• Bulletin of the Korean Chemical Society
• /
• v.14 no.6
• /
• pp.696-700
• /
• 1993

Gold bonding wire of 0.076 mm in diameter used in semiconductor industry, is dissoved in aqua regia. The solution is then evaporated to near dryness several times with a few drops of HCl added to prepare the final sample solution in 5% HCl. The gold matrix is separated from trace impurities by controlled potential deposition. The whole electrolysis has been carried out inside a clean bench. An optimum potential is found to be +0.25 V to give more than 99.9% Au matrix removal with better than 90 analytes remaining in the electrolyte solution. Isotope dilution calibration is employed to get the best accuracy and precision. Analytical results are presented with determination limits of the analytical method.

• Journal of the Korean Institute of Telematics and Electronics D
• /
• v.35D no.6
• /
• pp.72-78
• /
• 1998

An optical modulator Ti:LiNbO$_3$optical waveguide and CPW electrode structure were fabricated. The optical modulator was packaged using components such as ferrules, dirmy LN block and glass, vibration and shock absorbption pad, and alumina feeder through processings of pigtailing. Au wire bonding, epoxing, SMA connecting, sealing. The electrical and optical characteristics were measured after packaging. The electrical properties of S$_{21}$ and S$_{11}$ were obtained as 9.8 GHz at -3 dB and -8.9dB at 14.4GHz, respectively. Optical waveguide prepared met requirements for a single mode at a 1550nm wavelength range. Insertion loss was 4.3dB at room temperature after packaging, and was varied 4.3~6.4dB at various temperatures, 5~45$^{\circ}C$. E-O bandwidth measurement showed 3dB optical response at 7.8GHz, which means that it is applicable for 10Gbps optical communicationon