• Title/Summary/Keyword: Arsine

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Characteristics of Carbon and Aluminum Incorporation in AlGaAs by UHVCVD using Trimethylgallium, Trimethylalumnium, and Arsine (Trimethylgallium, Trimethylauminum과 Arsine을 사용하여 UHVCVD방법으로 성장된 AlGaAs의 탄소 및 알미늄의 유입 특성)

  • 노정래;심재기;하정숙;박성주;이일항
    • Journal of the Korean Vacuum Society
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    • v.2 no.1
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    • pp.34-40
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    • 1993
  • 새로운 단결정 박막 성장방법으로 최근에 많은 관심을 끌고 있는 초고진공 화학기상증착법(Ultra-High Vacuum Chemical Vapor Deposition)을 이용하여 AlGaAs에 에피탁시 박막을 성장시켰다. AlGaAs 에피탁시층의 성장은 2。 경사진 GaAs(100) 기판을 사용하였다. 반응 기체로는 Trimethylgallium(TMGa), Trimethylaluminum(TMAl)과 arsine을 사용하였고, 성장온도는 $580~700^{\circ}C$, 기체 압력은 10-5~10-4Torr를 유지하였다. 특히 본 연구에서는 arsine을 사전에 열분해 하는 통상의 Chemical Beam Epitaxy(CBE) 성장법과는 달리, arsine이 표면에서 분해되는 화학 반응만을 사용하여도 AlGaAs 에피탁시를 성장할 수 있음은 물론 박막내의 탄소 불순물의 농도가 크게 낮아짐을 관찰하였다. 또한 성장 온도의 변화에 따른 AlGaAs 에피탁시층의 Al 함유 과정에 대하여도 고찰하였다.

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Adsorption Reactions of Trimethylgallium and Arsine on H/Si(100)-2x1 Surface

  • Cho, Ji-Eun;Ghosh, Manik Kumer;Choi, Cheol-Ho
    • Bulletin of the Korean Chemical Society
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    • v.30 no.8
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    • pp.1805-1810
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    • 2009
  • The adsorptions of trimethygallium (TMG) and arsine (As$H_3$) on H/Si(100)-2x1 surface were theoretically investigated. In the case of TMG adsorption, methane loss reaction, surface methylation, hydrogen loss reaction and ring closing reaction channels were found. The mechanism of As$H_3$ adsorption on the surface was also identified. Among these, the methane loss reaction depositing –Ga(C$H_3)_2$ was found to be the major channel due to its low barrier height and the large exothermicity. The surface methylation reaction is the second most favorable channel. In contrast, arsine turned out to be less reactive on the surface, implying that Arsine surface reaction would be the rate limiting step in the overall ALD process.

Arsenic Poisoning (비소 중독)

  • Kim Yang Ho;Lee Ji Ho;Sim Chang Sun;Jeong Kyoung Sook
    • Journal of The Korean Society of Clinical Toxicology
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    • v.2 no.2
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    • pp.67-71
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    • 2004
  • Arsenic poisoning has three types of poisoning. First, acute arsenic poisoning is usually caused by oral intake of large amount of arsenic compound with purpose of homicide or suicide. Second, chronic arsenic poisoning is caused by inhalation of arsenic in the occupational setting or by long-term oral intake of arsenic-contaminated well water. Third, arsine poisoning occurs acutely when impurities of arsenic in non-ferrous metal react with acid. Clinical manifestation of acute arsenic poisoning is mainly gastrointestinal symptoms and cardiovascular collapse. Those of chronic poisoning are skin disorder and cancer. Arsine poisoning shows massive intravascular hemolysis and hemoglobinuria with acute renal failure. Exposure evaluation is done by analysis of arsenic in urine, blood, hair and nail. Species analysis of arsenic is very important to evaluate inorganic arsenic acid and mono methyl arsenic acid (MMA) separated from dimethyl arsenic acid (DMA) and trimethyl arsenic acid (TMA) which originate from sea weed and sea food. Treatment with dimercaprol (BAL) is effective in acute arsenic poisoning only.

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Determination of Arsenic in Human Scalp Hair by Hydride Generation-Inductively Coupled Plasma Spectrometry (수소화물 생성-유도 결합 플라즈마 분광법에 의한 머리카락 중 비소의 분석)

  • Park, Hyung-Shin;Kim, Sun-Tae;Jin, Hyoun-Chul;Ryoo, Si-Saeng;Choi, Beom-Suk
    • Analytical Science and Technology
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    • v.5 no.1
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    • pp.51-56
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    • 1992
  • A method to determine the trace level of arsenic in scalp hair by the hydride generation(HG)-inductively coupled plasma(ICP) spectrometry is described. The optimum conditions for the generation of arsine($AsH_3$), and the interference effects from the concomitant ions were studied. Severe interference effect from Ni(II) is circumvented by the coprecipitation of arsenic with $La(OH)_3$. The detection limit of arsenic is 0.3ppm and the arsenic contents in scalp hair ranged 10~20ppb.

