• 반도체디스플레이기술학회지
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• 제7권4호
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• pp.1-5
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• 2008

There is a need to enlarge the mother glass substrate in OLED to raise its productivity and to realize OLED TV. On the other hand, some difficulties may arise regarding the deflection of a large glass substrate during its handling operation due to its thinness $(0.5\sim0.7t)$, which is not even enough to allow it to stand its own mass. This thesis proposes a conceptual plan for the application of the clamping- and bending-end conditions to the glass substrate handler. To verify proposed plan, the non-contact 3 dimensional measuring instrument is developed. The composition of the 3 dimensional measuring instrument measures shape of the product using X-Y stage robot and laser distance sensor. X-Y stage robot and laser distance sensor are controlled by LabVIEW language. To calibrate measuring instrument, the direction conversion of the Euler angle was used. In order to confirm deflection of the glass substrate, the experiment was carried out at the bending end boundary condition and the proposed effect was verified.

• 반도체디스플레이기술학회지
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• 제13권2호
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• pp.57-62
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• 2014

In the study, a numerical analysis is conducted to investigate the heat transfer characteristics of an inverter system inside a panel for three locations (bottom, middle and top). A conjugate heat transfer is simulated using a CFD (computational fluid dynamics) code since the heat transfer through the surrounding panel walls is important. It is shown that the heat flux through the left wall, which is important for the safety of the electronic equipment, is the biggest when the inverter is located at bottom. On the other hand, the heat flux through the left wall is negligible when the inverter at middle or top. It is also found that the heat flux to the surrounding walls is the lowest when the inverter is at middle.

• 반도체디스플레이기술학회지
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• 제19권1호
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• pp.42-48
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• 2020

As global warming accelerates, eco-friendly electric cars are being developed to reduce carbon dioxide emissions, and power conversion inverters are used to drive motors. Among inverter components, DC-link capacitor is heated by high current usage, which causes problems such as performance and life-saving of inverter. Although metal cases with good thermal performance have been used to solve this problem, it is difficult to apply them in practice due to insulation problems with other parts. In this paper, the Heat-Generation influence factor of DC-link capacitor is analyzed. Variables on heat-generation are set at 3 levels for film width, inductance, and film thickness. Box-Behnken to 13 tests using the design and minimal deviations, e.g. through the experiment three times by each level. The surface of the film k type by attaching the sensor current is measured temperature. Capacitance was set to a minimum level of 200 ㎌ and had a frequency of 16 kHz with Worst case, ambient temperature of 85℃ and a ripple current of 50 Ams was applied. The temperature at the measurement point was collected in the data logger after sampling at 1 minute intervals for 2 hours after saturation with the ambient temperature. This experiment confirmed that setup factors are correlated with heat-generation.

• 반도체디스플레이기술학회지
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• 제14권3호
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• pp.13-22
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• 2015

LED (Light Emitting Diode) lighting is gaining more and more market penetration as one of the global warming countermeasures. LED is the next generation of fusion source composed of epi/chip/packaging of semiconductor process technology and optical/information/communication technology. LED has been applied to the existing industry areas, for example, automobiles, TVs, smartphones, laptops, refrigerators and street lamps. Therefore, LED makers have been striving to achieve the leading position in the global competition through development of core source technologies even before the promotion and adoption of LED technology as the next generation growth engine with eco-friendly characteristics. However, there has been a point of view on the cost compared to conventional lighting as a large obstacle to market penetration of LED. Therefore, companies are developing a Chip-Scale Packaging (CSP) LED technology to improve performance and reduce manufacturing costs. In this study, we perform patent analysis associated with Flip-Chip CSP LED and flow chart for promising technology forecasting. Based on our analysis, we select key patents and key patent players to derive the business strategy for the business success of Flip-Chip CSP PKG LED products.

• 반도체디스플레이기술학회지
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• 제19권4호
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• pp.139-144
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• 2020

Recently, the electronic equipment industry has become active due to the continuous increase in portable storage media with high-speed information communication, and in particular, the production of SSD(Solid State Drives) for miniaturization of mobile devices and high-speed information communication has increased rapidly. When the SSD is ejecting in the SSD test gender, the necessary ejecting force must be kept constant to have a lifespan applicable to the test device. When the ejecting force increased, it leads to wear of the link for ejecting, which causes a problem in that repeated durability decreases and the ejecting of the SSD becomes impossible. In this paper, the repeated durability test analysis according to the material and the reducing ejecting force design were performed to increase the life of the test gender for SSD inspection. The wear level of the pusher head and ejector was analyzed through repeated durability tests according to the material of the pusher head. The validity of the design was verified through the ejecting force test and repeated durability test of the Test gender, which was designed by carrying out the design to reduce the size and ejecting force of the test gender.

