• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.295-295
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• 2014

일반적으로 박막 태양전지의 효율은 박막 종류에 따른 광 흡수율에 의해 결정되며, 이는 증착한 박막의 두께에 의해 결정된다. 증착한 박막의 두께가 두꺼워질수록 광 흡수율은 증가하지만, 박막 두께가 지나치게 두꺼워지면 열화 현상으로 인한 모듈의 효율 감소가 생기므로 적절한 박막의 두께가 요구된다. 특히 a-Si:H의 경우 가시광 영역에서 높은 흡수계수를 가지고 있어서 얇은 박막 두께로도 태양전지의 제작이 가능하지만, 동일한 박막 두께에서 효율을 더욱 향상시키기 위한 다양한 광 포획 기술에 대한 연구가 많이 진행 되고 있다. 본 연구에서는 자외선을 이용한 nano-imprint lithography 기술을 이용하여 a-Si:H 태양전지의 유리기판 위에 pattern을 삽입하여 광 산란 효과를 향상 시키고자 하였다. 또한 유리기판의 굴절률 (n=1.5)과 투명전극의 굴절률 (n=1.9)의 중간 값을 갖는 ZnO nanoparticles (n=1.7)이 분산 된 imprinting resin을 사용함으로써 점진적으로 굴절률을 변화시켜, 최종적으로 a-Si:H 층까지의 광 투과율을 높이고자 하였다. 제작한 기판의 종류는 다음과 같다. 첫 번째 기판으로는 유리기판 위에 ZnO nanoparticles이 분산 된 imprinting resin을 spin-coating 하여 점진적인 굴절률의 변화에 의한 투과도 향상을 확인하고자 하였다. 두 번째 기판으로는 규칙적인 배열을 갖는 micro 크기의 패턴을 형성하였다. 마지막으로는 불규칙한 배열을 갖는 nano 크기와 micro 크기가 혼재 된 패턴을 형성하여 투과도 향상과 동시에 빛의 산란을 증가시키고자 하였다. 후에 이 세가지 종류를 기판으로 사용하여 a-Si:H 기반의 박막 태양전지를 제작하였다. 먼저 제작한 박막 태양전지용 기판의 광학적 전기적 특성을 분석하였다. 유리 기판 위에 형성한 패턴에 의한 roughness 변화를 확인하기 위해 atomic force microscopy (AFM)를 이용하여 시편의 표면을 측정하였다. 또한 제작한 유리 기판 위에 투명 전극층을 형성 후, 이로 인한 전기적 특성의 변화를 확인하기 위해 hall measurement system을 이용하여 sheet resistance, carrier mobility, carrier concentration 등의 특성을 측정하였다. 또한, UV-visible photospectrometer 장비를 이용하여 각 공정마다 시편의 광학적 특성(투과도, 반사도, 산란도, 흡수도 등)을 측정하였고, 최종적으로 제작한 박막 태양전지의 I-V 특성과 외부양자효율을 측정하여 태양전지의 효율 변화를 확인하였다. 그 결과 일반적인 유리에 기판에 제작된 a-Si:H 기반의 박막 태양전지에 비해, ZnO nanoparticles이 분산 된 imprinting resin을 spin-coating 하여 점진적인 굴절률 변화를 준 것만으로도 약 12%의 태양전지 효율이 증가하였다. 또한, micro 크기의 패턴과 nano-micro 크기가 혼재된 패턴을 형성한 경우 일반적인 유리를 사용한 경우에 비해 각각 27%, 36%까지 효율이 증가함을 확인하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.434-435
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• 2012

Plasma enhanced chemical vapor deposition (PECVD) silicon dioxide thin films have many applications in semiconductor manufacturing such as inter-level dielectric and gate dielectric metal oxide semiconductor field effect transistors (MOSFETs). Fundamental chemical reaction for the formation of SiO2 includes SiH4 and O2, but mixture of SiH4 and N2O is preferable because of lower hydrogen concentration in the deposited film [1]. It is also known that binding energy of N-N is higher than that of N-O, so the particle generation by molecular reaction can be reduced by reducing reactive nitrogen during the deposition process. However, nitrous oxide (N2O) gives rise to nitric oxide (NO) on reaction with oxygen atoms, which in turn reacts with ozone. NO became a greenhouse gas which is naturally occurred regulating of stratospheric ozone. In fact, it takes global warming effect about 300 times higher than carbon dioxide (CO2). Industries regard that N2O is inevitable for their device fabrication; however, it is worthwhile to develop a marginable nitrous oxide free process for university lab classes considering educational and environmental purpose. In this paper, we developed environmental friendly and material cost efficient SiO2 deposition process by substituting N2O with O2 targeting university hands-on laboratory course. Experiment was performed by two level statistical design of experiment (DOE) with three process parameters including RF power, susceptor temperature, and oxygen gas flow. Responses of interests to optimize the process were deposition rate, film uniformity, surface roughness, and electrical dielectric property. We observed some power like particle formation on wafer in some experiment, and we postulate that the thermal and electrical energy to dissociate gas molecule was relatively lower than other runs. However, we were able to find a marginable process region with less than 3% uniformity requirement in our process optimization goal. Surface roughness measured by atomic force microscopy (AFM) presented some evidence of the agglomeration of silane related particles, and the result was still satisfactory for the purpose of this research. This newly developed SiO2 deposition process is currently under verification with repeated experimental run on 4 inches wafer, and it will be adopted to Semiconductor Material and Process course offered in the Department of Electronic Engineering at Myongji University from spring semester in 2012.

