• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.11 no.3
• /
• pp.853-858
• /
• 2010

DRAM package substrate has been demonstrated using a thick alumina layer produced by aluminum anodization process. To apply a transmission-based design methodology, 2 dimensional electromagnetic simulation is performed. The design parameters including signal line width/spacing and alumina's thickness are optimized based on the simulation analysis and are verified with the fabrication and the measurement of the test patterns on the anodic alumina substrate. DDR2 DRAM package is chosen as a design vehicle. Aluminum anodization technique has been applied successfully to fabricate new DRAM package substrate.

• Journal of Welding and Joining
• /
• v.16 no.2
• /
• pp.122-128
• /
• 1998

This investigation was performed to collect fundamental informations concerning the behavior of glass solders on ceramic joining process. The wettability of glasses on two types of alumina was evaluated by sessile drop method. SiO$_2$-CaO-Al$_2$O$_3$system glasses were selected as solder glasses, and alumina that have different purities were used for substrate materials. It is indicated that contact angles of glasses on 99% purity of alumina substrate do not change as increasing time at elevated temperature, however the contact angles on the 92% purity of alumina substrate exhibit the strong time dependency. The time-dependent property on 92% alumina was due to the interlayer reactions occurred between the glass solder and impurities on the substrate.

• Journal of the Korean Ceramic Society
• /
• v.29 no.12
• /
• pp.956-962
• /
• 1992

The predominant sintering mechanisms of low firing temperature ceramic substrate which consists of borosilicate glass containing alumina as a filler are the rearrangement of alumina particles and the viscous flow of glass powders. In this system, sintering condition depends on the volume ratio of alumina to glass and on the particle size. When the substrate contains about 35 vol% alumina filler and the average alumina particle size is 4 $\mu\textrm{m}$, the best firing condition is obtained at the temperature range of 900∼1000$^{\circ}C$. The extensive rearrangement behavior occurs at these conditions, and the optimum sintering condition is attained by smaller size of glass particles, too. The formation of cristobalite during sintering causes the difference of thermal expansion coefficient between the substrate and Si chip. This phenomenon degradates the capacity of Si chip. Therefore, the crystallization should be prevented. In the alumina filled borosilicate glass system, the crystallization does not occur. This effect may have some relation with aluminum ions in alumina. For aluminum ions diffuse into glass matrix during sintering, functiong as network former.

• Journal of Welding and Joining
• /
• v.18 no.6
• /
• pp.96-101
• /
• 2000

Sintered alumina ceramic substrate has been used for the insulating substrate for thick Hybrid IC owing to its cheapness and good insulating properties. Some of thick HIC's are important to eliminate the heat emitted from the parts that are mounted on the ceramic substrate. Sintered ceramic substrate can not transfer and emit the heat efficiently. It's been tried to do plasma spray coating of alumina ceramic on the metal substrates that have a good heat emission property. The most important properties to commercialize this ceramic coated metal substrate are surface roughness and deposition efficiency. In this study, plasma spray coating parameters are optimized to minimize the surface roughness and to maximize the deposition efficiency using Taguchi experimental method. By this optimization, the deposition efficiency was greatly improved from 35% at the frist time to 75% finally.

• Journal of the Korean institute of surface engineering
• /
• v.44 no.4
• /
• pp.165-171
• /
• 2011

In this work, handling of sapphire substrate for LED by using an electrostatic chuck was studied. The electrostatic chuck consisted of alumina dielectric, which was doped with 1.2 wt% $TiO_2$. As the volume resistivity of alumina dielectric was decreased, the electrostatic force was increased by Johnsen-Rahbek effect. The narrower width and gap size of electrode led to the stronger electrostatic force. When alumina dielectric with $3.20{\times}10^{11}{\Omega}{\cdot}cm$ resistivity and 3 mm width/1.5 mm gap sized electrode was used, the strongest electrostatic force in this work was obtained, which value reached to ~14.46 gf/$cm^2$ at 2.5 kV for 4-inch sapphire substrate. This results show that alumina electrostatic chuck with low resistivity and fine electrode pattern is suitable for handling of sapphire substrate for LED.

