• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
• /
• pp.139.2-139.2
• /
• 2013

6" Multi-crystal Silicon wafer has etched suing a remote - type RF Dielectric barrier discharge (RF DBD) at atmospheric pressure. DBD source is composed of Al electrode and coated Al2O3 dielectric as function of Ar/NF3 gas combination and input power used 13.56 MHz power supply. Ar gas flow rate is changed from 2 to 10 Slm, and NF3 flow rate is changed from 0.2~1 slm. At the result, NF3 flow rate Si etching rate also increase whit the increasing of NF3 flow rate But at 2 slm etching rate was decrease. In this experience, Max etching rate is 2.3 ${\mu}m/min$ when the scan time is 45 sec.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
• /
• pp.31-36
• /
• 2003

We investigated dry etching of GaAs and AlGaAs in a high density planar inductively coupled plasma system with $BCl_3$ and $BCl_3/Ar$ gas chemistry. A detailed process study as a function of ICP source power, RIE chuck power and $BCl_3/Ar$ mixing ratio was performed. At this time, chamber pressure was fixed at 7.5 mTorr. The ICP source power and RIE chuck power were varied from 0 to 500 W and from 0 to 150 W, respectively. GaAs etch rate increased with the increase of ICP source power and RE chuck power. It was also found that etch rate of GaAs in $BCl_3$ gas with 25% Ar addition was superior to that of GaAs in a pure $BCl_3$ (20 sccm $BCl_3$) plasma. The result was same with AlGaAs. We expect that high ion-assisted effect in $BCl_3$/Ar plasma increased etch rates of both materials. The GaAs and AIGaAs features etched at 20 sccm $BCl_3$ and $15BCl_3/5Ar$ with 300 W ICP source power, 100 W RIE chuck power and 7.5 mTorr showed very smooth surfaces(RMS roughness < 2 nm) and excellent sidewall. XPS study on the surfaces of processed GaAs also proved extremely clean surfaces of the materials after dry etching.

• 한국세라믹학회지
• /
• 제35권12호
• /
• pp.1336-1336
• /
• 1998

2단계 열탄소환원법으로 탄화규소 휘스커를 Ar과 H2분위기에서 기상-고상, 2단계, 기상-액상-고상 성장기구를 통해 각각 합성하였다. Ar분위기에서 탄화규소 휘스커는 다음과 같은 반응기구로 성장하였다. SiO2(S)+C(s)-SiO(v)+CO(v) SiO(v)3CO(v)=SiC(s)whisker+2CO2(v) 2C(s)+2CO2(v)=4CO(v) 이때 전체 반응속도는 세번째 반응에 참여하는 탄소에 의해 지배되었다. 따라서 이 반응이 휘스커 합성의 율속반응으로 판단되었다. 한편 H2 분위기에서 탄화규소 휘스커는 다음과 같은 반응기구로 성장하였다.SiO2(s)+C(s)=SiO(v)+CO(v) 2C(s)+4H2(v)=2CH4(v) SiO(v)+2CH4(v)=SiC(s)whisker+CO(v)+4H2(v) 이때 전체 반응속도는 SiO(v) 기체의발생 속도에 의해 지배되었다. 따라서 첫번째 반응이 휘스커 합성의 율속 반응인 것으로 판단되었다.

• 반도체디스플레이기술학회지
• /
• 제20권4호
• /
• pp.72-77
• /
• 2021

The radial distribution of etch rate was analyzed using the ion energy flux model in VHF-CCP. In order to exclude the effects of polymer passivation and F radical depletion on the etching. The experiment was performed in Ar/SF6 plasma with an SF6 molar ratio of 80% of operating pressure 10 and 20 mTorr. The radial distribution of Ar/SF6 plasma was diagnosed with RF compensated Langmuir Probe(cLP) and Retarding Field Energy Analyzer(RFEA). The radial distribution of ion energy flux was calculated with Bohm current times the sheath voltage which is determined by the potential difference between the plasma space potential (measured by cLP) and the surface floating potential (by RFEA). To analyze the etch rate uniformity, Si coupon samples were etched under the same condition. The ion energy flux and the etch rate show a close correlation of more than 0.94 of R² value. It means that the etch rate distribution is explained by the ion energy flux.