• The Journal of Korean Academy of Prosthodontics
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• v.45 no.5
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• pp.675-686
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• 2007

Statement of problem: Titanium nitride(TiN) coatings are the most general and popular coating method and used to improve the properties of metallic surface for industrial purposes. When TiN coating applied to the abutment screw, frictional resistance would be reduced, as a results, the greater preload and prevention of the screw loosening could be expected. Purpose: The purpose of this study was to investigate mechanical properties of TiN coated film of various coating thickness on the titanium alloy surface and to evaluate proper coating thickness. Material and method: 95 Titanium alloy (Ti-6Al-4V) discs of 15 mm in diameter and 3 mm in thickness were prepared for TiN coating and divided into 7 groups in this study. Acceding to coating deposition time (CDT) with TiN by using Arc ion plating, were divided into 7 groups : Group A (CDT 30min), Group B (CDT 60min), Group C (CDT 90min), Group D (CDT 120min), Group E (CDT 150min), Group F(CDT 180min) and Group G (no CDT) as a control group. TiN coating surface was observed with Atomic Force Microscope(AFM), field emission scanning electron microscopy(FE-SEM) and examined with scratch tester, wear tester. Result: 1. Coating thickness fir each coated group was increased in proportion to coating deposition time. 2. Surface of all coated groups except Group A was homogeneous and smooth. However, surface of none coated Group G had scratch. 3. Adhesion strength for each coated group was increased in proportion to coating deposition time. 4. Wear resistance for each coated group was increased in proportion to coating deposition time. 5. Surface roughness in Group A, B, C was increased in proportion to coating deposition time. But, surface roughness in Group D, E, F was showed decreased tendency in proportion to coating deposition time. Conclusion: According to coating deposition time, mechanical properties of TiN coated film were changed. It was considered that 120 minutes coating deposition time ($1.32{\mu}m$ in coating thickness) is necessary.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.15 no.3
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• pp.124-127
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• 2005

It is demonstrated that the annealing process for Ti in-diffusion to z-cut $LiNbO_3$ at temperature lower than the curie temperature in a platinum (Pt) box can cause a ferroelectric micro-domain inversion at the +z surface and Li out-diffusion, therefore which should be avoided or suppressed for waveguide type periodically poled lithium niobate (PPLN) devices. The depth of the inversion layer depends on the Ti-diffusion conditions such as temperature, atmosphere, the sealing method of $LiNbO_3$ in the Pt box and crystal orientation is experimentally examined. The result shows that the polarization-inverted domain boundary appears at the only +z surface and its thickness is about $1.6{\mu}m$. Also, for the etched $LiNbO_3$, surface the domain shape was observed by the optical microscope and atomic force microscopy (AEM), and distribution of the cation concentrations in the $LiNbO_3$ crystal by the secondary ion mass spectrometry (SIMS).

• Korean Journal of Materials Research
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• v.10 no.4
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• pp.295-300
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• 2000

Uniform silicon tip arrays were fabricated using the reactive ion etching followed by the reoxidation sharpening, and the effect of Pd-coated layer on electron emission characteristics was studied. The electron emission from Si field emitter arrays(FEAs) was a little, but improved by removing surface oxide on the FEA, but pronounced drastically by coating a $100-{\AA}-thick$ Pd metal layer. The turn-on voltage in the Pd-coated Si FEAs was reduced by 30 V in comparison with that in uncoated ones. This results from the increase of surface roughness at the tip apex by the Pd coating on Si FEA, via the decrease of the apex radius at which electrons are emitting. The Pd-coated emitters showed superior operating stability over a wide current range to that of the uncoated ones. This suggests that Pd coating enhances the high temperature stability and the surface inertness Si FEA.

• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.76-76
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• 2000

최근 비정질 SiC 박막은 열과 광안정도면에서 비정질 Si 박막에 비해 우수하며 공정변수들을조절함으로써 비교적 쉽고 다양하게 광학적.전기적 특성을 얻을 수 있고, 낮은 광흡수계수 및 105($\Omega$cm)1 이상의 높은 전도도를 가지고 있어 Plasma Enhanced Chemical Vapor Deposition(PECVD)을 통해 가전자제어 (Valency electron control)가 가능한 비정질 SiC 박막이 제작된 이래 대한 많은 연구가 진행되고 있다. 결정성이 없는 비정질 물질은 상대적으로 낮은 온도에서 성장이 가능하며, 특히 glow-sidcharge 방식으로 저온에서 성장시킬 수 있음에 따라 유리등과 같은 다른 저렴한 물질을 기판으로 이용, 넓은 면적의 비정질 SiC 박막을 성장시켜 여러 분야의 소자에 응용되고 있다. 비정질 SiC 박막이 넓은 에너지띠 간격을 갖는 물질이라는 점과 화학적 안정성 및 높은 경도, 비정질성에 기인한 대면적 성장의 용이성 등의 장점이외에, 원자의 성분비 변화에 의해 에너지띠 간격(1.7~3.1eV)을 조절할 수 있다는 점은 광전소자의 응용에 큰 잠재성이 있음을 나타낸다. PECVD 방식으로 성장된 비정질 SiC 박막은 태양전지의 Window층이나 발광다이오드, 광센서, 광트랜지스터 등에 응용되어 오고 있다. 본 연구에서는, RF-PECVD(ULVAC CPD-6018) 방법에 의하여 비정질 Si1-xCx 박막을 2.73Torr의 고정된 압력에서 RF 전력(50~300W), 증착온도(150~30$0^{\circ}C$), 주입 가스량 (SiH4:CH4)등의 조건을 다양하게 변화시켜가며 증착된 막의 특성을 평가하였다. 성장된 박막을 X-ray Photoelectron Spectroscopy(XPS), UV-VIS spectrophotometer, Ellipsometry, Atomic Force Microscopy(AFM)등을 이용하여 광학적 밴드갭, 광흡수 계수, Tauc Plot, 그리고 파장대별 빛의 투과도의 변화를 분석하였으며 각 변수가 변화함에 따라 광학적 밴드갭의 변화를 정량적으로 조사함으로써 분자결합상태와 밴드갭과 광 흡수 계수간의상관관계를 규명하였고, 각 변수에 따른 표면의 조도를 확인하였다. 비정질 Si1-xCx 박막을 증착하여 특성을 분석한 결과 성장된 박막의 성장률은 Carbonfid의 증가에 따라 다른 성장특성을 보였고, Silcne(SiH4) 가스량의 감소와 함께 박막의 성장률이 둔화됨을 볼 수 있다. 또한 Silane 가스량이 적어지는 영역에서는 가스량의 감소에 의해 성장속도가 둔화됨을 볼 수 있다. 또한 Silane 가스량이 적어지는 영역에서는 가스량의 감소에 의해 성장속도가 줄어들어 성장률이 Silane가스량에 의해 지배됨을 볼 수 있다. UV-VIS spectrophotometer에 의한 비정질 SiC 박막의 투과도와 파장과의 관계에 있어 유리를 기판으로 사용했으므로 유리의투과도를 감안했으며, 유리에 대한 상대적인 비율 관계로 투과도를 나타냈었다. 또한 비저질 SiC 박막의 흡수계수는 Ellipsometry에 의해 측정된 Δ과 Ψ값을 이용하여 시뮬레이션한 결과로 비정질 SiC 박막의 두께를 이용하여 구하였다. 또한 Tauc Plot을 통해 박막의 optical band gap을 2.6~3.7eV로 조절할 수 있었다.

• Journal of the Korean Vacuum Society
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• v.9 no.3
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• pp.227-232
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• 2000

$MgTiO_3$thin films have been grown on various substrates by pulsed laser deposition (PLD) to investigate the application for microwave dielectrics and optical devices. Epitaxial $MgTiO_3$thin films were obtained on sapphire (c-plane$A1_2O_3$$MgTiO_3$thin films deposited on $SiO_2/Si$ and platinized silicon ($Pt/Ti/SiO_2/Si$) substrates were highly oriented. $MgTiO_3$thin films grown on sapphire were transparent in the visible and had a sharp absorption edge about 290 nm. These $MgTiO_3$thin films had extremely fine feature of surface morphology, i.e., rms roughness of 0.87 nm, which was examined by AFM. We have investigated the dielectric properties of the $MgTiO_3$thin films in $MIM(Pt/MgTiO_3/Pt)$ capacitors. Dielectric constant and loss of $MgTiO_3$thin films deposited by PLD were about 24 and 1.5% at 1 MHz, respectively. These $MgTiO_3$thin films also exhibited little dielectric dispersion.

