• Title/Summary/Keyword: Aluminum fluoride

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Alq$_3$-based organic light-emitting devices with Al/fluoride cathode; Performance enhancement and interface electronic structures

  • Park, Y.;Lee, J.;Kim, D.Y.;Chu, H.Y.;Lee, H.;Do, L.M.;Zyung, T.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2002.08a
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    • pp.105-107
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    • 2002
  • The device characteristics and the interface electronic structures of organic light-emitting devices based on tris-(8-hydroxyquinoline)aluminum were investigated with $Al/CaF_2$, Al/LiF, and Al-only cathodes. Similar to the Al/LiF cathode, the $Al/CaF_2$ cathode greatly improved the performance of the device over Al-only cathode. However, a photoelectron spectroscopy study revealed that despite the performance improvement, the evolution of the new peaks during $Al/CaF_2$ cathode formation closely resembled those of the Al-only cathode rather than the Al/LiF cathode.

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ENHANCEMENT OF PHOTOVOLTAIC PERFORMANCE IN COPPER PHTHALOCYNINE THICK FILM SOLAR CELLS

  • Ruiono, Yo Tomota;Momose, Yoshihiro;Takeuchi, Manabu
    • Journal of the Korean institute of surface engineering
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    • v.29 no.6
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    • pp.673-677
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    • 1996
  • Copper phthalocyanine(CuPc) thick film solar cells were fabgricated byspin coating and their photovoltaic behavior was studied. Polyvinylidene fluoride (PVdF) was used for the binder. Aluminum and indium were employed as electrode metals to form Schottky contact to CuPc layer. The cells showed rectifying J-V characteristics in the dark and photovoltaic effect associated with white light irradiation. The photovoltaic performance of the cells strongly depended on contact metals, in which the formation of oxide layer between binder layer and electrode interface affected the solar cell. Influnce of the CuPc layer thickness, CuPc/PVdF ratio on the photovoltaic performance of the cells were also examined.

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Characteristics of Cryolite as an Electrolyte for Reduction of Nd$_2$O$_3$ (네오디뮴 산화물의 전해환원시 전해질로서 빙정석의 특성)

  • 남상욱;백영현
    • Journal of the Korean institute of surface engineering
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    • v.26 no.2
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    • pp.82-86
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    • 1993
  • An attempt was made to reduce directly Nd2O3 in a cryolited based fluoride bath. Neodymium metal was electrodeposited on the iron cathode to produce the Fe-Nd eutectic alloy in a liquid state at 90$0^{\circ}C$. Graphite was adopted for the anode and pure iron for the cathode. Electrolyte was composed of Na3AlF6 50wt.%. AlF3 34wt.% and Nd2O3 16wt.%. Analysis of typical alloy product showed Al 63.4wt.% Fe 26.9wt.% and Nd 7.0 wt.% The enrichment of neodymium in the alloy couldn't be obtained because aluminum codeposited with ne-odydmium. Experimental results proved that the cryolited based electrolyte was unstable for the electrolysis of rare earth oxides even though their prominent solubilities.

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Fabrications and Properties of VF2-TrFE Films for Nonvolatile Memory Application (비휘발성 메모리 응용을 위한 VF2-TrFE 박막의 제작 및 특성)

  • Jeong, Sang-Hyun;Byun, Jung-Hyun;Kim, Hyun-Jun;Kim, Ji-Hun;Kim, Kwang-Ho
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.388-388
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    • 2010
  • In this study, Ferroelectric vinylidene fluoride-trifluoroethylene (VF2-TrFE) copolymer films were directly deposited on degenerated Si (n+, $0.002\;{\Omega}{\cdot}cm$) using by spin coating method. A 1~5 wt% diluted solution of purified vinylidene fluoride-trifluoroethylene (VF2:TrFE = 70:30) in a dimethylformamide (DMF) solvent were prepared and deposited on silicon wafers at a spin rate of 2000 ~ 4000 rpm for 2 ~ 30 seconds. After annealing in a vacuum ambient at 100 ~ $200^{\circ}C$ for 60 min, upper aluminum electrodes were deposited by vacuum evaporation for electrical measurement. X-ray diffraction results showed that the VF2-TrFE films on Si substrates had $\beta$-phase of copolymer structures. The capacitance on highly doped Si wafer showed hysteresis behavior like a butterfly shape and this result indicates clearly that the copolymer films have ferroelectric properties. The typical measured remnant polarization ($P_r$) and coercive filed ($E_c$) values were about $5.7\;{\mu}C/cm^2$ and 710 kV/em, respectively, in an applied electric field of ${\pm}$ 1.5 MV/em. The gate leakage current densities measured at room temperature was less than $7{\times}10^{-7}\; A/cm^2$ under a field of 1 MV/cm.

