• Title/Summary/Keyword: Automation in Assembly

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An Efficient Algorithm for 3-D Range Measurement using Disparity of Stereoscopic Camera (스테레오 카메라의 양안 시차를 이용한 거리 계측의 고속 연산 알고리즘)

  • 김재한
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.5 no.6
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    • pp.1163-1168
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    • 2001
  • The ranging systems measure range data in three-dimensional coordinate from target surface. These non-contact remote ranging systems is widely used in various automation applications, including military equipment, construction field, navigation, inspection, assembly, and robot vision. The active ranging systems using time of flight technique or light pattern illumination technique are complex and expensive, the passive systems based on stereo or focusing principle are time-consuming. The proposed algorithm, that is based on cross correlation of projection profile of vertical edge, provides advantages of fast and simple operation in the range acquisition. The results of experiment show the effectiveness of the proposed algorithm.

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Development of smart transducer with embedded sensor for automatic process control of ultrasonic wire bonding

  • Or, Siu Wing;Chan, Helen Lai Wa;Liu, Peter Chou Kee
    • Smart Structures and Systems
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    • v.1 no.1
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    • pp.47-61
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    • 2005
  • A ring-shaped lead zirconate titanate (PZT) piezoceramic sensor has been integrated with the Langevin-type piezoceramic driver of an ultrasonic wire-bonding transducer to form a smart transducer for in-situ measurement of three essential bonding parameters: namely, impact force, ultrasonic amplitude and bond time. This sensor has an inner diameter, an outer diameter and a thickness of 12.7 mm, 5.1 mm and 0.6 mm, respectively. It has a specifically designed electrode pattern on the two major surfaces perpendicular to its thickness along which polarization is induced. The process-test results have indicated that the sensor not only is sensitive to excessive impact forces exerted on the devices to be bonded but also can track changes in the ultrasonic amplitude proficiently during bonding. Good correlation between the sensor outputs and the bond quality has been established. This smart transducer has good potential to be used in automatic process-control systems for ultrasonic wire bonding.

Improvement of Assembly Characteristics of a Lens Module in a Mobile Phone Camera using Finite Element Analysis (유한요소해석을 사용한 휴대폰 카메라용 렌즈모듈의 결합특성 개선)

  • Moon, Yang-Ho;Moon, Jae-Ho;Lyu, Min-Young;Park, Keun
    • Elastomers and Composites
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    • v.44 no.4
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    • pp.366-372
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    • 2009
  • The present study covers the optimal design for a lens module in a mobile phone camera by using the design of experiments (DOE) and finite element (FE) analysis. FE analyses are performed to investigate the effect of design parameters on the amount of torque required to assemble a barrel and a housing part. The DOE approach is then performed to optimize the design parameters in order to maintain an appropriate torque with less variations.

Detection of Flip-chip Bonding Error Through Edge Size Extraction of X-ray Image (X선 영상의 에지 추출을 통한 플립칩 솔더범프의 접합 형상 오차 검출)

  • Song, Chun-Sam;Cho, Sung-Man;Kim, Joon-Hyun;Kim, Joo-Hyun;Kim, Min-young;Kim, Jong-Hyeong
    • Journal of Institute of Control, Robotics and Systems
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    • v.15 no.9
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    • pp.916-921
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    • 2009
  • The technology to inspect and measure an inner structure of micro parts has become an important tool in the semi-conductor industrial field with the development of automation and precision manufacturing. Especially, the inspection skill on the inside of highly integrated electronic device becomes a key role in detecting defects of a completely assembled product. X-ray inspection technology has been focused as a main method to inspect the inside structure. However, there has been insufficient research done on the customized inspection technology for the flip-chip assembly due to the interior connecting part of flip chip which connects the die and PCB electrically through balls positioned on the die. In this study, therefore, it is implemented to detect shape error of flip chip bonding without damaging chips using an x-ray inspection system. At this time, it is able to monitor the solder bump shape by introducing an edge-extracting algorithm (exponential approximation function) according to the attenuating characteristic and detect shape error compared with CAD data. Additionally, the bonding error of solder bumps is automatically detectable by acquiring numerical size information at the extracted solder bump edges.

Bin-Picking Method Using Laser (레이저를 이용한 Bin-Picking 방법)

  • Joo, Kisee;Han, Min-Hong
    • Journal of the Korean Society for Precision Engineering
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    • v.12 no.9
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    • pp.156-166
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    • 1995
  • This paper presents a bin picking method using a slit beam laser in which a robot recognizes all of the unoccluded objects from the top of jumbled objects, and picks them up one by one. Once those unoccluded objects are removed, newly developed unoccluded objects underneath are recognized and the same process is continued until the bin gets empty. To recognize unoccluded objects, a new algotithm to link edges on slices which are generated by the orthogonally mounted laser on the xy table is proposed. The edges on slices are partitioned and classified using convex and concave function with a distance parameter. The edge types on the neighborhood slices are compared, then the hamming distances among identical kinds of edges are extracted as the features of fuzzy membership function. The sugeno fuzzy integration about features is used to determine linked edges. Finally, the pick-up sequence based on MaxMin theory is determined to cause minimal disturbance to the pile. This proposed method may provide a solution to the automation of part handling in manufacturing environments such as in punch press operation or part assembly.

