• 제어로봇시스템학회논문지
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• 제8권8호
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• pp.625-632
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• 2002

We propose an outsole measurement/inspection system to improve the quality of the shoe product. It uses the Divide-and-Conquer technique to measure the length of shoes'outsole. First, it detects edge positions of outsole's toe and heel from each image frame using an unique scale block we defined and calculates the outsole's length as the distance of two edge positions. Then it compensates the total length of outsole using the side image of outsole. Next, it classifies the outsole as inferior goods if the measurement error is bigger than 5.8mm. As a result of testing with the various kinds of outsoles, it was shown that the 95% accuracy was acquired within 1mm allowable error range. In conclusion, the proposed inspection system is effective and useful in the measurement/inspection process of shoe product and any material object as well.

• 마이크로전자및패키징학회지
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• 제8권3호
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• pp.1-9
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• 2001

본 논문에서는 마이크로 납볼 격자 배열 ($\mu$BGA)패키지의 검사 알고리듬을 제안하였다. 이 알고리듬의 개발은 납볼 배열의 미세 크기 때문에 사람의 사각으로는 결함을 식별하기 어려운 점에 기인하였다. 특히, 여기에서 보인 자동 시각 $\mu$BGA 검사 알고리듬은 소위 말하는 이차원 오차뿐만 아니라 볼의 높이 오차까지 검사할 수 있다. 검사 알고리듬은 특수하게 제작된 청색 조명 하에서 이차원 $\mu$BGA 영상을 사용하고 회전 불변 알고리듬으로 영상을 처리하였다. 그리고 2개의 카메라를 사용하여 높이 오차를 검출할 수 있었다 모의실험결과, 제안한 알고리듬이 기존 방법에 비하여 괄목할 만큼 납볼 결함을 검출할 수 있음을 보였다.

• 반도체디스플레이기술학회지
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• 제11권2호
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• pp.45-51
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• 2012

Multilayer co-extrusion blown film construction is a popular technique for producing plastic films for various packaging industries. Automated detection of defective films can improve the quality of film production process. In this paper, we propose a film inspection system that can detect and classify film defects robustly. In our system, first, film images are acquired through a high speed line-scan camera under an appropriate lighting system. In order to detect and classify film defects, an inspection algorithm is developed. The algorithm divides the typical film defects into two groups: intensity-based and texture-based. Intensity-based defects are classified based on geometric features. Whereas, to classify texture-based defects, a texture analysis technique based on local binary pattern (LBP) is adopted. Experimental results revealed that our film inspection system is effective in detecting and classifying defects for the multilayer co-extrusion blown film construction line.

• 제어로봇시스템학회논문지
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• 제4권3호
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• pp.384-391
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• 1998

When a device is mounted on the PCB, it is impossible to have zero defects due to many unpredictable problems. Among these problems, devices with bent corner leads due to mis-handling and which are not placed at a given point measured along the axis are principal problem in SMT(Surface Mounting Technology). It is obvious that given the complexity of the inspection task, the efficiency of a human inspection is questionable. Thus, new technologies for inspection of SMD(Surface Mounting Device) should be explored. An example of such technologies is the Automated Visual Inspection(AVI), wherein the vision system plays a key role to correct this problem. In implementing vision system, high-speed and high-precision are indispensable for practical purposes. In this paper, a new algorithm based on the Radon transform which uses a projection technique to inspect the FIC(Flat Integrated Circuit) device is proposed. The proposed algorithm is compared with other algorithms by measuring the position error(center and angle) and the processing time for the device image, characterized by line scan camera.