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Fabrications and Properties of Al/$VF_2$/$n^+$-Si(100) Structures by Dip Coating Methode (Dip Coating 법에 의한 Al/$VF_2$-TrFE/Si(100) 구조의 제작 특성)

  • Kim, Ka-Lam;Jeong, Sang-Hyun;Yun, Hyeong-Seon;Lee, Woo-Seok;Kwak, No-Won;Kim, Kwang-Ho
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.20-21
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    • 2008
  • Ferroelectric vinylidene fluoride-trifluoroethylene ($VF_2$-TrFE) copolymer films were directly deposited on degenerated Si ($n^+$, 0.002 $\Omega{\cdot}cm$) using by dip coating method. A 1 ~ 3 wt% diluted solution of purified vinylidene fluoride-trifluoroethylene ($VF_2$:TrFE=70:30) in a dimethylformamide (DMF) solvent were prepared and deposited on silicon wafers using dip coating method for 10 seconds. After Post-Annealing in a vacuum ambient at 100~200 $^{\circ}C$ for 60 min, upper aluminum electrodes were deposited by thermal evaporation through the shadow mask to complete the MFS structure. The ferroelectric $\beta$-phase peak of films, depending on the annealing temperature, started to show up around $125^{\circ}C$, and the intensity of the peak increased with increasing annealing temperature. Above $175^{\circ}C$, the peak started to decrease. The C-V characteristics were measured using a Precision LCR meter (HP 4284A) with frequency of 1MHz and a signal amplitude of 20 mV. The leakage-current versus electric-field characteristics was measured by mean of a pA meter/DC voltage source (HP 4140B).

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A Study on Ni Electroless Plating Process for Solder Bump COG Technology (COG용 Solder Bump 제작을 위한 Ni 무전해 도금 공정에 관한 연구)

  • Han, Jeong-In
    • Korean Journal of Materials Research
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    • v.5 no.7
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    • pp.794-801
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    • 1995
  • To connect the driver IC and Al coated glass, a method has been developed to plate electrolessly Ni on Al/PR system. It Is necessary to pretreat Al to remove oxide film before plating. In order to find pretreatment process which does not damage photoresist or glass, alkaline and fluoride zincate process have been investigated. Because photoresist and aluminum thin film can easily dissolve in alkaline solution, it is considered that the fluoride zincate process was a suitable one. After immersion in the zincate solution containing 1.5 g/$\ell$ ammonium bifluoride and 100 g/$\ell$ zinc sulfate, electroless nickel plating could be performed. The additive in the zincate solution and thiourea in the plating solution increased smoothness of the plated surface. Acld dip could improve the uniformit of the surface.

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PARTITIONING RATIO OF DEPLETED URANIUM DURING A MELT DECONTAMINATION BY ARC MELTING

  • Min, Byeong-Yeon;Choi, Wang-Kyu;Oh, Won-Zin;Jung, Chong-Hun
    • Nuclear Engineering and Technology
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    • v.40 no.6
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    • pp.497-504
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    • 2008
  • In a study of the optimum operational condition for a melting decontamination, the effects of the basicity, slag type and slag composition on the distribution of depleted uranium were investigated for radioactively contaminated metallic wastes of iron-based metals such as stainless steel (SUS 304L) in a direct current graphite arc furnace. Most of the depleted uranium was easily moved into the slag from the radioactive metal waste. The partitioning ratio of the depleted uranium was influenced by the amount of added slag former and the slag basicity. The composition of the slag former used to capture contaminants such as depleted uranium during the melt decontamination process generally consists of silica ($SiO_2$), calcium oxide (CaO) and aluminum oxide ($Al_2O_3$). Furthermore, calcium fluoride ($CaF_2$), magnesium oxide (MgO), and ferric oxide ($Fe_2O_3$) were added to increase the slag fluidity and oxidative potential. The partitioning ratio of the depleted uranium was increased as the amount of slag former was increased. Up to 97% of the depleted uranium was captured between the ingot phase and the slag phase. The partitioning ratio of the uranium was considerably dependent on the basicity and composition of the slag. The optimum condition for the removal of the depleted uranium was a basicity level of about 1.5. The partitioning ratio of uranium was high, exceeding $5.5{\times}10^3$. The slag formers containing calcium fluoride ($CaF_2$) and a high amount of silica proved to be more effective for a melt decontamination of stainless steel wastes contaminated with depleted uranium.

