and we find that they could be utilized in various microwave packages for high integration density.

A Study on Stamping of the Center Pillar (High-Strength Steel-780MPa) Using Finite Element Analysis (유한요소해석을 이용한 센터필러(고장력강-780MPa)의 스탬핑 공정 설계)

  • Bang, G.B.;Seong, H.S.;Kwak, H.S.;Kim, C.
    • Transactions of Materials Processing
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    • v.26 no.2
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    • pp.87-94
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    • 2017
  • Center pillar, which is installed in the center of flank of car body, supports roof and door and ensures the safety of driver by reducing the damage of car body caused by impact. Recently, high-strength steel is widely used to manufacture the center pillar due to high stiffness and fuel efficiency. In this study, material properties of the high-strength steel, whose tensile strength is more than 780MPa, were obtained to produce the center pillar. Stamping was performed by considering the design parameters (blank holder force, press stroke, blank size and pad pressure) used in the actual filed. The drawbeads were included in the stamping process to reduce the amounts of wrinkling and spring back. Using the commercial software, Autoform R5.2 and Minitab, effects of design parameters of the stamping process upon spring back were analyzed and applied to the design process. The restriking process meets the target of under 0.5mm in the amount of spring back.

A Continuous Particle-size Sorter Using Negative a Dielectrophoretic Virtual Pillar Array (음의 유전영동에 의한 가상 기둥 어레이를 이용한 연속적 입자 크기 분류기)

  • Chang, Sung-Hwan;Cho, Young-Ho
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.32 no.11
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    • pp.824-831
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    • 2008
  • We present a continuous size-dependent particle separator using a negative dielectrophoretic (DEP) virtual pillar array. Two major problems in the previous size-dependent particle separators include the particle clogging in the mechanical sieving structures and the fixed range of separable particle sizes. The present particle separator uses the virtual pillar array generated by negative DEP force instead of the mechanical pillar array, thus eliminating the clogging problems. It is also possible to adjust the size of separable particles since the size of virtual pillars is a function of a particle diameter and applied voltage. At an applied voltage of 500 kHz $10\;V_{rms}$ (root mean sqaure voltage) sinusidal wave and a flow rate of $0.40\;{\mu}l\;min^{-1}$, we separate $5.7\;{\mu}m$-, $8.0\;{\mu}m$-, $10.5\;{\mu}m$-, and $11.9\;{\mu}m$-diameter polystyrene (PS) beads with separation purity of 95%, 92%, 50%, and 63%, respectively. The $10.5\;{\mu}m$- and $11.9\;{\mu}m$-diameter PS beads have relatively low separation purity of 50% and 63%. However, at an applied voltage of $8\;V_{rms}$, we separate $11.9\;{\mu}m$-diameter PS beads with separation purity over 99%. Therefore, the present particle separator achieves clog-free size-dependent particle separation, which is capable of size tuning of separable particles.

Stamping of Side Panel Using the Tailored Blank (Tailored Blank를 이용한 Side Panel 성형)

  • 권재욱;명노훈;백승엽;인정제;이경돈;유순영;이영국
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 1998.06a
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    • pp.102-109
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    • 1998
  • In this study, the side panels were developed using the laser-welded Tailored Blanks (TB) with both the same thickness and the different thickness. At first, the formability of the same thickness T.B was investigated to be compared with one of the non welded panel with respect to weldline movements and strain distribution on blank during the stamping. Based on these results, we selected candidates of T.B with different thickness for stamping experiments. That is, we determined the weld line positions and the die step. Then we made some stamping tryouts with selected types of blank designs to investigate the formability of T.B with different thickness. During the tryouts, the wrinkles were found in the a-pillar lower region which is under the deformation mode of the shrink flange. In the b-pillar region, the fractures were found also, these defects have been reduced and corrected by controlling the blank design and the die faces and process pamameters.

Application of Springback Analysis in the Development of a Reinforce Center Pillar Stamping Die (고강도강 Reinforce Center Pillar의 스프링백 해석)

  • Kim, K.T.;Kim, S.H.;Yoo, K.H.;Lee, C.W.;Shim, H.B.
    • Transactions of Materials Processing
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    • v.23 no.5
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    • pp.297-302
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    • 2014
  • The current paper introduces work that was conducted during the development of a stamping die for a reinforce center pillar made from high strength steel. In the current study, the Bauschinger effect on the springback analysis was studied by comparing simulation results with real panels, which are currently in production. For a complicated part shape, quantitative measurements of the deformed shape are not easy in general to obtain. An adjustment procedure of the shape data for some chosen sections has been suggested to improve the accuracy of the quantitative measurements. The results show that the kinematic hardening model provides more accurate results.