• 분석과학
• /
• 제30권2호
• /
• pp.82-88
• /
• 2017

Adenophorae Radix (AR) is a frequently used medicinal herb; because of its popularity, products containing similar herbal products are often sold as substitutes, especially if their morphology is similar. However, any analytical method to identify AR based on quantitative analysis is not registered in Korea, Japan and China Pharmacopoeias. This study developed a simple HPLC method to discriminate between authentic AR and substitutes. Linoleic acid was used as a marker compound of AR. Our optimized HPLC-UV conditions included a mobile phase of 90 % acetonitrile under isocratic condition, and a flow rate of 1.0 mL/min at room temperature. Detection wavelength was set at 205 nm. Linoleic acid was detected at 13.5 minutes for a total analysis time of 20 minutes. The standard herb of AR contained 0.025 % of linoleic acid, while four authentic AR samples and eight substitutes contained 0.040~0.071 % and 0.004~0.014 %, respectively. Comparison of the linoleic acid concentrations of the sample types to reference AR showed that among 12 samples, only the four samples were authentic. Thus, our HPLC-UV method, along with our suggested content criterion for linoleic acid concentration, can be used for the quick and accurate determination whether the herbal products are authentic AR or substitute.

• 한국전기전자재료학회논문지
• /
• 제15권7호
• /
• pp.570-575
• /
• 2002

$SrBi_2Ta_2O_9$ thin films were etched in $Cl_2/CF_4/Ar$ inductively coupled plasma (ICP). The maximum etch rate was 1300 ${\AA}/min$ at 900 W ICP power in Cl$_2$(20%)/$CF_4$(20%)/Ar(60%). As RF source power increased, radicals (F, Cl) and ion ($Ar^+$) increased. The influence of plasma induced damage during etching process was investigated in terms of P-E hysteresis loops, chemical states on the surface, surface morphology and phase of X-ray diffraction. The chemical states on the etched surface were investigated with X-ray spectroscopy and secondary ion mass spectrometry. After annealing $700^{\circ}C$ for 1 h in $O_2$ atmosphere, the decreased P-E hysteresises of the etched SBT thin films in Ar and $Cl_2/CF_4/Ar$ plasma were recovered.

• 한국주조공학회지
• /
• 제6권4호
• /
• pp.284-289
• /
• 1986

Decarburization phenomena have been studied by plasma in stainless steel, plain carbon steel and cast iron. It was also investigated the movement of impurity element P,S in the plasma jet metal pool. The plasma jet was obtained by $Ar\;-\;CO_2$ gas mixture with 5 kVA DC power source. It produced enough temperature to dissociate into activated oxygen atom by reaction of $CO_2{\leftrightarrows}CO+O^+$ and it reacted with ${\underline{C}}$ in metal pool. Decarburization rate was increased about 5 times in comparing with the conventional induction melted metal pool by $CO_2$ gas decarburization. Even under the Ar plasma jet, decarburization was obtained by agitation of metal bath by $Ar^+$ bombardment and dilution phenomena of carbon atom under the very high plasma temperature. But heavy element P and S are not much removed because they are too heavy in mass to be activated by $Ar^+$ion bombardment. Desulphurization was achieved by $Ar\;-\;CO_2$ plasma in plain carbon steel and cast iron by the reaction of $SO_2({\underline{S}}+O^+)$. But dephosphorization could not be obtained by $Ar\;-\;CO_2$ plasma, because gaseous reaction of phosphorous oxide (${\underline{P}}+O^+$) was not existed.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
• /
• pp.232-232
• /
• 2011

