• 한국전기전자재료학회논문지
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• 제22권7호
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• pp.555-558
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• 2009

This paper presents a step-down converter IC for automotive applications. This device was designed for a 40 V/1 A high-power output for voltage reference of automotive IC. It provides 250kHz PWM (pulse width modulation) and PFM(pulse frequency modulation) according to load conditions. This device was simulated spectre of IC-design-tools and fabricated Dong-bu Hitec 0.35um BD350BA process.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 춘계학술대회 논문집
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• pp.83-84
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• 2009

This paper presents a step-down converter IC for automotive applications. This device was designed for a 40V/1A high-power output for voltage reference of automotive IC. It provides 250kHz PWM(pulse width modulation) and PFM(pulse frequency modulation) according to load conditions. This device was simulated Spectre of IC Design Tool And fabricated Dong-bu Hitec 0.35um BD350BA process.

• Journal of Power Electronics
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• 제17권5호
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• pp.1372-1381
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• 2017

This paper presents a high-side switch driver IC capable of improving the current sensing accuracy and providing reverse battery protection. Power semiconductor switches used to replace relay switches are encumbered by two disadvantages: they are prone to current sensing errors and they require additional external protection circuits for reverse battery protection. The proposed IC integrates a gate driver and current sensing blocks, thus compensating for these two disadvantages with a single IC. A p-sub-based 90-V $0.13-{\mu}m$ bipolar-CMOS-DMOS (BCD) process is used for the design and fabrication of the proposed IC. The current sensing accuracy (error ${\leq}{\pm}5%$ in the range of 0.1 A-6.5 A) and the reverse battery protection features of the proposed IC were experimentally tested and verified.

• 한국전기전자재료학회논문지
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• 제22권7호
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• pp.563-566
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• 2009

This paper presents a motor drive IC for automotive applications. The drive IC is dedicated to control and drive external MOSFETs which directly drive 3-phase motor with a high current. In case of driving high-side power switches, the bootstrap topology is widely used. however, it requires three bootstrap diode and three capacitor respectively. And it needs a minimum charging time to maintain high-side voltage. The motor drive IC uses a charge-pump circuit for all three high-side voltage with various protection schemes for automotive applications.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 춘계학술대회 논문집
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• pp.41-42
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• 2009

This paper presents a motor drive IC for automotive applications. The drive IC is dedicated to control and drive external MOSFETs which directly drive 3-phase motor with a high current. In case of driving high-side power switches, the bootstrap topology is widely used. However, it requires three bootstrap diode and three capacitor respectively. And it needs a minimum charging time to maintain high-side voltage. The motor drive IC uses a charge-pump circuit for all three high-side voltage with various protection schemes for automotive applications.

• 한국자동차공학회논문집
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• 제16권3호
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• pp.15-22
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• 2008

Applications of bonded dissimilar materials such as integrated circuit(IC) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in bonded joints of dissimilar materials. In order to investigate the IC package crack propagating from the edge of die pad and resin, the fracture parameters of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method(BEM). From these results, crack propagation direction and path by thermal stress in the IC package were numerically simulated with boundary element method.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2001년도 춘계학술대회 논문집 전기기기 및 에너지변환시스템부문
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• pp.247-249
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• 2001

In our research, we designed a small step motor with 2-phase structure and a micro step driving IC, which is used in an automotive instrument. The step motor for the automotive instrument has the better advantages than a cross coil type motor. These advantages are the characteristics with a good linearity, a fine accuracy, a low noise and so on.

• 전자공학회논문지
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• 제51권8호
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• pp.38-48
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• 2014

본 논문은 Piezo Resistive Type(PRT) 압력 센서용 신호 처리 아날로그 전단부 IC 설계를 주제로 한다. 센서의 출력 전압을 개선을 하기 위해 센서의 전류를 보상하는 Gauge Factor Calibration 회로, 같은 센서와의 오차가 있더라도 적용이 가능하도록 설계한 Programmable Gain Amplifier (PGA), 클록 생성기에서 발생하는 EMI를 감소시키기 위한 확산 스펙트럼 클록 생성기, 압력 센서의 분해능을 향상시키기 위한 10Bit ADC와 14Bit DAC 그리고 기존 아날로그 방식으로 처리하던 방식과는 달리 디지털 신호처리 방식을 이용한 Calibration Microcontroller (CMC)를 설계하였다. $0.35{\mu}m$ CMOS Process를 이용하여 설계 하였으며, 설계된 IC의 공급 전압은 5V와 3.3V의 전원 분리를 통하여 아날로그 회로는 5V를 사용하고 디지털 회로는 LDO로부터 3.3V를 공급 받도록 구성하였다. Gauge Factor Calibration 회로는 3.75uA부터 120uA까지 보상이 가능하며 PGA는 30dB부터 45dB까지 제어가 가능하고 확산 스펙트럼 클록 생성기는 2.13dB에서 -5.94dB로의 EMI를 감소시킬 수 있다. 공급전압에 대한 ASIC 보호 회로는 800mV부터 6.4V를 제외한 나머지 전압은 차단이 가능하고 14Bit DAC는 0.305mV의 해상도를 가지고 있다. 총 전류 5.32mA를 소모하고 있으며, Die 크기는 $1.94mm{\times}1.94mm$의 면적을 갖는다.

• 한국자동차공학회논문집
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• 제21권5호
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• pp.1-7
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• 2013

The present paper relates to a development of the Gear Detection Sensor for automotive manual transmission. To detect air gap from control finger to detecting zone of sensor based on non-contacted method, permanent magnet and linear type Hall IC are mounted in this sensor. Control finger is machined to 3 step heights to detect 3 gear stages such as In-Gear, Normal and Rear. After conducting actual experimentation based on exclusive Jig and FEM, it is described to consider possibility for automotive application of Gear Detection Sensor.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2006년도 하계종합학술대회
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• pp.609-610
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• 2006

A 77GHz MMIC transceiver module consisting of a power amplifier, a low noise amplifier, a drive amplifier, a frequency doubler and a down-mixer has been developed for automotive forward-looking radar sensor. The MMIC chip set was fabricated using $0.15{\mu}m$ gate-length InGaAs/InAlAs/GaAs mHEMT process based on 4-inch substrate. The power amplifier demonstrated a measured small signal gain of over 20dB from $76{\sim}77GHz$ with 15.5dBm output power. The chip size is $2mm{\times}2mm$. The low noise amplifier achieved a gain of 20dB in a band between $76{\sim}77\;GHz$ with an output power of 10dBm. The chip size is $2.2mm{\times}2mm$. The driver amplifier exhibited a gain of 23dB over a $76{\sim}77\;GHz$ band with an output power of 13dBm. The chip size is $2.1mm{\times}2mm$. The frequency doubler achieved an output power of -16dBm at 76.5GHz with a conversion gain of -16dB for an input power of 10dBm and a 38.25GHz input frequency. The chip size is $1.2mm{\times}1.2mm$. The down-mixer demonstrated a measured conversion gain of over -9dB. The chip size is $1.3mm{\times}1.9mm$. The transceiver module achieved an output power of 10dBm in a band between $76{\sim}77GHz$ with a receiver P1dB of -28dBm. The module size is $8{\times}9.5{\times}2.4mm^3$. This MMIC transceiver module is suitable for the 77GHz automotive radar systems and related applications in W-band.