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Development of In-Process Polishing Pressure Control System (실시간 폴리싱 압력 제어시스템 개발)

  • 오창진;전문식;김옥현
    • Journal of the Korean Society for Precision Engineering
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    • v.21 no.1
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    • pp.109-115
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    • 2004
  • Polishing process has been applied to get extremely fine surfaces, e.g., mirror surfaces such as optical mirrors, lens, molds and etc. Nowadays not only fine surface quality but also submicron order of dimensional accuracy is required for many applications. To meet the requirements polishing process should be provided with an active control of polishing pressure especially for automation of polishing process. In this paper a study on development of an active polishing pressure control system has been presented. A new type of tool assembly has been developed to facilitate the control. The tool is attached to an axis of a polishing machine with a coil spring and control of the polishing pressure is done by the position control of the axis, which needs no additional actuator. The polishing pressure is successfully measured by the measurement of the spring deformation. Control specifications were quantitatively considered by weighting functions and a controller was designed by using loop-shaping technique based on the no synthesis. Some experiments have been executed on a polishing machine with a PC-NC controller. It is shown that the results were coincident well with the theoretical analyses and satisfied the design specifications.

Kinematic Analysis of a 6-DOF Ultra-Precision Positioning Stage Based on Flexure Hinge (플렉셔 힌지 기반 6-자유도 초정밀 위치 결정 스테이지의 기구학 해석)

  • Shin, Hyun-Pyo;Moon, Jun-Hee
    • Journal of the Korean Society for Precision Engineering
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    • v.33 no.7
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    • pp.579-586
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    • 2016
  • This paper describes kinematic analysis of a 6-degrees-of-freedom (DOF) ultra-precision positioning stage based on a flexure hinge. The stage is designed for processes which require ultra-precision and high load capacities, e.g. wafer-level precision bonding/assembly. During the initial design process, inverse and forward kinematic analyses were performed to actuate the precision positioning stage and to calculate workspace. A two-step procedure was used for inverse kinematic analysis. The first step involved calculating the amount of actuation of the horizontal actuation units. The second step involved calculating the amount of actuation of the vertical actuation unit, given the the results of the first step, by including a lever hinge mechanism adopted for motion amplification. Forward kinematic analysis was performed by defining six distance relationships between hinge positions for in-plane and out-of-plane motion. Finally, the result of a circular path actuation test with respect to the x-y, y-z, and x-z planes is presented.

Automated Generation of Wrapper to Test Components (컴포넌트 테스트를 위한 래퍼의 자동 생성에 관한 연구)

  • Song, Ho-Jin;Choi, Eun-Man
    • Journal of KIISE:Software and Applications
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    • v.32 no.8
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    • pp.704-716
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    • 2005
  • Assembling new software systems from Prepared components is an attractive alternative to traditional software development method to reduce development cost and schedule dramatically. However, if separately developed components are tested, integrated and verified with unreasonable effort and high cost, it would not be an effective way to software development. Components are not distributed in the shape of white-box source code so that should be hard to validate and test in new application environment. For solving this problem, built-in tester components are suggested to check the contract-compliance of their server components. If components have various and complex function, built-in tester should be heavy and unflexible to test in composition of components. This paper suggests enhancing automated wrapper technique which substitutes with built-in tester components and shows the usability of the wrapper by design and implementation. Component testing in this way reduces the cost and effort associated with preparation of component testing and makes the various test experiments in components assembly.

Circuit Design for Noise Removal of Sine Wave Hall Sensor Signal (정현파 Hall Sensor 신호의 잡음제거를 위한 회로설계)

  • Jeong, Sungin
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.21 no.4
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    • pp.135-141
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    • 2021
  • Interest is growing in the design and development of square wave driven BLDC permanent magnet motors suitable for industrial automation, and the development of position detection circuits and drivers. However, this motor is somewhat limited in its application despite the price and functional advantages due to the decrease in efficiency due to switching loss and vibration and noise. In the process of designing and assembling a BLDC motor, the magnetic pole angle is not uniform or the magnetic flux distribution is distorted due to problems in magnetic circuit design or product non-uniformity in the assembly process. Therefore, these things cause position detection deviation and deteriorate the motor characteristics. In addition, the sine wave driven BLDC system can operate stably only when the signal generated from the position sensor is accurately fed back to the driver. However, since the generated signal cannot perform stable position detection due to the occurrence of DC offset component due to magnetic flux density deviation or magnetization technology, which is an external influence, this study intends to study the proposed circuit that can remove the DC offset component.

Development of Shipbuilding Execution Scheduling Support System using Mobile Device : A Case Study for a Panel Block Assembly Shop (모바일 기기를 활용한 조선 생산 실행계획 지원 시스템 개발 : 판넬라인 개발 사례를 중심으로)

  • Hwang, Inhyuck;Song, Jungkyu;Back, Myunggi;Ryu, Cheolho;Lee, Kwangkook;Shin, Jong Gye
    • Journal of the Society of Naval Architects of Korea
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    • v.50 no.4
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    • pp.262-271
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    • 2013
  • Owing to the development of mobile communication technology during the last a few years, the number of users of mobile devices such as the smartphone and the tablet PC has increased rapidly. As a result, the range of applications of the mobile devices has also been greatly expanded from an application for the convenience of daily life to an application for assisting the operations of industrial fields. Especially, portability of mobile devices can provide great help in collecting and using information on the production site. In shipbuilding production processes, it is difficult to collect changes of circumstance in the field and reflect the changes to schedule due to the low production automation rate and frequent changes in schedule. In this study, we propose a system to solve the problems of shipbuilding production processes such as the ones described above by using mobile devices. First of all, we organize the production information and production processes of the panel line through the analysis of shipyard panel line operations. Next, we have developed a system that can support the production execution plan of the panel line and monitor the production processes in the field. The system was developed utilizing application virtualization to allow access to the system from various platforms of mobile devices and PC's. The system was implemented using ooCBD methodology considering the future expansion of the system and ease of maintenance.