• Journal of Mechanical Science and Technology
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• 제18권9호
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• pp.1680-1688
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• 2004

The information indicating device plays an important part in the information times. Recently, the classical CRT (Cathod Ray Tube) display is getting transferred to the LCD (Liquid Crystal Display) one which is a kind of the FPDs (Flat Panel Displays). The OLED (Organic Light Emitting Diodes) display of the FPDs has many advantages for the low power consumption, the luminescence in itself, the light weight, the thin thickness, the wide view angle, the fast response and so on as compared with the LCD one. The OLED has lately attracted considerable attention as the next generation device for the information indicators. And also it has already been applied for the outside panel of a mobile phone, and its demand will be gradually increased in the various fields. It is manufactured by the vapor deposition method in the vacuum state, and the uniformity of thin film on the substrate depends on the temperature distribution in the point-cell source. This paper describes the basic concepts that are obtained to design the point-cell source using the computational temperature analysis. The grids are generated using the module of AUTOHEXA in the ICEM CFD program and the temperature distributions are numerically obtained using the STAR-CD program. The temperature profiles are calculated for four cases, i.e., the charge rate for the source in the crucible, the ratio of diameter to height of the crucible, the ratio of interval to height of the heating bands, and the geometry modification for the basic crucible. As a result, the blowout phenomenon can be shown when the charge rate for the source increases. The temperature variation in the radial direction is decreased as the ratio of diameter to height is decreased and it is suggested that the thin film thickness can be uniformed. In case of using one heating band, the blowout can be shown as the higher temperature distribution in the center part of the source, and the clogging can appear in the top end of the crucible in the lower temperature. The phenomena of both the blowout and the clogging in the modified crucible with the nozzle-diffuser can be prevented because the temperature in the upper part of the crucible is higher than that of other parts and the temperature variation in the radial direction becomes small.

• 한국정보통신학회논문지
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• 제12권3호
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• pp.517-526
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• 2008

본 논문에서는 자동차 계기판의 OLED 디스플레이 모듈용 One-chip DC-DC 변환기 회로를 제안하였다. 전하 펌핑 방식의 OLED 패널 구동전압 회로는 PWM(Pulse Width Modulation) 방식을 사용한 DC-DC 변환기 회로에 비해 소형화, 저가격 및 낮은 EMI 특성을 갖는다. 그리고 Bulk-potential 바이어싱 회로를 사용하므로 전하 펌핑 시 기생하는 PNP BJT에 의한 전하 손실을 방지하도록 하였고, 밴드갭 기준전압 발생기의 Start-up 회로에서 전류소모를 기존 BGR 회로에 비해 42% 줄였고 VDD의 링 발진기 회로에 로직전원인 VLP를 사용하여 링 발진기기 레이아웃 면적을 줄였다. 또한 OLED 구동전압인 VDD의 구동 전류는 OLED 패널에서 요구하는 40mA 이상이다. $0.25{\mu}m$ High-voltage 공정을 이용하여 테스트 칩을 제작 중에 있으며, 레이아웃 면적은$477{\mu}m{\times}653{\mu}m$이다.

• 대한인간공학회:학술대회논문집
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• 대한인간공학회 1998년도 춘계학술대회논문집
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• pp.13.1-18
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• 1998

IVNS(In-Vehicle Navigation System) which developed by the advance of technological system including computer, display and communication will procide the important interface functions between the driver and the ITS (Intelligent Transport System). However, hat the human factors engineer can actually offer to the designer is by no means a complete set of design specifications. Therefore, a set of boundary conditions and operational ranges within which the designer can be assured that physical, perceptual and cognitive abilities and limitations of drivers will be accommodated system atically[6]. Also, this will be the considerations to compose the IVNS HMI (Human-Machine Interface) design guidelines and IVNS HMI evaluation system. As the first phase of developing the IVNS HMI evaluation system, this paper describe the architecture and the content of this system.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2005년도 추계종합학술대회
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• pp.379-382
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• 2005

This study proposes an effective algorithm that can render a realistic image of a lighting environment, especially an automotive rear lamp, using the backward ray tracing method. To producea realistic image similar to that perceived by the human eye, the incident light energy at the eye point estimated by a ray tracing algorithm is represented by XYZ tri-stimulus values, which are then converted into RGB values considering the particular display device.

• 한국조명전기설비학회:학술대회논문집
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• 한국조명전기설비학회 2009년도 추계학술대회 논문집
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• pp.205-207
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• 2009

LCD (liquid crystal display) industry is needed to goods of high reliability and is interested in products without harmful material. In this experiment, we made the LED backlight unit for Automotive-navigation. And for making this backlight unit we used to eight side emitting type white LEDs with 1W high power of the lumileds company. We could know that this backlight unit releases to 6500 nit in 14W power consumption and start up voltage time is under the15ms in the ambient temperature -20 $^{\circ}C$.