• 한국세라믹학회지
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• 제33권4호
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• pp.455-463
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• 1996

Aluminium nitride (AlN) powder was prepared by using aluminium (III) complexes with dibasic carboxylate ligands(adipato)(hydroxo) aluminium(III) and (hydroxo)(succinato)aluminium (III) as a precursor. The AlN pow-der was obtained by calcining the complexes without mixing any carbon source under a flow of ammonia at 120$0^{\circ}C$ Contary to the conventional carbothermal reduction and nitridiation the process of decarboniza-tion of the residual carbon was not required because of the reaction of ammonia with carbon at temperature >100$0^{\circ}C$. Fine AlN powder was also prepared by calcining a mixture of an (adipato)(hydroxo)aluminium(III) complex and carbon under a flow of nitrogen at 140$0^{\circ}C$ The AlN powders prepared were ultrafine and their morphology was almost the same as that of powders of two precursors.

• Journal of Welding and Joining
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• 제13권3호
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• pp.134-146
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• 1995

Aluminium nitride(AlN) is currently under investigation as potential candidate for replacing alumium oxide(Al$_{2}$ $O_{3}$) as a substrate material for for electronic circuit packaging. Brazing of aluminium nitride(AlN) to Cu with Ag base active alloy containing Ti has been investigated in vacuum. Binary Ag$_{98}$ $Ti_{2}$(AT) and ternary At-1wt.%Al(ATA), AT-1wt.%Ni(ATN), AT-1wt.% Mn(ATM) alloys showed good wettability to AlN and led to the development of strong bond between brate alloy and AlN ceramic. The reaction between AlN and the melted brazing alloys resulted in the formation of continuous TiN layers at the AlN side iterface. This reaction layer was found to increase by increase by increasing brazing time and temperature for all filler metals. The bond strength, measured by 4-point bend test, was increased with bonding temperature and showed maximum value and then decreased with temperature. It might be concluded that optimum thickness of the reaction layer was existed for maximum bond strength. The joint brazed at 900.deg.C for 1800sec using binary AT alloy fractured at the maximum load of 35kgf which is the highest value measured in this work. The failure of this joint was initiated at the interface between AlN and TiN layer and then proceeded alternately through the interior of the reaction layer and AlN ceramic itself.

• Transactions on Electrical and Electronic Materials
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• 제12권4호
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• pp.148-151
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• 2011

We designed and fabricated aluminium gallium nitride (AlGaN)/GaN high electron mobility transistors (HEMTs) with stable reverse blocking characteristics established by employing a selective fluoride plasma treatment on the drainside gate edge region where the electric field is concentrated. Implanted fluoride ions caused a depolarization in the AlGaN layer and introduced an extra depletion region. The overall contour of the depletion region was expanded along the drift region. The expanded depletion region distributed the field more uniformly and reduced the field intensity peak. Through this field modulation, the leakage current was reduced to 9.3 nA and the breakdown voltage ($V_{BR}$) improved from 900 V to 1,400 V.

• 한국표면공학회지
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• 제53권6호
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• pp.280-284
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• 2020

Electron beam irradiation is widely used as a type of surface modification technology to advance surface properties. In this study, the effect of electron beam irradiation on properties, such as surface hardness, wear resistance, roughness, and critical load of Titanium Aluminium nitride (TiAlN) films was investigated. TiAlN films were deposited on the SKD-61 substrate by using cathode arc ion plating. After deposition, the films were bombarded with intense electron beam for 10 minutes. The surface hardness was increased up to 4520 HV at electron irradiation energy of 1500 eV. In addition, surface root mean square (RMS) roughness of the films irradiated at 1500 eV shows the lowest roughness of 484 nm in this study.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 춘계학술대회 논문집
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• pp.302-305
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• 2009

This paper examines the effect of nitride formation on formability for Cu bearing high strength extra low carbon (ELC) steel sheets. For this purpose, we have investigated the effect of addition of aluminium (Al) and boron (B) on texture and precipitation behavior of the ELC steel during continuous annealing. Mechanical properties and microstructures of the ELC steel sheets were analyzed as well using uni-axial tensile test, electron back-scattered diffraction (EBSD) technique and transmission electron microscopy (TEM) following pilot rolling and continuous annealing. It has been found that the addition of Al and B increases the precipitation of AlN and BN. What is more, the scavange of solute nitrogen is effective in increasing the formability of the ELC steels. In addition, the Al and B addition improves the aging property of the ELC steel.

