• Title/Summary/Keyword: Amorphous Silicon

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A New AMOLED Pixel Circuit Employing a-Si:H TFTs for High Aperture Ratio

  • Shin, Hee-Sun;Lee, Jae-Hoon;Jung, Sang-Hoon;Kim, Chang-Yeon;Han, Min-Koo
    • 한국정보디스플레이학회:학술대회논문집
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    • 2005.07b
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    • pp.1297-1300
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    • 2005
  • We propose a new pixel design for active matrix organic light emitting diode (AM-OLED) displays using hydrogenated amorphous silicon thin-film transistors (a-Si:H TFTs). The pixel circuit is composed of five TFTs and one capacitor, and employs only one additional control signal line. It is verified by SPICE simulation results that the proposed pixel compensates the threshold voltage shift of the a-Si:H TFTs and OLED.

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Performance and Applications of High Efficiency Phosphorescent OLED Technology

  • Hack, M.;Lu, M.K.;Kwong, R.;Weaver, M.S.;Tung, Y.J.;Chwang, A.;Brown, J.J.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2003.07a
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    • pp.169-173
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    • 2003
  • Universal Display Corporation (UDC), together with its University partners at Princeton University and the University of Southern California, are developing high-efficiency electrophosphorescent OLED devices, based on triplet emission. Recent results show both excellent device efficiencies and good lifetimes for the commercialization of low power consumption, full-color, passive and activematrix OLED displays. We also show that phosphorescent devices may be driven by low cost amorphous silicon backplanes, and discuss the benefits of using our proprietary top emission OLED device architecture.

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Dielecrtric and Voltage Holding Properties of the Half-V-shaped Switching Ferroelectric Liquid Crystal Mode Driven by Active Matrix

  • Choi, Suk-Won;Kim, Hong-Chul;Jeong, Woo-Nam;Seo, Chang-Ryong
    • 한국정보디스플레이학회:학술대회논문집
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    • 2003.07a
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    • pp.1121-1124
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    • 2003
  • For high quality displays, analog responding liquid crystals with spontaneous polarization ($P_{s}$) need to be coupled with active matrix driving schemes. We have characterized the half-V-shaped switching ferroelectric liquid crystal mode (half-V FLC mode) in terms of dielectiric and voltage holding properties. Research on these switching properties provided us with the technology for switching half-V FLC mode FLCs by using amorphous silicon TFTs.

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Electrical stabilities of half-Corbino thin-film transistors with different gate geometries

  • Jung, Hyun-Seung;Choi, Keun-Yeong;Lee, Ho-Jin
    • Journal of Information Display
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    • v.13 no.1
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    • pp.51-54
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    • 2012
  • In this study, the bias-temperature stress and current-temperature stress induced by the electrical stabilities of half-Corbino hydrogenated-amorphous-silicon (a-Si:H) thin-film transistors (TFTs) with different gate electrode geometries fabricated on the same substrate were examined. The influence of the gate pattern on the threshold voltage shift of the half-Corbino a-Si:H TFTs is discussed in this paper. The results indicate that the half-Corbino a-Si:H TFT with a patterned gate electrode has enhanced power efficiency and improved aperture ratio when compared with the half-Corbino a-Si:H TFT with an unpatterned gate electrode and the same source/drain electrode geometry.

A Study on the Characteristics of Aluminum Oxide Thin Films Prepared by ECR-PECVD (ECR-플라즈마 화학 증착된 알루미늄 산화막 연구)

  • 이재균;전병혁;이원종
    • Journal of the Korean Ceramic Society
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    • v.31 no.6
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    • pp.601-608
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    • 1994
  • Aluminum oxide thin films were deposited on p-type(100) silicon substrates by electron cyclotron resonance plasma enhanced CVD(ECR-PECVD) using TMA[Al(CH3)3] and oxygen as reactant gases at 16$0^{\circ}C$ or lower temperatures. The aluminum oxide films deposited by ECR-PECVD have the amorphous structure with the refractive index of 1.62~1.64 and the O/Al ratio of 1.6~1.7. Oxygen flow rate necessary for the stable deposition of the aluminum oxide films increases as the deposition temperature increases. It was found from the OES analysis that the ECR plasma had les cooling effect by introducing the TMA reactant gas in comparison with the RF plasma. The properties of aluminum oxide films prepared by ECR-PECVD were compared with those prepared by RF-PECVD. The ECR-PECVD aluminum oxide films have the higher refractive indices, the lower contents of impurities (H and C) and the stronger wet etch resistance than those deposited by RF-PECVD.

