• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2003년도 제5회 학술대회 논문집 일렉트렛트 및 응용기술연구회
• /
• pp.105-108
• /
• 2003

CMP(chemical mechanical polishing) process has been attracted as an essential technology of multi-level interconnection. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40 %. So, we focused how to reduce the consumption of raw slurry. In this paper, We have studied the CMP (chemical mechanical polishing) characteristics of slurry by adding of raw alumina abrasive and annealed alumina abrasive. As a experimental results, we obtained the comparable slurry characteristics compared with original silica slurry in the view point of high removal rate and low non-uniformity. Therefore, we can reduce the cost of consumables(COC) of CMP process for ULSI applications.

• 한국세라믹학회지
• /
• 제34권11호
• /
• pp.1173-1181
• /
• 1997

Effects of particle size distribution of alumina ceramics on behaviors of tape casting were investigated with emphases on the rheological characteristic of slurry, green density, green sheet strength, and sintering density. For the control of particle size distribution of alumina, the commercial grade low soda alumina, which had different mean particle size of 3.58 ${\mu}{\textrm}{m}$ and 0.42 ${\mu}{\textrm}{m}$, were chosen and blended together. As results, the mixing of 80 wt% fine powder and 20 wt% coarse powder(designated to FC20) led to the increase of packing density and strength of green sheet, and made it easy to handle during processing without lowering of sintering density. Besides, the pseudoplastic behavior of slurry decreased with increase of the fraction of coarse alumina powder.

• 한국세라믹학회지
• /
• 제46권3호
• /
• pp.306-312
• /
• 2009

The size of various alumina ceramics used in semiconductor and display industry is also required to increase with increase in wafer and panel size. In this research, large alumina ceramics was fabricated by filter pressing of alumina slurry using commercial powder and thereafter sintering at $1600^{\circ}C$ in gas furnace. The characteristics of large alumina ceramics thereby were compared to those of small alumina ceramics prepared by pressure forming such as uniaxial pressing and CIP. Careful control of properties of alumina slurry and filter pressing made the fabrication of large alumina ceramics possible, and its characteristics were equivalent to those of small alumina ceramics. The large alumina ceramics, prepared by sintering the green body of 63% relative density at $1600^{\circ}C$, exhibited both dense microstructure corresponding to 98.5% of relative density and 99.8% of high purity as in starting powder.

• 한국세라믹학회지
• /
• 제38권3호
• /
• pp.212-217
• /
• 2001

The influence of granules characteristics and compaction pressure on the microstructure and mechanical properties of sintered as a function of slurry dispersion state. The characteristics and the compaction behavior of the spray dried alumina granules considerably affected the microstructure as well as the mechanical properties of the sintered body. In the green bodies formed with granules prepared with a dispersed slurry, the granules with dimple clearly existed and caused pore defects in sintered body. These dimples were clearly present even in the green body prepared at 180 MPa. The pores between the granules were not removed during pressing and sintering, and remained in the sintered body. In contrast, in the granules fabricated from a flocculated slurry, the destroy of granules at the contact points was observed with increasing pressure. Sintered bodies fabricated with fewer defects showed strength increase. For the sample fabricated with flocculated slurry, the pores at the boundaries of granules were small and more irregular shape compared with those of dispersed slurry.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
• /
• pp.136-139
• /
• 2003

Copper has attractive properties as a multi-level interconnection material due to lower resistivity and higher electromigration resistance as compared with Alumina and its alloy with Copper(0.5%). Among a variety of agents in Copper CMP slurry, $H_2O_2$ has commonly been used as the oxidizer However. $H_2O_2$ is so unstable that it requires stabilization to use as oxidizer Hence, stabilization of $H_2O_2$ is a vital process to get better yield in practical CMP process. In this article the stability of Hydrogen Peroxide as oxidizer of Copper CMP slurry has been investigated. When alumina abrasive was used, $\gamma$-particle Alumina C had a better stability than $\alpha$-particle abrasive. As adding KOH as pH buffering agent, $H_2O_2$ stability in slurry decreased. Urea hydrogen peroxide was used as oxidizer, an enhanced stability was gotten. When $H_3PO_4$ as $H_2O_2$ stabilizer was added, the decrease of $H_2O_2$ concentration in slurry became slower. Even though adding $H_2O_2$ in slurry after bead milling lead to better stability than in advance of bead milling, it had a lower dispersibility.