투명전도산화물에 대한 연구가 많이 이루어지고 있으며, 최근 Ga이 도핑된 ZnO의 연구가 많이 되고 있다. 투명전도산화물은 태양전지, 평면디스플레이와 같은 다양한 분야에 응용이 가능하다. 본 연구에서는 RF magnetron sputtering을 이용하여 Ar gas 유량 변화에 따른 GZO 박막을 연구하였다. 기판으로는 유리기판을 사용하였으며, 전기적, 광학적, 구조적인 특성을 조사하였다. 박막의 증착시 초기 압력은 $2.0{\times}10^{-6}$Torr 이하로 하였으며, 증착온도는 상온으로 고정하여 증착하였다. 기판은 Corning 1737 유리 기판을 사용하였고, GZO 타겟은 ZnO : Ga 분말이 각각 97 : 3 wt.%로 소결된 타겟을 사용하였다. Ar 유량변수는 20, 40, 60, 80 sccm으로 변화를 주었다. 유리기판에 증착된 모든 GZO박막은 약 200 nm의 두께로 증착되었으며 모든 GZO 박막에서 85%이상의 투과율을 나타내었다. Ar 유량이 적을수록 투과율을 증가하였으며, 광학적 밴드갭 또한 증가하였다. 공정별로 제작된 모든 GZO박막에서 (002)면의 배향성이 관찰되었고, Ar 유량이 적을수록 박막의 결정성은 향상되었다. Hall 측정 결과 Ar 유량이 20 sccm일 때 전기비저항 $3.46{\times}10^{-3}{\Omega}cm$, 전하의 농도 $3.832{\times}10^{-20}\;cm^{-3}$, 이동도 $4.7cm^2V^{-1}s^{-1}$로 전극으로서의 특성을 나타내었다. GZO 박막의 경우 Ar 유량이 적었을 때 결정성이 높아지고, 전극 특성이 더 우수한 것을 확인할 수 있었다.

• 한국전기전자재료학회논문지
• /
• 제13권3호
• /
• pp.183-187
• /
• 2000

In this study the SrBi$_2$Ta$_2$$O_{9}$ (SBT) thin films were etched by using magnetically enhanced inductively coupled Ar/CHF$_3$plasma as function of CHF$_3$/(Ar+CHF$_3$)gas mixing ratio. Maximum etch rate of SBT thin films was 1650 $\AA$/min and the selectivities of SBT to Pt and photoresist(PR) were 1.35 and 0.94 respectively under CHF$_3$/(Ar+CHF$_3$) of 0.1 For study on etching mechanism of SBT thin film X-ray photoelectron spectroscopy (XPS) surface analyses and secondary ion mass spectrometry (SIMS) mass analysis of etched SBT surfaces were performed. Among the elements of SBT thin film. M(Sr, Bi, Ta)-O bonds are broken by Ar ion bombardment and form SrF and TaF$_2$by chemical reaction with F. SrF and TaF$_2$are removed more easily by Ar ion bombardment. Scanning electron microscopy(SEM) was used for the profile examination of etched SBT film and the cross-sectional SEM profile of etched SBT film under CHF$_3$(Ar+CHF$_3$) of 0.1 was about 85$^{\circ}$X>.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2000년도 추계학술대회 논문집
• /
• pp.363-366
• /
• 2000

In this study, SrBi$_2$Ta$_2$$O_{9}$ (SBT) thin films were etched at different Cl$_2$gas mixing ratio in Cl$_2$/Ar. The maximum etch rate of SBT was 883 $\AA$/min in Cl$_2$(20%)/Ar(80%). The result indicates that physical sputtering of charged particles is dominant to chemical reaction in etching SBT thin films. To evaluate the changes of morphology and crystallinity on the near surface of etched SBT, atomic force microscopy (AFM) and x-ray diffraction (XRD) were used. The rms values of etched samples in Ar only or Cl$_2$ only plasma were higher than that of as-deposited, Cl$_2$/Ar Plasma. The SBT (105) crystalinity of the etched samples decreased in Af only or Cla only plasma, but maintain constant in ClyAr plasma. This can be illustrated by a decrease of Bi content or nonvolatile etching products (Sr-Cl and Ta-Cl), resulting in the changes of stoichiometry on the etched surface of the SBT thin films. The decrease of Bi content and nonvolatile etch products were revealed by x-ray photoelectron spectroscopy (XPS) and secondary ion mass spectrometry (SIMS).).