• 한국레이저가공학회지
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• 제4권2호
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• pp.1-12
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• 2001

This study has been performed to evaluate basic characteristics of CW-CO$_2$ laser welding process of A5083 and A7N01 Al alloy. The effect of welding parameters, such as shielding gas, gas flow rate, laser power and welding speed on the bead shape and porosity from bead on plate welding tests have been investigated. Welds shielded by He gas had deeper penetration and better bead shape than those shielded by Ar. The penetration depth was augmented with the increase of laser Power and the decrease of welding speed. Welds of A7N01 alloy had deeper penetration than those of A5083 alloy In beads of A5083 alloy which has deeper penetration, the volume fraction of porosities was high due to the number of its was few, but size of its was larger. The case of deeper penetration beads of A7N01 alloy, the porosity reduced under relatively higher power The Volume fraction of porosities in weld of A5083 alloy was significantly higher than that in weld of A7N01 alloy.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2000년도 제18회 학술발표회 논문개요집
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• pp.213-213
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• 2000

Direct laser vaporization of transition-metal(Co, Ni)/graphite composite pellet produced single wall carbon naotubes(SWNT) in the condensing vapor in a heated flow cylinder-type tube furnace, Transition metal/graphite composite pellet target was made by mixing graphite, Co, and Ni in 98:1:1 atomic weight ratios, pressing the mixed powder, and curing it. The target was placed in a tube furnace maintained at 1200$^{\circ}C$ and Ar inert collision gas continuously flowed into the tube. The 2nd harmonic, 532nm wavelength light from Nd-YAG laser was used to vaporize the tube. The carbon nanotubes produced by the laser vaporization were accumulated on quartz tube wall. The raw carbon nanotube materials were purified with surfactants(Triton X-100) in a ultrasonicator. These carbon nanotubes were analyzed using SEM, XRD, and Raman spectroscopic method. The carbon nanotube growth on the Ni-patterned Si substrate was investigated by the CVD process. Transition-metal, Ni and CH4 gas were used as a catalyst and a reactant gas, respectively. The structure and the phonon frequencies of the carbon nanotubes formed on the patterned Si substrate were measured by SEM and Raman spectrometer.

• 한국자기학회지
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• 제5권1호
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• pp.42-47
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• 1995

자기 유도 헤드용 FeN 박막을 RF diode reactive 스퍼터 방법으로 Corning 7059 유리 기판 위에 증착하여 그 자기적 특성을 측정하였다. FeN 박막의 자기적 특성은 박막 두께, 가스 압력, 스퍼터 파워, $N_{2}$와 Ar의 유량비에 큰 영향을 받았다. 스퍼터 파워 800 W, 가스 압력 3 mT, 질소와 아르곤의 유량비 6.6 : 100, 단층 박막의 두께를 $1,000\;{\AA}$에서 $6,000\;{\AA}$으로 변화시키며 보자력의 변화를 측정 하였다. 두께가 $30\;{\AA}$인 $SiO_{2}$ 층을 사이층으로 하여 전체 박막 두께를 $6,000\;{\AA}$으로 고정하고 7층까지 증착한 시편의 보자력과 포화 자화값을 측정하였다. 단층 박막 두께에 따른 자화용이 방향의 보자력은 두께가 증가할수록 감소하였으며 $3,000\;{\AA}$ 이상에서는 거의 변화가 없었다. FeN 다층 박막의 경우 층수가 증가함에 따라 보자력은 감소하였다. X 선 회절 선폭으로 부터 결정립의 크기를 계산한 결과 층수가 증가할수록 결정립의 크기가 $200\;{\AA}$에서 $120\;{\AA}$으로 점차 감소하였다. 최소 보자 력은 4층 박막에서 자화 곤란 방향으로 0.4 Oe을 얻었다. 투자율 측정 결과 최대 상대 투자율은 2,900이었으며, 이들 박막의 차단 주파수는 100 MHz 이상이었다.

