• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.05a
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• pp.71-73
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• 2006

This research aims to develop a multiple channel electrochemical DNA chip using micro- fabrication technology. At first, we fabricated a high integrated type DNA chip array by lithography technology. Several probe DNAs consisting of thiol group at their 5-end were immobilized on the gold electrodes. Then target DNAs were hybridized by an electrical force. Redox peak of cyclic-voltammogram showed a difference between target DNA and mismatched DNA in the anodic peak current. Therefore. it is able to detect a various genes electrochemically after immobilization of a various probe DNA and hybridization of label-free DNA on the electrodes simultaneously. It suggested that this DNA chip could recognize the sequence specific genes.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.19-21
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• 2005

The ball shea. tests for ball grid array (BGA) and flip chip packages were carried out with different displacement rates to find out the optimum condition of the displacement rate for this test. The BGA packages consisted of two different kinds of solder balls (eutectic Sn-37wt.%Pb and Sn-3.5wt.%Ag) and electroplated Au/Ni/Cu substrate, whereas the flip chip package consisted of electroplated Sn-37Pb solder and Cu UBM. The packages were reflowed up to 10 times, or aged at 443 K up to 21 days. The variation of the displacement rate resulted in the variations of the shear properties such as shear force, displacement rate at break, fracture mode and strain rate sensitivity. The increase in the displacement rate led to the increase of the shear force and brittleness of solder joints.

• ETRI Journal
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• v.29 no.1
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• pp.59-69
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• 2007

We designed and fabricated a vision chip for edge detection with a $160{\times}120$ pixel array by using 0.35 ${\mu}m$ standard complementary metal-oxide-semiconductor (CMOS) technology. The designed vision chip is based on a retinal structure with a resistive network to improve the speed of operation. To improve the quality of final edge images, we applied a saturating resistive circuit to the resistive network. The light-adaptation mechanism of the edge detection circuit was quantitatively analyzed using a simple model of the saturating resistive element. To verify improvement, we compared the simulation results of the proposed circuit to the results of previous circuits.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.602-605
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• 2000

Recently, a study of intellectual smell recognition system is applied for the various fields such as control of food processing and survey of decay. A basic gas recognition system was implemented gases using four metal oxides semiconductor sensors as inputs. A CPLD chip of twenty thousand gates level was used for this purpose. The CPLD chip was designed and the availability of the one chip smell recognition system was tested.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1319-1321
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• 2006

This research aims to develop the multiple channel electrochemical DNA chip that has the above characteristic and be able to solve the problems. At first, we fabricated a high integration type DNA chip array by lithography technology. It is able to detect a plural genes electrochemically after immobilization of a plural probe DNA and hybridization of non-labeling target DNA on the electrodes simultaneously. It suggested that this DNA chip could recognize the sequence specific genes. It suggested that multichannel electrochemical DNA microarray is useful to develop a portable device for clinical gene diagnostic system.

• Proceedings of the Korean Information Science Society Conference
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• 2000.04a
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• pp.36-38
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• 2000

An optoelectronic database filter chip for high performance database computers and applications is proposed. The proposed device is designed to perform the selection and projection operations of relational database operation on-the-fly in page-parallel manner to increase the overall performance of a database system. The device utilizes CMOS smart pixel array consists of detector and combinational logic circuit to perform the selection and projection operation.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.10
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• pp.2059-2063
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• 2009

This paper presents a programmable System-On-a-chip (SoC) for various embedded smart applications that need Neural Network computations. The system is fully implemented into a prototyping platform based on Field Programmable Gate Array (FPGA). The SoC consists of an embedded processor core and a reconfigurable hardware accelerator for neural computations. The performance of the SoC is evaluated using a real image processing application, an optical character recognition (OCR) system.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.149-154
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• 2018

This paper describes the fabrication and heat transfer property of 50 watts rated LED array module where multiple chips are mounted on chip-on-board type ceramic-metal hybrid substrate with high heat dissipation property for high power street and anti-explosive lighting system. The high heat transfer ceramic-metal hybrid substrate was fabricated by conformal coating of thick film glass-ceramic and silver pastes to form insulation and conductor layers, using thick film screen printing method on top of the high thermal conductivity aluminum alloy heat-spreading panel, then co-fired at $515^{\circ}C$. A comparative LED array module with the same configuration using epoxy resin based FR-4 PCB with thermalvia type was also fabricated, then the thermal properties were measured with multichannel temperature sensors and thermal resistance measuring system. As a result, the thermal resistance of the ceramic-metal hybrid substrate in the $4{\times}9$ type LEDs array module exhibited about one third to the value as that of FR-4 substrate, implying that at least triple performance of heat transfer property as that of FR-4 substrate was realized.

• Proceedings of the IEEK Conference
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• 2002.07b
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• pp.767-769
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• 2002

A novel RE configurable device composed by bare-chip, bumps and board are proposed. We call this "Field-Programmable RF Gate Array (FPRA)," This device, a kind of programmable system packages, has a potential to be applied to wireless communication terminals such as software-defined radio.

• Journal of information and communication convergence engineering
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• v.13 no.2
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• pp.81-85
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• 2015

A 94-GHz phased array antenna using a log-periodic antenna has been developed on a GaAs substrate. The developed phased array antenna comprises four log-periodic antennas, a phase shifter, and a Wilkinson power divider. This antenna was fabricated using the standard microwave monolithic integrated circuit (MMIC) process including an air bridge for unipolar circuit implementations on the same GaAs substrate. The total chip size of the fabricated phased array antenna is 4.8 mm × 4.5 mm. Measurement results showed that the fabricated phased array antenna had a very wide band performance from 80 GHz to 110 GHz with return loss characteristics better than -10 dB. In the center frequency of 94 GHz, the fabricated phased array antenna showed a return loss of -16 dB and a gain of 4.43 dBi. The developed antenna is expected to be widely applied in many applications at W-band frequency.