• 한국세라믹학회지
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• 제36권9호
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• pp.954-964
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• 1999

The effect of fabrication variables and microstructures on the compressive strength of open cell alumina zirconia and silicon nitride ceramics fabricated by polymeric sponge method was investigated. Bulk density and compressive strength of open cell ceramics were mainly affected by coating characteristics of ceramic slurry on polymeric sponge that controlled a shape thickness and defect of the struts. Sintering temperature was optimized for enhancement of strut strength and compressive strength of open cell ceramics. Relative density and compressive strength behaviors were relatively well matched with the predicted values. Open cell ceramics of lower relative density below 0.1 prepared by first relatively well matched with the predicted values. Open cell ceramics of lower relative density below 0.1 prepared by first coating of ceramic slurry had thin triangular prismatic struts that were often broken or longitudinally cracked. With an application of second coating of slurry shape of struts was transformed into thickner cylindrical one and defects in struts were healed but the relative density increased over 0.2 Open cell zirconia had both the highest bulk density and compressive strength and alumina had the lowest compressive strength while silicon nitrides showed relatively high compressive strength and the lowest density. Based upon the analysis open cell silicon nitride was expected to be one of potential structural ceramics with light weight.

• 한국세라믹학회지
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• 제39권5호
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• pp.446-451
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• 2002

지르코니아/알루미나 복합분말의 분무건조로 제조된 과립들의 형상과 성형시 과립 경계면 파괴에 분말의 분산 정도, 결합제의 종류, 그리고 고형분말 함량이 미치는 영향을 관찰하였다. 구형의 과립은 복합분말 슬러리가 완전 분산이 되지 않고 약간의 floc을 형성하고 결합제로서 Polyvinyl Pyrrolidone(PVP)을 사용했을 때 얻어졌다. PVP를 결합제로 사용하고 분말함량이 32.5 vol%인 슬러리로 분무건조한 분말은 성형시 과립경계면이 파괴되어 소결밀도는 99.7%이었고 굴곡강도는 850Mpa이었다.

• 한국기계가공학회지
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• 제2권1호
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• pp.32-38
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• 2003

Engineering ceramics have many unique characteristics both in mechanical and physical properties such as high temperature hardness, high thermal, chemical and electrical resistance. However, its machinability is very poor in conventional machining due to its high hardness and severe tool wear. In the current experimental study alumina($Al_2O_3$) was ultrasonically machined using SiC abrasives under various machining conditions to investigate the material removal rate and surface quality of the machined samples. Under the applied amplitude of 0.02mm, 27kHz frequency, three slurry ratios (abrasives water by weight) of 11, 13 and 15 with different tool shapes and applied pressure levels, the machining was conducted. Using the mesh number of 240 abrasive, slurry ratio of 11 and static pressure of $25kg/cm^2$, maximum material removal rate of $18.97mm^3/mm$ was achieved with mesh number of 600 SiC abrasives and static pressure of $30kg/cm^2$, best surface roughness of $0.76{\mu}m$ Ra was obtained.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 센서 박막재료 반도체 세라믹
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• pp.166-169
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• 2003

In this study, we evaluated the characteristics by the addition of 3 different kinds of nonionic surfactant to improve the dispersion stability of slurries. Slurry stability is an issue in any industry in which settling of particles can result in poor performance. So we observed the variation of particle size and settling rate when the concentration and addition time of surfactant are changed. When the surfactant is added after milling process, the particle size and pH became low. It is supposed that the particle agglomeration was disturbed by adsorption of surfactant on alumina abrasive. The settling rate was relatively stable when nonionic surfactant is added about 0.1~1.0 wt%. When molecular weight(MW) is too small like Brij 35, it was appeared low effect on dispersion stability. Because it can't prevent coagulation and subsequent settling with too small MW. The proper quality of MW for slurry stability was presented about 500,000. Consequently, the addition of nonionic surfactant to alumina slurry has been shown to have very good effect on slurry stabilization. If we apply this results to copper CMP process, it is thought that we will be able to obtain better yield.

• 한국세라믹학회지
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• 제39권9호
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• pp.871-877
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• 2002

알루미나 함량비와 유기물의 첨가비를 변화시킨 각 조성의 알루미나 테이프를 제조하였다. 유기첨가물 조성이 알루미나 슬러리의 안정성에 미치는 영향을 확인하기 위해 각 조성의 슬러리에 대하여 상대점도를 측정하였다. 여러 조성 슬러리의 상대점도를 알루미나 부피분율의 함수로 나타내었을 때 동일한 곡선 상에 위치하였으며, 이로부터 유기물의 함량 및 조성이 캐스팅용 슬러리의 안정성에 큰 영향을 미치지 않음을 알 수 있었다. 준비된 각 조성의 슬러리를 성형하여 건조한 그린 테이프들을 상온에서 인장시험한 결과, 파괴변형율은 알루미나 함량비와 결합제 첨가비가 증가함에 따라 각각 363%에서 45%로, 68%에서 25%로, 연속적으로 감소하는 경향을 나타내었으나, 인장강도는 결합제의 첨가비가 증가함에 따라서는 0.5MPa에서 4MPa로 연속적으로 증가하는 경향을, 알루미나 함량비가 증가함에 따라서는 1MPa까지 급격히 증가한 후 감소하는 변화를 나타내었다. 그린 테이프들은 20$^{\circ}C$에서부터 80$^{\circ}C$까지 승온한 조건에서 인장하였을 때 유기물의 열화로 인해 기계적 물성이 급격히 저하되었다.