• 마이크로전자및패키징학회지
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• 제8권3호
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• pp.49-53
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• 2001

유도결합형 플라즈마 (ICP-RIE) 장치를 이용하여 SBT ($SrBi_2Ta_2O_9$)/Si의 수직식각 실험을 하였다. 이와 같은 실험의 목적은 수직 단면구조의 강유전체 gate구조 및 capacitor 제조에 있어서 유효면적을 확보하고 parasitic effect를 최소화 하는 기술이 우수한 소자 특성을 얻기 위해 매우 중요한 기술이기 때문이다. $Ar/C1_2$를 반응가스로 사용하였으며 $Ar/C1_2$유량비를 각각 1, 0.8, 0.6, 0.4로 바꾸어 가면서 각 유량비에 대해 RF power를 700, 600, 500W로 변화시키는 동안 DC power를 각각 200, 150, 100, 50 W로 변화시키면서 식각 실험을 하였다. 식각조건 변화에 따른 수직 및 수평 식각율, 선택식각율, 감광막의 보호성, 리소그라피 조건에 따른 식각율 및 식각단면 구조의 특성, 식각율 변화에 따른 패턴 크기의 변화, SBT의 식각 단면 특성 등을 조사하였다. $Ar/C1_2$유량비가 0.8, RF power 700 W, DC power 200 W 일 때 식각속도는 1050 A/min으로 최적의 식각율을 확인하였다. 그리고 주사전자현미경의 관찰 결과 수 적도는 $82^{\circ}C$ 정도로 매우 양호함을 알 수 있었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.210.2-210.2
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• 2016

An inductively coupled plasma source was prepared for the deposition of a-C:H thin film. Properties of the inductively coupled plasma source are investigated by fluid simulation including Navier-Stokes equations and home-made tuned single Langmuir probe. Signal attenuation ratios of the Langmuir probe harmonic frequency were 13.56Mhz and 27.12Mhz. Dependencies of plasma parameters on process parameters were accord with simulation results. Ar/CH4 plasma simulation results shown that hydrocarbon radical densities have their lowest value at the vicinity of gas feeding line due to high flow velocity. For input power density of 0.07W/cm3, CH radical density qualitatively follows electron density distribution. On the other hand, central region of the chamber become deficient in CH3 radical due to high dissociation rate accompanied with high electron density. The result suggest that optimization of discharge power is important for controlling deposition film quality in high density plasma sources.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 제4회 영호남학술대회 논문집
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• pp.138-141
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• 2002

The channel of the superconducting Flux Flow Transistor has been fabricated with plasma etching method using ICP. The ICP conditions were 700 W of ICP power, 150 W of rf chuck power, 5 mTorr of the pressure in chamber and 1:1 of Ar : $Cl_2$, respectively. The channel etched by plasma gas showed superconducting characteristics of over 77 K and superior surface morphology. The critical current of SFFT was altered by varying the external applied current. As the external applied current increased from 0 to 12 mA, the critical current decreased from 28 to 22 mA. Then the obtained $r_m$ values were smaller than $0.1\Omega$ at a bias current of 40 mA. The current gain was about 0.5. Output resistance was below $0.2\Omega$.

• 한국전기전자재료학회논문지
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• 제20권4호
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• pp.318-324
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• 2007

We report on a strong violet luminescence emitted from the ZnO:Al films grown on glass substrate by radio-frequency magnetron sputtering. The growth of high-quality thin films and their optical properties are controlled by adjusting the mixture ratio of Ar and $O_2$, which is used as the sputtering gas. The crystallinity of the films is improved as the oxygen flow ratio is decreased, as evidenced in both x-ray diffractometer and atomic force microscope measurements. As for the violet luminescence measured by photoluminescence (PL) spectroscopy, the peak energy and intensity of the PL signal are decreased with increasing the oxygen flow ratio. The peak energy of the violet PL spectrum for the thin film with an oxygen flow ratio of 50 % is almost constant, regardless of the increase of laser Power and temperature. These results indicate that the violet PL signal is probably due to defects related to interstitial Zn atoms.

