• Title/Summary/Keyword: Application Module

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ASTRONAUT'S EARTH OBSERVATION ON THE INTERNATIONAL SPACE STSTION

  • Lee Joo-Hee;Kim Yeon-Kyu;Kim Jong-Woo;Choi Gi-Hyuk
    • Proceedings of the KSRS Conference
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    • 2005.10a
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    • pp.624-627
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    • 2005
  • Ministry of Science & Technology (MOST) and Korea Aerospace Research Institute (KARI) are preparing for the first Korean astronaut program based on the mid and long-term basic plan for space development of Korea from the year of 2003. KARI is making plans for the Korean astronaut's missions with Russia. To participate in the International Space Station (ISS) utilization through the Korean astronaut program, KARI investigates a lot of manned space missions. Among the suggested items, Earth observation on the Russian Module of ISS is the one expected mission for a Korean astronaut. This paper is intended to give readers a brief introduction of ISS Russian Module and research fields of Earth observation for astronaut's mission.

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An Analysis of the Transition of Architectural Data on the Intelligent Office Building in Korea (국내(國內) 인텔리전트 사무소(事務所) 건물(建物)의 건축계획(建築計劃) 관련지표(關聯指標) 추이(推移) 분석(分析))

  • Byun, Gye-Sung
    • Journal of The Korean Digital Architecture Interior Association
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    • v.2 no.1
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    • pp.24-31
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    • 2002
  • The purpose of this study was to analyze the transition on architectural data such as valid indoor length, module, ratio of core, floor height, ceiling height and the type of structured cabling system according to the intelligent building grade through case study of the intelligent office buildings constructed in Korea since 1980. The results of this study were as follows. The average floor height was 3.80m, and it was higher in proportion to the IB grade. The average ceiling height was 2.57m, and it didn't have connection with the IB grade. The module of high frequency in application was $3.0{\times}3.0m$, and it showed 25% in the application frequency. The average valid indoor length was 12.27m. The average ratio of core was 24.49%. The type of high frequency in application for the structured cabling was Access Floor Type, and it showed 31% in the application frequency.

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실시간 분산 응용을 위한 타스크 행위 명세 언어

  • 김정술
    • Proceedings of the Korea Society for Industrial Systems Conference
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    • 1998.10a
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    • pp.623-635
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    • 1998
  • 이 논문에서 우리는 분산 실시간 소프트웨어 설계방법인 CODARTS/DA(Concurrent Design Approach for Real-Time Systems/Distributed Application)를 위한 타스크 행위 명세방법을 제안한다. 각 타스크는 CODARTS/DA 모듈들, 즉, 다수 클라이언트/서버 모듈(Multiple Client/Sever Module), 단일 클라이언트/서버 모듈(Single Client/Server Module), 그룹 통신모듈(Group Comm. Module), 우선 순위 모듈등과 통신을 수행하는데, 분산환경의 동기, 비동기 문제들을 제안한 방법으로 설계 명세할 수 있다. 또한 제안된 명세방법은 C언어와 비슷한 문법구조를 제공하므로 쉽게 문서들이 구조적 프로그램으로 변환될 수있다.

Development of an Adobe Connect Meeting Moodle Module (Adobe Connect Meeting 무들 모듈 개발)

  • Park, Jong-Dae;Jang, Jin-Hoon
    • The Journal of Natural Sciences
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    • v.19 no.1
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    • pp.11-25
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    • 2008
  • An Adobe Connect Meeting Moodle activity module was developed for the Pai-Chai Moodle virtual learning environment. Professors can create online meeting room directly from their courses by using the Adobe Connect Meeting module. The web services from the server was utilized for the application integration.

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Chaos Simulator as a Developing Tool for Application of Chaos Engineering

  • Kuwata, Kaihei;Kajitani, Yuji;Katayama, Ryu;Nishida, Yukiteru
    • Proceedings of the Korean Institute of Intelligent Systems Conference
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    • 1993.06a
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    • pp.853-856
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    • 1993
  • In this paper, we describe a chaos simulator as a developing tool for applications of chaos engineering. This simulator is composed of three modules, such as generation module of chaotic signals by deterministic rules, determination module whether observed time series is chaos or not, and nonlinear system identification module by self generating Neuro Fuzzy Model.

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Implementation of IEEE 1451 based Dual CAN Module for Fault Tolerance of In-Vehicle Networking System (차량 네트워크 시스템의 결함 허용을 위한 IEEE 1451 기반 중복 CAN 모듈의 구현)

  • Lee, Jong-Gap;Kim, Man-Ho;Park, Jee-Hun;Lee, Suk;Lee, Kyung-Chang
    • Journal of Institute of Control, Robotics and Systems
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    • v.15 no.7
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    • pp.753-759
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    • 2009
  • As many systems depend on electronics in an intelligent vehicle, concern for fault tolerance is growing rapidly. For example, a car with its braking controlled by electronics and no mechanical linkage from brake pedal to calipers of front tires(brake-by-wire system) should be fault tolerant because a failure can come without any warning and its effect is devastating. In general, fault tolerance is usually designed by placing redundant components that duplicate the functions of the original module. In this way a fault can be isolated, and safe operation is guaranteed by replacing the faulty module with its redundant and normal module within a predefined interval. In order to make in-vehicle network fault tolerant, this paper presents the concept and design methodology of an IEEE 1451 based dual CAN module. In addition, feasibility of the dual CAN network was evaluated by implementing the dual CAN module.

