• Journal of the Korean Ceramic Society
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• v.47 no.2
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• pp.132-135
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• 2010

Thermal properties of layered metal chalcogenides such as $WT_2$ (T=S,Se) with two-dimensionally disordered structure were evaluated. Thermal conductivity shows a marked decrease after exfoliation and subsequent restacking because of random stacking of two-dimensional crystalline sheet, which circumvents thermal conduction pathways along longitudinal direction in anisotropic materials.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.291-294
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• 2005

Recently, the usage of aluminum alloy is rapidly increasing in automobile industry to achieve weight reduction for fuel efficiency. However, design of forming process of aluminum is more difficult than steel because of poor formability and severe springback. Since applications of finite element analysis for the design of sheet metal forming process are actively performed, it is required to conduct proper consideration of aluminum material behavior. In this study, a plane stress yield function Yld2000(Yoon et al., 2000), proven to describe well the anisotropic behavior of aluminum alloy, is implemented for FE analysis. One element test is considered to verify the validity of implementation of Yld2000 model. In addition, cylindrical cup drawing test is performed to verify earing shape of a drawn cup.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.8
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• pp.1-6
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• 2010

We report on the electrical properties of Ti/Al/Ni/Au (20 nm/ 150 nm/ 30 nm/ 100 nm) Ohmic contacts and the anisotropic conductivity of n-type ${\alpha}$-plane ([11-20]) GaN grown on $\gamma$-plane ([1-102]) sapphire substrates. The Ti/Al/Ni/Au Ohmic contacts and their sheet resistances are characterized by using the transfer length method (TLM) as a function of azimuthal angles. It is found that the specific contact resistance does not depend on the axis orientation and there are significant electrical anisotropy in ${\alpha}$-plane GaN films on $\gamma$-plane sapphire substrates, and the sheet resistance varies with azimuthal angles. The sheet resistance values in the direction parallel to m-axis [1-100] are 25% ~ 75% lower than those parallel to c-axis [0001] directions. Thus, Basal stacking faults (BSFs) are offered as a feasible source of the anisotropic mobility in defected m-axis direction because the band-edge discontinuities owing to the differential band gap structure.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.106-109
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• 2005

Springback is a common phenomenon in sheet metal forming, caused by the elastic recovery of the internal stresses after removal of the tooling. Recently, advanced high strength steels (AHSS) such as TRIP and DP are finding acceptance in the automotive industry because their superior strength to weight ratio can lead to improved fuel efficiency and assessed crashworthiness of vehicles. The major troubles of the automotive structural members stamped with high strength steel sheets are the tendency of the large amount of springback due to the high yield strength and the tensile strength. The amount of springback is mainly influenced by the type of the yield function and anisotropic model induced by rolling. The discrepancy of the deep drawn product comparing the data of from the product design induced by springback must be compensated at the tool design stage in order to guarantee its function and assembly with other parts. The methodology of compensation of the low shape accuracy induced by large amount of springback is developed by the expert engineer in the industry. Recently, the numerical analysis is introduced in order to predict the amount of springback and to improve the shape accuracy prior to tryout stage of press working. In this paper, the tendency of springback is evaluated with respect to the blank material. The stamping process is analyzed fur the front side member formed with AHSS sheets such as TRIP60 and DP60. The analysis procedure fully covers the binderwrap, stamping, trimming and springback process with the commercial elasto-plastic finite element code LS-DYNA3D.