• Korean Journal of Materials Research
• /
• v.12 no.11
• /
• pp.856-859
• /
• 2002

To investigate effects of heat treatments including grain size control in substrate aluminum on nanopore arrays in anodic alumina template, aluminum was heat treated at $500^{\circ}C$ for 1h. The heat treated aluminum was anodized by two successive anodization processes in oxalic solution and the nanopore arrays in anodic alumina layer were studied using TEM and FE-SEM. The highly ordered porous alumina templates with 110 nm interpore distance and 40 nm pore diameter have been observed and the pore array of the anodic alumina has a uniform and closely-packed honeycomb structure. In the case of alumina template obtained from heat treated aluminum substrate, the well- ordered nanopore region in anodic alumina increased and became more homogeneous compared with that from non-heattreated one.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.30 no.11
• /
• pp.683-687
• /
• 2017

We investigated the structure of an ultra-thin insulating board with low thermal conductivity along z-axis, which was based on the idea of void layers created during the glass infiltration process for the zero-shrinkage low-temperature co-fired ceramic (LTCC) technology. An alumina and four glass powders were chosen and prepared as green sheets by the tape casting method. After comparison of the four glass powders, bismuth glass was selected for the experiment. Since there is no notable reactivity between alumina and bismuth glass, alumina was selected as the supporting additive in glass layers. With 2.5 vol% of alumina powder, glass green sheets were prepared and stacked alternately with alumina green sheet to form the 'alumina/glass (including alumina additive)/alumina' structure. The stacked green sheets were sintered into an insulating substrate. Scanning electron microscopy revealed that the additive alumina formed supporting bridges in void layers. The depth and number of the stacking layers were varied to examine the insulating property. The lowest thermal conductivity obtained was 0.23 W/mK with a $500-{\mu}m-thick$ substrate.

• Journal of the Korean Ceramic Society
• /
• v.39 no.11
• /
• pp.1011-1016
• /
• 2002

Colloidal particles of silica (100 nm in size) were electrostatically dispersed and adsorbed on a glass substrate coated with silica sol or alumina sol. Stability of the suspensions and microstructure of the adsorbed particle layers were discussed in terms of total potential energies between the particles and the substrate. Well-dispersed suspension resulted in a layer with densely packed and regularly arranged particles, whereas less stable suspension resulted in a porous layer with loosely packed and irregularly arranged particles. Despite repulsive interactions between the particles and the substrate coated with silica sol, the observed adsorption can be attributed to chemical bonds formed at the interface between the particle and silica sol. In contrast, the adsorption of the particles on the substrate coated with alumina sol formed a layer with strongly adhered and densely packed particles, due to large attractive interactions between the particles and alumina sol.

• Journal of the Korean institute of surface engineering
• /
• v.24 no.4
• /
• pp.187-195
• /
• 1991

Adhesion strength of electroless-plated Ni, Ni-P and Cu deposites on alumina substrate has been studied. Grain boundary spaces produced on the substrate surface by etching treatment provided anchoring sites for enhancing the adhesion strength. Adhesion strengths of Ni-P and Ni deposit were higher than that of Cu deposit, because of higher initial nucleation rates than the latter. The electroless-plated Ni-P and Ni underlayer improved the adhesion strength of the Cu deposit. In could be attributed to the enhanced adhesion between the substrate and those underlayers as well as the satisfactory adhesion between Cu deposits and those underlayers. Heat treatment was also conducted in order to enhance the adhesion strength of Cu layer. The strength was enhanced by about 19% when the treatment was conducted at $150^{\circ}C$ for 2 hours. The enhancement was attributed to relief of internal stress and release of hydrogen.

• Journal of Korea Foundry Society
• /
• v.13 no.5
• /
• pp.476-483
• /
• 1993

The influence of substrate materials on the degree of basal porosity during spray casting process has been investigated. Different conditions of droplet spreading on the substrate were induced by varying the substrate material. Flat sections of cast iron and aluminum have been spray deposited via spray casting process onto an aluminum substrate, a low carbon steel substrate, and an alumina based refractory substrate. Results for cast iron and aluminum sprayed onto the aluminum substrate showed significant improvements in the surface condition and degree of basal porosity with evidence of substrate deformation that round pits ranging from $5{\mu}m$ to $20{\mu}m$ in diameter are distributed on the surface of aluminum substrate. The lowest level of porosity was developed in alumina based refractory material. Several mechanisms for porosity formation were discussed with droplet impact pressure and droplet spreading. Adopting a spray cutting mechanism for removing the periphery of spray cone, porosity level was remarkably decreased.