• 한국전산구조공학회:학술대회논문집
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• 한국전산구조공학회 2008년도 정기 학술대회
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• pp.178-183
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• 2008

A robot crane truck is being developed by the Bridge Inspection Robot Development Interface(BRIDI) for an automated and/or teleoperated bridge inspection. At the end of the telescoping boom allows the operator to scan the bridge structure under the deck trough the camera. Boom vibration induced by wind and deck movement can cause serious problems in this scanning system. This paper presents a control system to mitigate such vibration of the robot boom In the proposed control system an actuator is installed at the end of the working boom. This control system is studied using a mathematical model analysis with LQ control algorithm and a scaled model test in the laboratory. The study indicates that the proposed system is efficient for the vibration control of the robot booms, thereby demonstrating its immediate applicability in the field.

• 전자공학회논문지B
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• 제33B권11호
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• pp.53-61
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• 1996

In this paper, efficient techniques for solder joint inspection have been described. Using three layers of ring shaped LED's with different illumination angles, three frames of images are sequentially obtained. From these images the regions of interest (soldered regions) are segmented, and their characteristic features including the average gray level and the percentage of highlights - refereed to as 2D features - are extracted. Based on the backpropagation algorithm of neural networks, each solder joint is classified intor one of the pre-defined types. If the output value is not in the confidence interval, the distribution of tilt angles-referred to as 3D features - is claculated, and the solder joint is classified based on the bayes classfier. The second classifier requires more computation while providing more information and better performance. The proposed inspection system has been implemented and tested with various types of solder joints in SMDs. The experimental results have verified the validity of this scheme in terms of speed and recognition rate.

• 한국공작기계학회논문집
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• 제13권3호
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• pp.84-90
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• 2004

Today, automobile world market is highly competitive. In order to strengthen the competitiveness, quality of automobile is recognized as important and efforts are being made to improve the quality of manufactured components. The directional ability of automobile has influence on driver directly and hence it must be solved on the preferential basis. In the present research, an automated vision system has been developed to inspect the front chassis module. To interpret the inspection data obtained for front chassis module, new interpreting algorithm have been developed. Previously the control of tolerance of front chassis module was done manually. With the help of the new algorithm developed, the dimension is calculated automatically to check whether the front chassis module is within the tolerance limit or not.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년 학술대회 논문집 정보 및 제어부문
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• pp.422-424
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• 2006

This paper suggests an automatic spot-inspection algorithm for LCD modules. Usually, LCD module testing is classified by two categories. One is for uniform pattern testing and the other is Non-uniform testing. The uniform pattern testing is well defined and also fully automated in the factory. However non-uniform pattern testing is not defined well yet, so non-uniform testing is conducted by human operators. In this paper a spot-pattern, which is one of non-uniform pattern, inspection algorithms are proposed. The performance of the proposed algorithm is tested by extensive simulations using artificial slot-patterns and real ones in the LCD modules.

• 제어로봇시스템학회논문지
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• 제21권10호
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• pp.982-987
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• 2015

The inspection machine in SMT (Surface Mount Technology) line detects the assembly defects such as missing, misalignment, loosing, or tombstone. We propose a new method to classify the defect types of chip components by processing the image of PCB. Two original images are obtained from horizontal lighting and vertical lighting. The image of the component is divided into two soldering regions and one packaging region. The features are extracted by appling the PCA (Principle Component Analysis) to each region. The MLP (Multilayer Perceptron) and SVM (Support Vector Machine) are then used to classify the defect types by learning. The experimental results are presented to show the usefulness of the proposed method.

• 제어로봇시스템학회논문지
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• 제19권11호
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• pp.974-978
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• 2013

AVI (Automatic Vision Inspection) systems automatically detect defect features and measure their sizes via camera vision. AVI systems usually report different measurements on the same defect with some variations on position or rotation mainly because different images are provided. This is caused by possible variations from the image acquisition process including optical factors, nonuniform illumination, random noises, and so on. For this reason, conventional area based defect measuring methods have problems of robustness and consistency. In this paper, we propose a new defect size measuring method to overcome this problem, utilizing volume information that is completely ignored in the area based defect measuring method. The results show that our proposed method dramatically improves the robustness and consistency of defect size measurement.