• 한국세라믹학회지
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• 제33권3호
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• pp.285-292
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• 1996

질소 분위기에서 상압소결한 알루미나 소결체의 열전도도에 대한 AIN 첨가효과를 검토하였다. AIN 함량이 1,5 및 10 mol%롤 증가하면 $Al_{2}O_{3}$-AIN 소결체의 열전도도는 급격히 감소하지만, 20 및 25 mol%가 첨가되면 거의 일정하였다. 1~10mol% AIN이 첨가된 알루미나 소결체의 열전도도는 $1700^{\circ}C$의 소결온도에서 최대값을 나타내었으며, 소결온도가 $1800^{\circ}C$로 증가하면 감소하는 경향을 보였다. 이러한 현상은 $1700^{\circ}C$까지는 $\alpha$-$Al_{2}O_{3}$ 및 $Al_{2}O_{3}$와 AIN이 반응하여 생성되 ALON상이 존재하나, $1750^{\circ}C$부터 ${\gamma}$-ALON($9Al_{2}O_{3}$.AIN) 및 $\Phi$($5Al_{2}O_{3}$.AIN)상 등의 2차상을 생성하는 것에 기인된다. 20 및 25 mol% AIN이 첨가된 알루미나 소결체의 열전도도는 $1800^{\circ}C$에서 최대값을 나타내며, $1600^{\circ}C$에서는 $\alpha$-$Al_{2}O_{3}$ 및 ALON상이 존재하나 그 이상의 온도에서는 모두 ALON상만이 존재하였다.

• 반도체디스플레이기술학회지
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• 제14권2호
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• pp.47-52
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• 2015

In this paper, the performance of uncoated- and Titanium nitride aluminium TiAlN-PVD coated- carbide twist drills were investigated when drilling aluminium alloy, Al 6061. This research focuses on the optimization of drilling parameters using the Taguchi technique to obtain minimum surface roughness and thrust force. A number of drilling experiments were conducted using the L9 orthogonal array on a CNC vertical machining center. The experiments were performed on Al 6061 material l blocks using uncoated and coated HSS twist drills under dry cutting conditions. Analysis of variance(ANOVA) was employed to determine the most significant control factors. The main objective is to find the important factors and combination of factors influence the machining process to achieve low surface roughness and low cutting thrust force. From the analysis of the Taguchi method indicates that among the all-significant parameters, feed rate are more significant influence on surface roughness and cutting thrust than spindle speed.

• The Journal of Advanced Prosthodontics
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• 제5권4호
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• pp.382-387
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• 2013

PURPOSE. Although several surface treatments have been recently investigated both under in vitro and in vivo conditions, controversy still exists regarding the selection of the most appropriate zirconia surface pre-treatment. The purpose of this study was to evaluate the effect of alumina (Al) and aluminium nitride (AlN) coating on the shear bond strength of adhesive resin cement to zirconia core. MATERIALS AND METHODS. Fifty zirconia core discs were divided into 5 groups; air particle abrasion with 50 ${\mu}m$ aluminum oxide particles ($Al_2O_3$), polishing + Al coating, polishing + AlN coating, air particle abrasion with 50 ${\mu}m$ $Al_2O_3$ + Al coating and air particle abrasion with 50 ${\mu}m$ $Al_2O_3$ + AlN coating. Composite resin discs were cemented to each of specimens. Shear bond strength (MPa) was measured using a universal testing machine. The effects of the surface preparations on each specimen were examined with scanning electron microscope (SEM). Data were statistically analyzed by one-way ANOVA (${\alpha}$=.05). RESULTS. The highest bond strengths were obtained by air abrasion with 50 ${\mu}m$ $Al_2O_3$, the lowest bond strengths were obtained in polishing + Al coating group (P<.05). CONCLUSION. Al and AlN coatings using the reactive magnetron sputtering technique were found to be ineffective to increase the bond strength of adhesive resin cement to zirconia core.

• 반도체디스플레이기술학회지
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• 제3권2호
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• pp.17-21
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• 2004

Aluminum nitride(AlN) thin films were deposited on silicon substrate by reactive RF magnetron sputtering without substrate heating. We investigated the dependence of some properties for AlN thin film on sputtering conditions such as working pressure, $N_2$ concentration and RF power. XRD, Ellipsometer and AES has been measured to find out structural properties and preferred orientation of AlN thin films. Deposition rate of AlN thin film was increased with an increase of RF power and decreased with an increase of $N_2$ concentration. AES in-depth measurements showed that stoichiometry of Aluminium and Nitrogen elements were not affected by $N_2$ concentration. It has shown that low working pressure, low $N_2$ concentration and high RF power should be maintained to deposit AlN thin film with a high degree of (0002) preferred orientation.

• 한국결정성장학회지
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• 제30권1호
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• pp.1-6
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• 2020

본 연구에서는 패턴화된 사파이어 기판 위에 HVPE(Hydride Vapor Phase Epitaxy System) 법에 의해 50 nm 두께의 AlN thin film을 증착한 뒤, 에피층 구조가 MO CVD에서 성장되었다. AlN 버퍼층 박막의 표면형상이 SEM, AFM에 의해서, 에피층 구조의 GaN 박막의 결정성은 X-선 rocking curve에 의해 분석되었다. 패턴화된 사파이어 기판 위에 증착된 GaN 박막은, 사파이어 기판 위에 증착된 GaN 박막의 경우보다 XRD 피크 세기가 다소 높은 결과를 나타냈다. AFM 표면 형상에서 사파이어 기판 위에 AlN 박막이 증착된 경우, GaN 에피층 박막의 p-side 쪽의 v-pit 밀도가 상대적으로 낮았으며, 결함밀도가 낮게 관찰되었다. 또한, AlN 버퍼층이 증착된 에피층 구조는 AlN 박막이 없는 에피층의 광출력에 비해 높은 값을 나타냈다.