• Bulletin of the Korean Chemical Society
• /
• 제17권11호
• /
• pp.1061-1065
• /
• 1996

The charge transfer compounds of tetrathiafulvalene (TTF) with the general formula of (TTF)mMCln, (M=Au, Pt, Ir, Os) were prepared by the direct reaction using excess HAuCl4·3H2O, H2PtCl6·xH2O, H2IrCl6·xH2O and H2OsCl6 respectively. The powdered electrical conductivities (σrt) at room temperature are given as follows; (TTF)3AuCl2, 4.53×10-3; (TTF)3.5AuCl2, 6.37×10-3; (TTF)3PtCl4, 5.51×10-4; (TTF)2IrCl4, 2.40×10-5; (TTF)OsCl4·1/2C2H5OH, 4.46×10-7 Scm-1. Magnetic susceptibility, electronic (UV-Vis.), vibrational (IR) and EPR spectroscopic evidences indicate that there is incomplete charge transfer from the TTF donor to gold, platinum, and iridium respectively, and that there is essentially complete charge transfer to osmium, thereby resulting a relatively low electrical conductivity in osmium compound. The EPR and magnetic susceptibility data reflect that the metals are in diamagnetic Au(Ⅰ), Pt(Ⅱ), Ir(Ⅲ), and Os(Ⅱ) oxidation states, and the odd electrons are extensively delocalized over the TTF lattices in each compound.

• Transactions on Electrical and Electronic Materials
• /
• 제4권3호
• /
• pp.1-4
• /
• 2003

The etching of Au thin films has been performed in an inductively coupled $CF_4 / Cl_2 / Ar$ plasma. The etch properties including etch rate and selectivity were examined as $CF_4$ content adds from o to $30\%$ to $Cl_2/Ar$ plasma. The $Cl_2/(Cl_2 + Ar)$ gas mixing ratio was fixed at $20\%$. Other parameters were fixed at an rf power of 700 W, a dc bias voltage of -150 V, a chamber pressure of 15 mTorr, and a substrate temperature of $30^{\circ}C$. The highest etch rate of the Au thin film was 370 nm/min at a $10\%$ additive $CF_4$ into $Cl_2/Ar$ gas mixture. The surface reaction of the etched Au thin films was investigated using x-ray photoelectron spectroscopy (XPS) analysis. The XPS analysis shows that the intensities of Ail peaks are changed, indicating that there is a chemical reaction between Cl and Au. Au-Cl is hard to remove on the surface because of its high melting point. However, etching products can be sputtered by Ar ion bombardment.

• 한국표면공학회:학술대회논문집
• /
• 한국표면공학회 2009년도 추계학술대회 초록집
• /
• pp.239-239
• /
• 2009

We prepared Au nanoparticles by seed-mediated method and investigated the effects of process variables on the seed-mediated growth of Au nanoparticles. The monodispersed Au seed nanoparticles in the size range from 14.3 nm to 20.3 nm were prepared by the reduction reaction between $HAuCl_4$ and citrate. We added the $HAuCl_4$ precursors with citrates into the Au seed solution and prepared the Au nanoparticles in the size range from 16.8 and 37.8 nm with monodisperse distribution and could control the size of Au nanoparticles by changing the amount of $HAuCl_4$ precursor.

• 산업기술연구
• /
• 제29권B호
• /
• pp.229-232
• /
• 2009

We prepared gold nanoparticles (Au NPs) by reduction-oxidation reaction between $HAuCl_4$ and trisodium citrate and measured the size and morphology of Au NPs by TEM for various molar ratios of $HAuCl_4$ to citrate and for various concentrations of $HAuCl_4$. UV-vis spectroscopy was used to characterize the optical properties of Au NPs. Au NPs in the size range from 14.3 nm to 20.3 nm were prepared with monodisperse distribution.

• Bulletin of the Korean Chemical Society
• /
• 제33권3호
• /
• pp.906-910
• /
• 2012

Hollow gold-silver bimetallic nanoparticles (AuAg-HNPs) have been synthesized and their optical and structural properties were characterized. Initially Ag nanoparticles (Ag-NPs) were prepared using poly(ethylenimine) (PEI) as a reducing and a stabilizing agent simultaneously. AuAg-HNPs could then be synthesized via galvanic replacement reaction in a PEI aqueous solution by reacting sacrificial Ag template with a precursor compound of Au, i.e., $HAuCl_4$. Due to the presence of abundant amine functional groups in PEI, which could act as the dissolving ligand for AgCl, the precipitation problem of $Ag^+$ in the presence of Cl from $HAuCl_4$ salt was avoided. On this basis, the relatively high concentrations of $HAuCl_4$ and PEI-stabilized Ag nanoparticles could be used for the fabrication of AuAg-HNPs. Because of their increased surface areas and reduced densities, the AuAg-HNPs were expected and confirmed to outperform their solid counterparts in applications such as catalysis for the reduction of 4-nitrophenol in the presence of $NaBH_4$.

• 한국염색가공학회지
• /
• 제22권2호
• /
• pp.123-131
• /
• 2010

Shape and size controlled synthesis of gold particles has been studied by using wet-chemical method. When ${AuCl_4}^-$ in aqueous $HAuCl_4$ precursor was reduced using $Na_2SO_3$ as a reducing agent, mixtures of spherical, triangular and hexagonal particles were prepared in a few minutes. It was found that the shape selective oxidative etching by ${AuCl_4}^-\;+\;Cl^-$ anions and crystal growth took place simultaneously. As the ${AuCl_4}^-$ and $Cl^-$ concentration increased, yields of large triangular and hexagonal plate type particles increased, while the spherical particles decreased in most cases. Possible etching and growth mechanisms are discussed.