• 한국표면공학회지
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• 제27권5호
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• pp.253-260
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• 1994

Ta-N films were reactively sputter deposited by dc magnetron sputtering from a Ta target with a various Ar-N, gas ratio. Electrical resistivity of pure Ta film was 150$\mu$$\Omega$cm and decreased initially with nitrogen addition, and then increased to a value of 220$\mu$$\Omega$-cm~260$\mu$$\Omega$-cm at 9%~23% nitrogen partial flow. Rutherford backscattering spectrometry(RBS) and Auger electron spectroscopy (AES) analysis show that nitrogen content in the film is increased with the nitrogen partial flow. The film contains 58at.% nitrogen at 36% nitrogen partial flow. Both the phase and the microstructure of the as-deposisted films were investigated by x-ray diffractometry(XRD) adn transmission electron microscopy (TEM) at various nitrogen content. The phase of pure Ta film is identified as $\beta$-Ta with a 200$\AA$~300$\AA$ grain size. The phase of Ta film is changed to bcc-Ta as small amount of nitrogen is added. Crystalline Ta2N film was deposited at 24at.% nitrogen content. Amorphous phase is formed over a range of nitrogen content from about 33at.% to 35at.% while crystalline fcc-TaN is observed to form at 39at.%~48at.% nitrogen content.

• Progress in Superconductivity
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• 제7권2호
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• pp.130-134
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• 2006

Buffer layers such as $CeO_2\;and\;Yb_2O_3$ films for YBCO coated conductors were deposited on (100) $SrTiO_3$ single crystals and (100) textured Ni substrates by a metal organic chemical vapor deposition (MOCVD) system of the hot-wall type. The substrates were moved with the velocity of 40 cm/hr. Source flow rate, $Ar/O_2$ flow rate and deposition temperature were main processing variables. The degree of film epitaxy and surface morphology were investigated using XRD and SEM, respectively. On a STO substrate, the $CeO_2$ film was well grown epitaxially above the deposition temperature of $450^{\circ}C$. However, on a Ni substrate, the XRD showed NiO (111) and (200) peaks due to Ni oxidation as well as (111) and (200) film growth. For the films deposited with $O_2$ gas as oxygen source, it was found that the NiO film was formed at the interface between the buffer layer and the Ni substrate. The NiO layer interrupts the epitaxial growth of the buffer layer. It seems that the epitaxial growth of the buffer layer on Ni metal substrates using $O_2$ gas is difficult. We are considering a new method avoiding Ni oxidation with $H_2O$ vapor instead of $O_2$ gas.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1999년도 제17회 학술발표회 논문개요집
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• pp.216-216
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• 1999

The usage of a stationary plasma thruster (SPT) ion source, invented previously for space application in Russia, in experiments with surface modifications and film deposition systems is reported here. Plasma in the SPT is formed and accelerated in electric discharge taking place in the crossed axial electric and radial magnetic fields. Brief description of the construction of specific model of SPT used in the experiments is presented. With gas flow rate 39ml/min, ion current distributions at several distances from the source are obtained. These was equal to 1~3 mA/$\textrm{cm}^2$ within an ion beam ejection angle of $\pm$20$^{\circ}$with discharge voltage 160V for Ar as a working gas. Such an extremely high ion current density allows us to obtain the Ti metal films with deposition rate of $\AA$/sec by sputtering of Ti target. It is shown a possibility of using of reactive gases in SPT (O2 and N2) along with high purity inert gases used for cathode to prevent the latter contamination. It is shown the SPT can be operated at the discharge and accelerating boltages up to 600V. The results of presented experiments show high promises of the SPT in sputtering and surface modification systems for deposition of oxide thin films on Si or polymer substrates for semiconductor devices, optical coatings and metal corrosion barrier layers. Also, we have been tried to establish in application of the modeling expertise gained in electric and ionic propulsion to permit numerical simulation of additional processing systems. In this mechanism, it will be compared with conventional DC sputtering for film microstructure, chemical composition and crystallographic considerations.