A Study on the Alternative Environmental Assessment System in KOREA : Applying New Conceptual Model(APEMI IA MODEL) into Impact Assessment for Better Integrated Decision-Making (대안적 환경평가 시스템 연구: 통합적 의사결정을 위한 새로운 개념의 영향평가모형(APEMI IA MODEL)의 국내 적용방안 탐색)

  • Kim, Im Soon;Han, Sang Wook
    • Journal of Environmental Impact Assessment
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    • v.14 no.4
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    • pp.179-193
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    • 2005
  • As the world's attention turns to sustainability and the considerations of cumulative effects, the concept of Strategic Environmental Assessment(SEA) has become more significant and urgent and increasing number of countries and international organizations now undertake some forms of SEA. The term SEA, however, is variously defined and understood; generally it means a formal process of systematic analysis of the environmental effects on development policies, plans, programmes and other proposed strategic actions. This process extends the aims and principles of EIA upstream in the decision-making process, beyond the project level in which major alternatives are still open. There is a shift toward more integrative approaches and greater use of Environmental Impact Assessment (EIA) and Strategic Environmental Assessment (SEA) as sustainability tools in cooperation with Environmental Management System (EMS). Currently, Korea has EIA system and Prior Environmental Review System (PERS) which is different type of SEA as Environment Assessment (EA) system. APEMI IA MODEL integrated following three pillar(refer to attached figure.1) ; First pillar symbolized decision making cycle with planning process. Second pillar symbolized integrated assessment which tying SEA and EIA with specific impacts assessment(eg: social impact assessment, economic impact assessment, health impact assessment etc) in cooperation with EMS. Third pillar symbolized EA best practical procedure of International Association for Impact Assessment(IAIA). Considering the above, we applied new conceptual model(APEMI IA MODEL) into Impact Assessment for better integrated decision-making in KOREA as an alternative IA system(IS IA MODEL A and B refer to attached figure 4, 5).

Surface Flow Visualization of MIRA Notchback Reference Car (MIRA Notchback Reference Car 표면유동가시화)

  • Chun, Chung-Hwan;Kim, Yong-Hwan;Cho, Kwang-Ryun;Roh, Sang-Kil;Lee, Eung-Ho
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.24 no.10
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    • pp.1309-1316
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    • 2000
  • A surface flow visualization of a MIRA notchback reference car was conducted using a 1/4 -scale model in the POSTECH wind tunnel. The flow separation and reattachment phenomen a around A-pillar, C-pillar, backlight, and trunk were discussed with the help of the distributions of singular points such as nodes, saddles, and spiral foci. The locations of the singular points on the trunk and the backlight from experimental results are compared with those of CFD results using the turbulence modeling of RNG k -${\varepsilon}$ and RSM.

A Study on Mechanical Properties and Microstructure of Local-Hardening Heat-Treated Automotive Panel (국부 경화 열처리된 차체 부품의 기계적 성질과 미세조직에 관한 연구)

  • Lee, Jae Ho;Jeong, Woo Chang
    • Journal of the Korean Society for Heat Treatment
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    • v.23 no.6
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    • pp.301-308
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    • 2010
  • A steel with chemical composition, 0.22% C, 0.25% Si, 1.26% Mn, 0.22% Cr, 0.04% Ti, 0.0042% B, and a microstructure of ferrite and spheroidized cementite has been press-formed to automotive center pillar followed by local-hardening heat-treatment. Hardness, tensile properties, fractography, microstructure and surface roughness of local-hardening heat-treated automotive center pillar have been examined. The directly heated and quenched area had fully martensitic structure with Vickers hardenss in the range of 500 to 510. The heat affected area close to the directly heated area showed dual-phase structure of ferrite and martensite. The width of the heat-treated and heat-affected areas after the local-hardening heat treatment was ranging from 32 mm to 50 mm. The surface of the local-hardening heat-treated center pillar revealed some temper color as a consequence of the oxidation during the heat treatment, but the surface roughness was not affected by the local-hardening heat treatment.