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Development of High Voltage TFT by Discharge Plasma Chemical Vapor Depoisition (방전 플라즈마 CVD에 의한 전력용 고합 TFT의 개발)

  • Lee, Woo-Sun;Kang, Yong-Chul;Kim, Byung-In;Yang, Tae-Whan;Chung, Hae-In;Chung, Yong-Ho
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1993.05a
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    • pp.137-141
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    • 1993
  • We studied the fabrication and electrical characteristics of high voltage hydrogenerated amorphous silicon thin film transistor using glow discharge plasma enchanced chemical vapor deposition (GDPECVD) with $2500{\AA}\;SiO_2$, $400-1500{\AA}$ a-Si thickness, 350V output voltage, 100V input voltaege, and $9.55{\times}10^4$ average on/off ratio. We found that leakage current of high voltage TFT occured 0-70V drain voltage.

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Thermite Reaction Between CuO Nanowires and Al for the Crystallization of a-Si

  • Kim, Do-Kyung;Bae, Jung-Hyeon;Kim, Hyun-Jae;Kang, Myung-Koo
    • Transactions on Electrical and Electronic Materials
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    • v.11 no.5
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    • pp.234-237
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    • 2010
  • Nanoenergetic materials were synthesized and the thermite reaction between the CuO nanowires and the deposited nano-Al by Joule heating was studied. CuO nanowires were grown by thermal annealing on a glass substrate. To produce nanoenergetic materials, nano-Al was deposited on the top surface of CuO nanowires. The temperature of the first exothermic reaction peak occurred at approximately $600^{\circ}C$. The released heat energy calculated from the first exothermic reaction peak in differential scanning calorimetry, was approximately 1,178 J/g. The combustion of the nanoenergetic materials resulted in a bright flash of light with an adiabatic frame temperature potentially greater than $2,000^{\circ}C$. This thermite reaction might be utilized to achieve a highly reliable selective area crystallization of amorphous silicon films.

Infrared Response Characterization on the Microbolometer Device Design (마이크로볼로미터 소자설계에 따른 적외선 검출특성)

  • Han, Myung-Soo;Ahn, Su-Chang;Kang, Tai-Young;Lim, Sung-Soo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.343-344
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    • 2008
  • A surface micromachined uncooled microbolometer based on the amorphous silicon was designed, fabricated, and characterized. We designed the microbolometer with a pixel size of $44\times44{\mu}m^2$ and a fill factor of about 50 % ~ 70% by considering such important factors as the thermal conductance, thermal time constant, the temperature coefficient of resistance, and device resistance. Also, we successfully fabricated the microbolometer by using surface MEMS technology. Finally, we investigated responsivity and detectivity properties depends on the active area size.

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Dynamic Pixel Models for a-Si TFT-LCD and Their Implementation in SPICE

  • Wang, In-Soo;Lee, Gi-Chang;Kim, Tae-Hyun;Lee, Won-Jun;Shin, Jang-Kyoo
    • ETRI Journal
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    • v.34 no.4
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    • pp.633-636
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    • 2012
  • A dynamic analysis of an amorphous silicon (a-Si) thin film transistor liquid crystal display (TFT-LCD) pixel is presented using new a-Si TFT and liquid crystal (LC) capacitance models for a Simulation Program with Integrated Circuit Emphasis (SPICE) simulator. This dynamic analysis will be useful when predicting the performance of LCDs. The a-Si TFT model is developed to accurately estimate a-Si TFT characteristics of a bias-dependent gate to source and gate to drain capacitance. Moreover, the LC capacitance model is developed using a simplified diode circuit model. It is possible to accurately predict TFT-LCD characteristics such as flicker phenomena when implementing the proposed simulation model.

Characterization of PECVD and LPCVD a-Si films crystallized by excimer laser (엑시머 레이저를 이용하여 결정화한 PECVD 및 LPCVD 비정질 실리콘 박막의 특성 분석)

  • 최홍석;이성규;장근호;전명철;한민구
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.33A no.6
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    • pp.172-177
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    • 1996
  • We have characterized XeCl excimer-laser-induced crystallization of thin amorphous silicon films deposited by PECVD (${\alpha}$-Si:H) and LPCVD (${\alpha}$-Si). The electrical properties, surface roughness and crystallinity of crystallized thin films have been measured. The dc conductivities, crystallinity andsurface roughness of the films increased as the laser energy density and shot density were increased. The properties of laser annealed films deposited by LPCVD were better than those of thin films deposite by PECVD. We have also found that the multiple shots with relative low energy density were more benifical to the improsvement of surface roughness than the single shot with high energy density preserving the crystallinity.

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