Design and Build of Transmit/Receive Module for X Band (X 대역 T/R 모듈의 설계 및 구현)

  • Park, Sung-Kyun
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.19 no.2
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    • pp.168-173
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    • 2008
  • In this paper, we have designed transmit/receive Module for X band which can be applied to active phase array radar system. AESA(active electrically beam steered array) is able to transmit high power as like TWTA with composition of TH Module and steer a main beam faster than mechanically steering system. The proposed structure of T/R Module for X band is brick type for physical structure, common leg structure electrically and small size design as MCM(multi chip module). The results show that the characteristic of proposed T/R module can fully cover the specification of required military radar application.

Modeling and control of a flexible continuum module actuated by embedded shape memory alloys

  • Hadi, Alireza;Akbari, Hossein
    • Smart Structures and Systems
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    • v.18 no.4
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    • pp.663-682
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    • 2016
  • Continuum manipulators as a kind of mechanical arms are useful tools in special robotic applications. In medical applications, like colonoscopy, a maneuverable thin and flexible manipulator is required. This research is focused on developing a basic module for such an application using shape memory alloys (SMA). In the structure of the module three wires of SMA are uniformly distributed and attached to the circumference of a flexible tube. By activating wires, individually or together, different rotation regimes are provided. SMA model is used based on Brinson work. The SMA model is combined to model of flexible tube to provide a composite model of the module. Simulating the model in Matlab provided a platform to be used to develop controller. Complex and nonlinear behavior of SMA make the control problem hard especially when a few SMA actuators are active simultaneously. In this paper, position control of the two degree of freedom module is under focus. An experimental control strategy is developed to regulate a desired position in the module. The simulation results present a reasonable performance of the controller. Moreover, the results are verified through experiments and show that the continuum module of this paper would be used in real modular manipulators.

Failure Mechanism of Bendable Embedded Electronic Module Under Various Environment Conditions (Bendable 임베디드 전자모듈의 손상 메커니즘)

  • Jo, Yun-Seong;Kim, A Young;Hong, Won Sik
    • Journal of Welding and Joining
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    • v.31 no.5
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    • pp.59-63
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    • 2013
  • A bendable electronic module has been developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In flexible embedded electronic module, a thin silicon chip was embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. To confirm reliability and durability of prototype bendable module, the following tests were conducted: Moisture sensitivity level, thermal shock test, high temperature & high humidity storage test, and pressure cooker tester. Those experiments to induce failure of the module due to temperature variations and moisture are the experiment to verify the reliability. Failure criterion was 20% increase in bump resistance from the initial value. The mechanism of the increase of the bump resistance was analyzed by using non-destructive X-ray analysis and scanning acoustic microscopy. During the pressure cooker test (PCT), delamination occurred at the various interfaces of the bendable embedded modules. To investigate the failure mechanism, moisture diffusion analysis was conducted to the pressure cooker's test. The hygroscopic characteristics of the encapsulating polymeric materials were experimentally determined. Analysis results have shown moisture saturation process of flexible module under high temperature/high humidity and high atmosphere conditions. Based on these results, stress factor and failure mechanism/mode of bendable embedded electronic module were obtained.

Cluster Tool Module Communication Based on a High-level Fieldbus (고수준 필드버스 기반의 클러스터 툴 모듈 통신)

  • Lee Jin Hwan;Lee Tae Eok;Park Jeong Hyeon
    • Proceedings of the Korean Operations and Management Science Society Conference
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    • 2002.05a
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    • pp.285-292
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    • 2002
  • A cluster tool for semiconductor manufacturing is an integrated device that consists of several single wafer processing modules and a wafer transport module based on a robot. The distributed module controllers are integrated by an inter-module communication network and coordinated by a centralized controller, called a cluster tool controller (CTC). Since the CTC monitors and coordinates the distributed complex module controllers for advanced process control, complex commuication messaging and services between the CTC and the module controllers are required. A SEMI standard, CTMC(Cluster Tool Module Communication), specifies application-level communication service requirements for inter-module communication. We propose the use of high-level fieldbuses, for instance. PROFIBUS-FMS, for implementing CTMC since the high-level fieldbuses are well suited for complex real-time distributed manufacturing control applications. We present a way of implementing CTMC using PROFIBUS-FMS as the communication enabler. We first propose improvements of a key object of CTMC for material transfer and the part transfer protocol to meet the functional requirements of modem advanced cluster tools. We also discuss mapping objects and services of CTMC to PROFIBUS-FMS communication objects and services. Finally, we explain how to implement the mappings.

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