• 한국재료학회:학술대회논문집
• /
• 한국재료학회 2011년도 추계학술발표대회
• /
• pp.24.2-24.2
• /
• 2011

Ru is used as a bottom electrode capacitor in dynamic random access memories (DRAMs) and ferroelectric random access memories (FRAMs). The surface of the Ru needs to be planarized which is usually done by chemical mechanical polishing (CMP). Ru CMP process requires chemical slurry consisting of abrasive particles and oxidizer. A slurry containing NaIO4 and alumina particles is already proposed for Ru CMP process. However, the stability of the slurry is critical in the CMP process since if the particles in the slurry get agglomerated it would leave scratches on the surface being planarized. Thus, in the present work, the stability behavior of the slurry using a suitable anionic polyelectrolyte is investigated. The parameters such as slurry pH, polyelectrolyte concentration, adsorption time and the sequence of addition of chemicals are optimized. The results show that the slurry is stable for longer time at an optimized condition. The polishing behavior of the Ru using the optimized slurry is also investigated.

• 한국세라믹학회지
• /
• 제36권6호
• /
• pp.625-631
• /
• 1999

Ceramic tapes were fabricated by ultrasonically spraying slurries of monodispersed spherical and alumina powders. Effects of slurry compositions on tape forming were investigated. A relatively fast rate of solvent evaporation caused pores and cracks to be formed. A good chemical affinity between solvent and binder gave rise to binder separation resulting in inhomogeneous distribution of binder. Defect-free silica tapes with uniform distribution of particle packing and the binder were obtained from the solvent having a low chemical affinity and a slow evaporation rate and containing appropriate amounts of the binder and the plasticizer. Tape thickness could be controlled by adjusting solids loadings and slurry feed rates. It was possible to fabricate a tape in 15 $\mu\textrm{m}$ thickness from 7 vol% alumina slurry.

• 한국세라믹학회지
• /
• 제50권6호
• /
• pp.528-532
• /
• 2013

Well-dispersed slurries of submicron-sized alumina powders were pressure-infiltrated in 3D preforms of mullite fibers and the effects of the particle size and infiltration pressure on the particle packing characteristics were investigated. Infiltration without pressure showed that the packing density increased as the particle size decreased due to the reduction of the friction between the particles and the fibers. The infiltrated preforms contained large pores in the large voids between the fiber tows and small pores in the narrow voids between the individual fibers. Pressure infiltration resulted in a packing density of 77% regardless of the particle size or the infiltration pressure(210 ~ 620 kPa). Pressure infiltration shortened the infiltration time and eliminated the large pores in preforms infiltrated with the slurries of smaller particles. The slurry pressure-infiltration process is thus an efficient method for the packing of matrix materials in various preforms.

• 한국정밀공학회지
• /
• 제19권8호
• /
• pp.134-140
• /
• 2002

Chemical mechanical polishing of aluminum and photoresist using colloidal silica-based slurry was experimented. The effects of slurry pH, silica concentration, and oxidizer ($H_2O_2$) concentration on surface roughness and removal rate were studied. The optimum slurry conditions for reduction of micro-scratch were investigated. The optimum chemical mechanical polishing with the colloidal silica-based slurry was compared with conventional chemical mechanical polishing with alumina-based slurry. Chemical mechanical polishing of the aluminum with the colloidal silica-based slurry showed improved result but chemical mechanical polishing of the photoresist did not. The improved result was comparative with that of chemical mechanical polishing with filtered alumina-based slurry which one of desirable methods to reduce the micro-scratch.

• 한국전기전자재료학회논문지
• /
• 제14권12호
• /
• pp.979-986
• /
• 2001

This paper was researched the effect of slurry stability on the mechanical and electrical property of the porcelain insulator with various raw materials such as feldspar, quartz, clay and l7wt% alumina. The slurry was fabricated after ball milling the mixed raw materials. Green compacts were made by the extrusion and were sintered at 1300$\^{C}$ for 60min in the tunnel kiln. All of the specimens were densified 96% of the theoretical density. The 3-point flexural strength($\sigma$$\_$B/) of the specimen stabilized slurry pH 7.8 was 1650 k9/㎠ and the vickers hardness(Hv) and the fracture toughness(K$\_$IC/) were 27.5 GPa and 2.2 MPa$.$m$\^$$\sfrac{1}{2}$/, respectively. The mechanical properties of the specimen stabilized slurry PH 9.3 were 1716 kg/㎠($\sigma$$\_$B/), 27.6 GPa(Hv) and 3.0 MPa$.$m$\^$$\sfrac{1}{2}$/(K$\_$IC/), respectively. The dielectric strength was increased from 8.3kV/mm to 13.2kV/mm as the increase of the slurry pH from 7.8 to 9.3. Therefore the physical properties of the specimen stabilized slurry pH 9.3 were improved.