Comparison of sample storage containers for the analysis of volatile organic compounds (VOC) (휘발성유기물(VOC) 분석을 위한 시료보관 용기의 비교)

  • Kim, Seokyung;Kim, Dalho
    • Analytical Science and Technology
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    • v.35 no.3
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    • pp.116-123
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    • 2022
  • Polymer bags, metallic canisters, and glass bottles have been used as containers for analyzing the volatile organic compounds (VOCs) in air. In this study, various sampling containers were compared to investigate the short-term stability of VOCs, that is, from the time they are sampled to the time they are analyzed. Polyvinyl fluoride (PVF), polypropylene (PP), polyester aluminum (PE-Al) bags, canisters, and glass bottles were used as sample containers. A 100 nmol/mol standard gas mixture of benzene, toluene, ethylbenzene, m-xylene, styrene, and o-xylene was used for the VOC comparison. Changes in the concentrations of samples stored for 10~20 day in each container were measured using a thermal desorption-gas chromatograph-flame ionization detector (TD-GC-FID). As a result, VOCs stored in a canister and two kinds of amber glass bottles have shown immaterial decreases in concentration in one week, and more than 80 % of the initial concentration was maintained for two weeks. In the case of polymer bags, the concentration of all VOCs, except benzene and toluene, were remarkably decreased below 70% of the initial concentration in one day. Particularly, ethylbenzene, xylene, and styrene have shown dramatic decreases in concentration below 30 % of the initial concentration in all polymer bags in one day.

Acid Property and Catalytic Activity on Mordenites Treated by Hydrochloric Acid and Hydrofluoric Acid (염산 및 불산처리 모더나이트의 산특성과 촉매활성)

  • Han, Young-Taek;Ha, Baik-Hyon
    • Applied Chemistry for Engineering
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    • v.2 no.1
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    • pp.77-85
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    • 1991
  • A series of samples having different $SiO_2/Al_2O_3$ ratio were prepared by treating hydrogen mordenites with boiling hydrochloric acid and with hydrofluoric acid. The acidities of these samples were measured by TPD of $NH_3$ and by pyridine adsorption using IR, and the catalytic activities and selectivities of isomerization were measured for the reaction of ortho-xylene. For the samples treated by boiling hydrochloric acid, the acidities decreased with the increasing $SiO_2/Al_2O_3$ ratio caused by the extraction of framework aluminum. The sample having the $SiO_2/Al_2O_3$ ratio or 22 showed better activity than the others. For the samples treated by hydrofluoric acid, the content of chemically binding fluorine increased with the increasing contact time of hydrofluoric acid solution. The catalytic activities decreased with the hydrofluoric acid treatment due to the decreased acid sites resulted from the extraction of aluminum and silicon as well as the hydroxyl group replacement by the fluoride ion. The slightly increasing catalytic activities, however, came from the newly created acid sites, due to the removal of surface silicon, having enhanced by the inductive effect of binding fluorin with further acid treatment.

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Characteristics of Carbon Tetrafluoride Plasma Resistance of Various Glasses

  • Choi, Jae Ho;Han, Yoon Soo;Lee, Sung Min;Park, Hyung Bin;Choi, Sung Churl;Kim, Hyeong Jun
    • Journal of the Korean Ceramic Society
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    • v.53 no.6
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    • pp.700-706
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    • 2016
  • Etch rate, surface roughness and microstructure as plasma resistance were evaluated for six kinds of oxide glass with different compositions. Borosilicate glass (BS) was found to be etched at the highest etch rate and zinc aluminum phosphate glass (ZAP) showed a relatively lower etch rate than borosilicate. On the other hand, the etching rate of calcium aluminosilicate glass (CAS) was measured to be similar to that of sintered alumina while yttrium aluminosilicate glass (YAS) showed the lowest etch rate. Such different etch rates by mixture plasma as a function of glass compositions was dependent on whether or not fluoride compounds were formed on glass and sublimated in high vacuum. Especially, in view that $CaF_2$ and $YF_3$ with high sublimation points were formed on the surface of CAS and YAS glasses, both CAS and YAS glasses were considered to be a good candidate for protective coating materials on the damaged polycrystalline ceramics parts in semi-conductor and display processes.