• 대한치과기공학회지
• /
• 제14권1호
• /
• pp.23-43
• /
• 1992

Corrosion characteristics of four commerial gold-based dental alloys(C-1; Au75%, Ag13.9%, Pd3%, Cu & etc.,8.1%, C-2 ;Au 52.08, Ag 24%, Pd 5%, Cu & etc.,18.92, C-3 ; Au 53%, Ag 22%, Pd 5%, Pt 3% Cu & etc.,17%, C-4 ; Au 53%, Pd4, Pt1.5%, Ag & Cu & etc.,41.5%) and four experimental ternary Au-Ag-Cu alloys(E-1 ; Au 50%, Ag 30%, Cu 20%, E-2 ; Au 50%, Ag 20%, Cu 30%, E-3 ; Au 50%, Ag 10%, Cu 40%, E-4 ; Au 50%, Ag 40%, Cu 10%) were investigated by potentiodynamic polarization analysis and the structure was examined by optical microscope and SEM. All corrosion testing was conducted in 1% NaCl solution. The main results are as follows : 1. The corrosion resistence of commercial alloys was decreased in the order of C-1, C-3, C-4, C-2. C-2. 2. The E-1 and E-3 ternary alloys exhibits the higher corrosion resistence than E-2 and E-4 alloys. 3. The cast microstructure of alloys reveals dendrite morphology which shows the significant microsegregation caused by the difference in the diffusion rate between liquid and solid. 4. It is found that the surface corrosion products were mainly AgCl by X-ray diffraction results.

• Fibers and Polymers
• /
• 제5권1호
• /
• pp.1-5
• /
• 2004

The ability of inherently conducting polymer (ICP) coated textiles to recover gold metal from aqueous solutions containing $[AuCl_4]^-$ was investigated. Nylon-lycra, nylon, acrylic, polyester and cotton were coated with a layer of polypyrrole (PPy) doped with 1,5-naphthalenedisulfonic acid (NDSA), 2-anthraquinonesulfonic acid (AQSA) or p-toluenesulfonic acid (pTS). Textiles coated with polyaniline (PAn) doped with chloride were also used. The highest gold capacity was displayed by PPy/NDSA/nylon-lycra, which exhibited a capacity of 115 mgAu/g coated textile, or 9700 mgAu/g polymer. Varying the underlying textile substrate or the ICP coating had a major effect on the gold capacity of the composites. Several ICP coated textiles recovered more than 90 % of the gold initially present in solutions containing 10 ppm $[AuCl_4]^-$ and 0.1 M HCl in less than 1 min. Both PPy/NDSA/nylon-lycra and PAn/Cl/nylon-lycra recovered approximately 60 % of the gold and none of the iron present in a solution containing 1 ppm $[AuCl_4]^-$, 1000 ppm $Fe^{3+}$ and 0.1 M HCl. The spontaneous and sustained recovery of gold metal from aqueous solutions containing $[AuCl_4]^-$ using ICP coated textiles has good prospects as a potential future technology.

• 한국전기전자재료학회논문지
• /
• 제16권7호
• /
• pp.564-568
• /
• 2003

The etching of Au thin films have been performed in an inductively coupled CF$_4$/Cl$_2$/Ar plasma. The etch rates were measured as CF$_4$ contents added from 0 to 30 % to Cl$_2$/Ar plasma, of which gas mixing ratio was fixed at 20%. Other parameters were fixed at an rf power of 700 W, a dc bias voltage of 150 V, a chamber pressure of 15 mTorr, and a substrate temperature of 3$0^{\circ}C$. The highest etch rate of the Au thin film was 3700 $\AA$m/min at a 10% additive CF$_4$ into Cl$_2$/Ar plasma. The surface reaction of the etched Au thin films was investigated using x-ray photoelectron spectroscopy (XPS) analysis. XPS analysis indicated that Au reacted with Cl and formed Au-Cl, which is hard to remove on the surface because of its high melting point. The etching products could be sputtered by Ar ion bombardment.

• Corrosion Science and Technology
• /
• 제4권1호
• /
• pp.19-22
• /
• 2005

Two Au-Ag-Cu-Pd dental casting alloys (Au:12% and 20%) used. The test solutions used 0.9 % NaCl solution (isotonic sodium chloride solution), 0.9 % NaCl solution containing 1 % lactic acid, and 0.9 % NaCl solution containing 1 % lactic acid and 0.1 mol $dm^{-3}$ $Na_2S$. The surface of two samples in three sample solutions was not natural discoloration during one year. The alloy containing 12 % gold was easily alloyed and the composition was uniform comparing with the alloy containing 20 % gold. The rest potentials have not a little effect after three months. The kinds of metals could not definitely from the oxidation and reduction waves of metal on the cyclic voltammograms. The dissolutions of gold and palladium were 12 % Au sample in the 0.9 % NaCl solution containing 1 % lactic acid and 0.1 mol $dm^{-3}$ $Na_{2}S$. The pH of solution had an affect on dissolution of copper, and sulfur ion had an affect on dissolution of silver. The copper dissolved amount from 20 % gold sample was about 26 times comparing with that of 12 % gold sample in the 0.9 % solution containing 1 % lactic acid. Corrosion products were silver chloride and copper chloride in NaCl solution, and silver sulfide and copper sulfide in NaCl solution containing $Na_{2}S$.