• 한국전기전자재료학회논문지
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• 제18권9호
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• pp.803-809
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• 2005

Cerium ammonium nitrate (CAN) and nitric acid was used an etchant and an additive for Ru etching and polishing. pH and Eh values of the CAN and nitric acid added chemical solution satisfied the Ru etching condition. The etch rate increased linearly as the concentration of CAN increased. Nitric acid added solution had the high etch rate. But micro roughness of etched surfaces was not changed before and after etching, The removal rate of Ru film was the highest in $1wt\%$ abrasive added slurry, and not increased despite the concentration of alumina abrasive increased to $5wt\%$. Even Ru film was polished by only CAN solution due to the friction. The highest removal rate of 120nm/min was obtained in 1 M nitric acid and $1wt\%$ alumina abrasive particles added slurry. The lowest micro roughness value was observed in this slurry after polishing. From the XPS analysis of etched Ru surface, oxide layer was founded on the etched Ru surface. Therefore, Ru was polished by chemical etching of CAN solution and oxide layer abrasion by abrasive particles. From the result of removal rate without abrasive particle, the etching of CAN solution is more dominant to the Ru CMP.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.227-230
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• 2004

As the organic acids were added in the slurry, zeta potential of alumina was changed to negative value and IEP value was shifted from alkaline to acidic pH. In citric acid based slurry, Cu surface continuously dissolved and etching depth linearly increased. On the contrary, passivation layer was grown on Cu surface in oxalic acid based slurry. As the platen rotation speed increased, Preston coefficient decreased in both slurries. With oxalic acid based slurry, at low velocity, removal rate is high value because of high friction force compared to citric acid based slurry. As platen velocity increased, removal of Cu in citric acid based slurry became higher value than oxalic acid based slurry. Typical lubrication behaviors were observed in both slurries. As Sommerfeld number increased, COF values gradually decreased and then re-increased. It indicated that lubrication was changed to direct contact or semi-direct contact mode to hydro-lubrication mode.

• Transactions on Electrical and Electronic Materials
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• 제5권6호
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• pp.233-236
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• 2004

Copper metallization has been used in high-speed logic ULSI devices instead of the conventional aluminum alloy metallization. One of the key issues in copper CMP is the development of slurries that can provide high removal rates. In this study, the effects of slurry chemicals and pH for slurry dispersion stability on Cu CMP process characteristics have been performed. The experiments of copper slurries containing each different alumina and colloidal silica particles were evaluated for their selectivity of copper to TaN and $SiO_{2}$ films. Furthermore, the stability of copper slurries and pH are important parameters in many industries due to problems that can arise as a result of particle settling. So, it was also observed about several variables with various pH.

• 설비공학논문집
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• 제19권8호
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• pp.593-598
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• 2007

The present study has dealt with the measuring method of ice slurry viscosity using falling sphere viscometer. The experimental apparatus was composed by test section and high-speed video system. And the spheres used in this study were alumina and glass. The main parameters were ice packing factor (IPF) and falling velocity of sphere so the acquired results were discussed for these parameters. The viscosity of ice slurry was calculated by using measured falling velocity and moving distance at instantaneous time and the Stokes hypothesis was used for this calculation. It was clarified that possible measuring range was $IPF\;=\;0.06{\sim}0.14$ of this type of measuring device and measuring method. In addition, it was clarified that the viscosity of ice slurry increased to increase of ice packing factor (IPF) of ice slurry.

• 한국전기전자재료학회논문지
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• 제13권7호
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• pp.568-574
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• 2000

We have been optimized tungsten(W) plug CMP(chemical mechanical polishing) characteristics using two different kinds of component of slurry and two different kinds of pad which have different hardness. The comparison of oxide film roughness on around W plug after polishing has been carried out. And W plug recess for consumable sets and dishing effect at dense area according to the rate of over-polishing has been investigated. Also the analysis of residue on surface after cleaning have been performed. As a experimental result we have concluded that the consumable set of slurry A and hard pad was good for W plug CMP process. After decreasing the rate of chemical reaction of silica slurry and adding two step buffering we could reduce the expanding of W plug void however we are still recognizing to need a more development for those kinds of CMP consumables.