• Membrane Journal
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• v.16 no.4
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• pp.294-302
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• 2006

Silver polymer electrolytes are very promising membrane materials for the separation of olefin/paraffn mixtures. Olefin molecules are known to be transported through reversible complex formation with silver ions entrapped iii polymer matrix. However, they have poor long-term stability, which is very important fur the industrial application; the selectivity through the membrane decreases gradually with time mostly due to the reduction of silver ions ($Ag^+$) into silver nanoparticles ($Ag^0$). In this study, the stability of silver polymer electrolyte was investigated for poly(vinyl pyrrolidone) (PVP) and $AgBF_4$ system containing a surfactant, i.e. $C_{18}H_{35}(OCH_2CH_2)_{20}OH$ (Brij98) as a stabilizer. The reduction behavior of silver ions to silver nanoparticles in PVP was also investigated by atomic force microscopy (AFM) and UV-visible spectroscopy. It was found that the growth of silver nanoparticles was slower and selectivity of polymer electrolyte for propylene in propylene/propane was maintained longer time when Brij98 was added as a stabilizer.

• Journal of Pharmacopuncture
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• v.27 no.1
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• pp.1-13
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• 2024

Background: Diabetic nephropathy (DN) is one of the major complications of chronic hyperglycaemia affecting normal kidney functioning. The ayurvedic medicine curcumin (CUR) is pharmaceutically accepted for its vast biological effects. Objectives: The Curcuma-derived diferuloylmethane compound CUR, loaded on Poly (lactide-co-glycolic) acid (PLGA) nanoparticles was utilized to combat DN-induced renal apoptosis by selectively targeting and modulating Bcl2. Methods: Upon in silico molecular docking and screening study CUR was selected as the core phytocompound for nanoparticle formulation. PLGA-nano-encapsulated-curcumin (NCUR) were synthesized following standard solvent displacement method. The NCUR were characterized for shape, size and other physico-chemical properties by Atomic Force Microscopy (AFM), Dynamic Light Scattering (DLS) and Fourier-Transform Infrared (FTIR) Spectroscopy studies. For in vivo validation of nephro-protective effects, Mus musculus were pre-treated with CUR at a dose of 50 mg/kg b.w. and NCUR at a dose of 25 mg/kg b.w. (dose 1), 12.5 mg/kg b.w (dose 2) followed by alloxan administration (100 mg/kg b.w) and serum glucose levels, histopathology and immunofluorescence study were conducted. Results: The in silico study revealed a strong affinity of CUR towards Bcl2 (dock score -10.94 Kcal/mol). The synthesized NCUR were of even shape, devoid of cracks and holes with mean size of ~80 nm having -7.53 mV zeta potential. Dose 1 efficiently improved serum glucose levels, tissue-specific expression of Bcl2 and reduced glomerular space and glomerular sclerosis in comparison to hyperglycaemic group. Conclusion: This study essentially validates the potential of NCUR to inhibit DN by reducing blood glucose level and mitigating glomerular apoptosis by selectively promoting Bcl2 protein expression in kidney tissue.

• Korean Journal of Optics and Photonics
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• v.18 no.5
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• pp.351-361
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• 2007

The samples composed of a GST thin film and the protective layers of $ZnS-SiO_2$ or $Al_2O_3$ coated on c-Si substrate were prepared by using the magnetron sputtering method. Samples of three different structures were prepared, that is, i) the GST single film on c-Si substrate, ii) the GST film sandwiched by the protective $ZnS-SiO_2$ layers on c-Si substrate, and iii) the GST film sandwiched by $Al_2O_3$ protective layers on c-Si substrate. The ellipsometric constants in the temperature range from room temperature to $700^{\circ}C$ were obtained by using the in-situ ellipsometer equipped with a conventional heating chamber. The measured ellipsometric constants show strong variations versus temperature. The variation of ellipsometric constants at the temperature region higher than $300^{\circ}C$ shows different behaviors as the ambient medium is changed from in air to in vacuum or the protective layers are changed from $ZnS-SiO_2$ to $Al_2O_3$. Since the long heating time of 1-2 hours is believed to be the origin of the high temperature variation of ellipsometric constants upon the heating environment and the protective layers, a PRAM (Phase-Change Random Access Memory) recorder is introduced to reduce the heating time drastically. By using the PRAM recorder, the GST samples are heated up to $700^{\circ}C$ decomposed preventing its partial evaporation or chemical reactions with adjacent protective layers. The surface image obtained by SEM and the surface micro-roughness verified by AFM also confirmed that samples prepared by the PRAM recorder have smoother surface than the samples prepared by using the conventional heater.