• Corrosion Science and Technology
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• v.11 no.1
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• pp.1-8
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• 2012

The development of martensitic grades which can be processed in continuous galvanizing lines requires the reduction of the oxides formed on the steel during the hot dip process. This reduction mechanism was investigated in detail by means of High Resolution Transmission Electron Microscopy (HR-TEM) of cross-sectional samples. Annealing of a martensitic steel in a 10% $H_2+N_2$ atmosphere with the dew point of $-35^{\circ}C$ resulted in the formation of a thin $_{C-X}MnO.SiO_{2}$ (x>1) oxide film and amorphous $_{a-X}MnO.SiO_{2}$ oxide particles on the surface. During the hot dip galvanizing in Zn-0.13%Al, the thin $_{C-X}MnO.SiO_{2}$ (x>1) oxide film was reduced by the Al. The $_{a-X}MnO.SiO_{2}$ (x<0.9) and $a-SiO_{2}$ oxides however remained embedded in the Zn coating close to the steel/coating interface. No $Fe_{2}Al_{5-X}Zn_{X}$ inhibition layer formation was observed. During hot dip galvanizing in Zn-0.20%Al, the $_{C-X}MnO.SiO_{2}$ (x>1) oxide film was also reduced and the amorphous $_{a-X}MnO.SiO_{2}$ and $a-SiO_{2}$ particles were embedded in the $Fe_{2}Al_{5-X}Zn_{X}$ inhibition layer formed at the steel/coating interface during hot dipping. The results clearly show that Al in the liquid Zn bath can reduce the crystalline $_{C-X}MnO.SiO_{2}$ (x>1) oxides but not the amorphous $_{a-X}MnO.SiO_{2}$ (x<0.9) and $a-SiO_{2}$ oxides. These oxides remain embedded in the Zn layer or in the inhibition layer, making it possible to apply a Zn or Zn-alloy coating on martensitic steel by hot dipping. The hot dipping process was also found to deteriorate the mechanical properties, independently of the Zn bath composition.

• Journal of Technology Innovation
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• v.27 no.2
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• pp.37-71
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• 2019

How has the passenger car's architecture evolved? In the meantime, the discussions on the car architecture have been mixed, i.e., integral, modular, and the coexistence of two types. Therefore, in this study, we aim to develop two indices can measure the degree of modularization of passenger car and its all modules using global trade data. By applying the indices to the framework of architecture positioning that reflects the hierarchical structure of a product, we examined that the degree of modularization of the passenger car architecture has been enhanced. Meanwhile, the degree of modularization differs across the modules that make up the car. Specifically, we observed the higher degree of modularization in front-end, cockpit and seat modules. Whereas, we found that body module had a relatively low degree of modularization. In particular, we observed that the platform of passenger car has notably modularized due to carmakers' efforts to achieve model diversification and reduction of cost and period in new product development at the same time. Interestingly, we showed that three modules, i.e., engine, chassis (relatively less modularized), and transmission (relatively highly modularized), had a different level of modularization, even if they commonly make up the platform. We contribute to the suggestion for analytical approaches that examine the degree of modularization and its progress longitudinally. In addition, we propose the necessity of decomposition of a system into elements in a study of product architecture, considering the possibly distinctive progress of modularization across the elements.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.9
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• pp.517-524
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• 2019

The overdrive hub clutch is attached to a 6-speed automatic transmission to reduce fuel consumption by using the additional power of the engine. This paper proposes a means to minimize the load and roll-over ratio on the punch during the piercing process for the overdrive hub clutch product. Die clearance, shear angle, and friction coefficient, which can affect the load and roll-over ratio of the punch during processing, were set as the design variables. Sensitivity analysis was also conducted to determine the influence of each design variable on the punch load and roll-over ratio. As a result, shear angle, friction coefficient and die clearance were found to be sensitive to load and roll-over ratio. The punch load and roll-over ratio were set as the objective function and the equation of each design variable and objective function was derives using the Response Surface Method. Finally, the optimal value of the design variables was derived using the Response Surface Method. Application of this model to finite element analysis resulted in 22.14% improvement in the roll-over ratio of the punch load and material.

• Journal of the Korea Society for Simulation
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• v.18 no.3
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• pp.73-82
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• 2009

Due to the many advantages including low price, low power consumption, and miniaturization, the CMOS camera has been utilized in many applications, including mobile phones, the automotive industry, medical sciences and sensoring, robotic controls, and research in the security field. In particular, the 360 degree omni-directional camera when utilized in multi-camera applications has displayed issues of software nature, interface communication management, delays, and a complicated image display control. Other issues include energy management problems, and miniaturization of a multi-camera in the hardware field. Traditional CMOS camera systems are comprised of an embedded system that consists of a high-performance MCU enabling a camera to send and receive images and a multi-layer system similar to an individual control system that consists of the camera's high performance Micro Controller Unit. We proposed the SL-AVS (Small Size/Low power Around-View System) to be able to control a camera while collecting image data using a high speed synchronization technique on the foundation of a single layer low performance MCU. It is an initial model of the omni-directional camera that takes images from a 360 view drawing from several CMOS camera utilizing a 110 degree view. We then connected a single MCU with four low-power CMOS cameras and implemented controls that include synchronization, controlling, and transmit/receive functions of individual camera compared with the traditional system. The synchronization of the respective cameras were controlled and then memorized by handling each interrupt through the MCU. We were able to improve the efficiency of data transmission that minimizes re-synchronization amongst a target, the CMOS camera, and the MCU. Further, depending on the choice of users, respective or groups of images divided into 4 domains were then provided with a target. We finally analyzed and compared the performance of the developed camera system including the synchronization and time of data transfer and image data loss, etc.