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Quantitative Exposure Assessment of Various Chemical Substances in a Wafer Fabrication Industry Facility

  • Park, Hyun-Hee;Jang, Jae-Kil;Shin, Jung-Ah
    • Safety and Health at Work
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    • v.2 no.1
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    • pp.39-51
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    • 2011
  • Objectives: This study was designed to evaluate exposure levels of various chemicals used in wafer fabrication product lines in the semiconductor industry where work-related leukemia has occurred. Methods: The research focused on 9 representative wafer fabrication bays among a total of 25 bays in a semiconductor product line. We monitored the chemical substances categorized as human carcinogens with respect to leukemia as well as harmful chemicals used in the bays and substances with hematologic and reproductive toxicities to evaluate the overall health effect for semiconductor industry workers. With respect to monitoring, active and passive sampling techniques were introduced. Eight-hour long-term and 15-minute short-term sampling was conducted for the area as well as on personal samples. Results: The results of the measurements for each substance showed that benzene, toluene, xylene, n-butyl acetate, 2-methoxy-ethanol, 2-heptanone, ethylene glycol, sulfuric acid, and phosphoric acid were non-detectable (ND) in all samples. Arsine was either "ND" or it existed only in trace form in the bay air. The maximum exposure concentration of fluorides was approximately 0.17% of the Korea occupational exposure limits, with hydrofluoric acid at about 0.2%, hydrochloric acid 0.06%, nitric acid 0.05%, isopropyl alcohol 0.4%, and phosphine at about 2%. The maximum exposure concentration of propylene glycol monomethyl ether acetate (PGMEA) was 0.0870 ppm, representing only 0.1% or less than the American Industrial Hygiene Association recommended standard (100 ppm). Conclusion: Benzene, a known human carcinogen for leukemia, and arsine, a hematologic toxin, were not detected in wafer fabrication sites in this study. Among reproductive toxic substances, n-butyl acetate was not detected, but fluorides and PGMEA existed in small amounts in the air. This investigation was focused on the air-borne chemical concentrations only in regular working conditions. Unconditional exposures during spills and/or maintenance tasks and by-product chemicals were not included. Supplementary studies might be required.

Growth of GaAs by Chemical Beam Epitaxy Using Unprecracked Arsine and Trimethylgallium

  • Park, Seong-Ju;Ro, Jeong-Rae;Sim, Jae-Ki;Lee, El-Hang
    • ETRI Journal
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    • v.16 no.3
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    • pp.1-10
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    • 1994
  • Undoped GaAs has been successfully grown by chemical beam epitaxy (CBE) via surface decomposition process using arsine $(AsH_3)$ and trimethylgallium (TMG). Three distinct regions of temperature-dependent growth rates were identified in the range of temperatures from 570 to $690^{\circ}C$. The growth rates were found strongly dependent on the V/III ratio between 5 and 30. The growth rate at low V/III ratio seems to be determined by arsenic produced on the surface, whereas at high V/III ratio it shows dependence on the adsorption of TMG. Hall measurement and photoluminescence (PL) analysis show that the films are all p-type and that carbon impurities are primarily responsible for the background doping. Carbon concentrations have been found to be reduced by two orders of magnitude as compared to those of epilayers grown by CBE which employs TMG and arsenic obtained from precracked $AsH_3$ in a high temperature cell. It was also found that hydrogen atoms dissociated from unprecracked $AsH_3$ play an important role in removing hydrocarbon-containing species resulting in a significant reduction of car-bon impurities.

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Periodic Arsine Interruption에 의한 균일한 InAs 양자점 성장

  • Yun, Ui-Jun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.57-57
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    • 2011
  • 저차원 나노구조인 자발형성 양자점은 그 우수한 전기적, 광학적 특성으로 많은 주목을 받고 있다. 이미 양자점을 이용한 소자들의 우수성이 입증이 되고 있다. 그러나 양자점의 형성은 단결정 기판 위에서 Stranski-Krastanow 성장 방법을 통해 일어나기 때문에 성장표면에 존재하는 표면 계단구조 등의 국부적인 표면 불균일성에 의해서 모두 동시에 형성되는 것은 아니다. 표면 핵생성의 시간차에 의해 양자점의 크기 불균일성이 나타나게 되며 이는 양자점의 우수성을 저해하는 요인이 된다. 특히, 비정상적으로 크게 성장된 양자점은 내부에 전위 등의 결정결함을 내포하게 되고, 양자점의 우수한 광특성을 손상시키는 주 요인이 된다. 양자점의 우수한 광특성을 소자로 응용하기 위해서는 이러한 비정상적으로 큰 양자점이 없으면서 균일한 양자점을 성장하는 것이 매우 필요하다. 본 발표에서는 그 동안 본 연구실에서 제안한 새로운 양자점 성장 방법에 대한 소개를 하고자 한다. 유기화학금속화학성장(Metal Organic Chemical Vapor Deposition) 도중에 V족 소스가스인 $AsH_3$의 주입을 주기적으로 끊어 주는 새로운 성장 방법(Periodic Arsine Interruption; PAI)을 제안하였다. 이 방법을 통해서 비정상적으로 형성되는 큰 양자점을 완전히 제거할 수 있었다. $AsH_3$을 끊어주는 시간 동안에 표면에서 As의 탈착을 유도하여 표면을 In-rich 쪽으로 유도하였고, 이렇게 함으로써 성장 표면에너지를 높은 쪽으로 바꾸어 줌으로써 핵생성을 위한 표면 roughening이 시작되는 것을 억제하였다. 이렇게 함으로써 미리 핵생성이 되어 비정상적으로 크게 성장하는 양자점으로 억제하면서 거의 동시에 모든 양자점이 핵생성되게 유도하였다. $AsH_3$의 주입 방법의 변화에 따른 양자점의 형성 거동을 연구함으로써 PAI 의 메카니즘을 이해할 수 있었다.

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