• 치위생과학회지
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• 제23권4호
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• pp.245-254
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• 2023

Background: This study aimed to determine the skeletal and dental effects in pediatric and adolescent Korean patients with Class II Division 1 malocclusion treated using the Invisalign Mandibular Advancement (MA^®) appliance. Methods: The study included patients aged 6 to 18 years who received orthodontic treatment with the MA^® appliance for Class II Division 1 malocclusion at the Department of Pediatric Dentistry, Wonkwnag University Daejeon Dental Hospital, between July 1, 2018, and December 31, 2021. The treatment group consisted of 20 patients, 10 boys and 10 girls. The control participants were also 10 boys and 10 girls. Lateral cephalometric radiographs were taken before and after treatment, and 41 measurements of skeletal and dental changes were measured and analyzed using the V-Ceph^TM 8.0 (Osstem Implant). All analyses were performed using SPSS software (IBM SPSS for Windows, ver 26.0; IBM Corp.), and statistical significance was tested using paired and independent samples t-tests for within-group and between-group comparisons, respectively. Results: The patients in the treatment group showed significant decreases in ANB (A point, Nasion, B point), maxillary protrusion, maxillary anterior incisor labial inclination, and maxillary protrusion after treatment. However, when compared with the growth changes observed in the control group, only ANB and maxillary protrusion decreased, with no significant differences in SNA, SNB, and mandibular length. Conclusion: Collectively, the results of this study confirm that the use of MA^® appliance in pediatric and adolescent Korean patients with Class II Division 1 malocclusion results in a reduction of anteroposterior skeletal and dental disharmony.

• 한국전기전자재료학회논문지
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• 제15권4호
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• pp.301-307
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• 2002

Direct bonded SOI wafer pairs with $Si ll SiO_2/Si_3N_4 ll Si$ the heterogeneous insulating layers of SiO$_2$-Si$_3$N$_4$are able to apply to the micropumps and MEMS applications. Direct bonding should be executed at low temperature to avoid the warpage of the wafer pairs and inter-diffusion of materials at the interface. 10 cm diameter 2000 ${\AA}-SiO_2/Si(100}$ and 560 $\AA$- ${\AA}-Si_3N_4/Si(100}$ wafers were prepared, and wet cleaned to activate the surface as hydrophilic and hydrophobic states, respectively. Cleaned wafers were pre- mated with facing the mirror planes by a specially designed aligner in class-100 clean room immediately. We employed a heat treatment equipment so called fast linear annealing(FLA) with a halogen lamp to enhance the bonding of pre mated wafers We kept the scan velocity of 0.08 mm/sec, which implied bonding process time of 125 sec/wafer pairs, by varying the heat input at the range of 320~550 W. We measured the bonding area by using the infrared camera and the bonding strength by the razor blade clack opening method, respective1y. It was confirmed that the bonding area was between 80% and to 95% as FLA heat input increased. The bonding strength became the equal of $1000^{\circ}C$ heat treated $Si ll SiO_2/Si_3N_4 ll Si$ pair by an electric furnace. Bonding strength increased to 2500 mJ/$\textrm{m}^2$as heat input increased, which is identical value of annealing at $1000^{\circ}C$-2 hr with an electric furnace. Our results implies that we obtained the enough bonding strength using the FLA, in less process time of 125 seconds and at lowed annealing temperature of $400^{\circ}C$, comparing with the conventional electric furnace annealing.

• 대한심미치과학회지
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• 제27권2호
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• pp.82-96
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• 2018

3D 프린팅은 삼차원 이미지 정보를 이용하여 레이어로 분할한 후 선택한 소재를 적층하여 가공하는 방법을 말한다. 소재를 적층하는 방법에 따라 다양한 종류의 3D 프린팅이 존재하는데 최근 치과분야에서는 SLA방식과 DLP방식으로 광원을 이용한 경화를 통해 적층 가공하는 3D 프린팅이 널리 보급되어 사용되고 있다. 전악 범위의 3D프린팅 치과용 모델은 전통적인 인상 채득으로 제작된 스톤모델보다는 다소 정확성이 부족한 것으로 보고되었으나, 같은 STL파일을 이용하여 4분악 범위를 3D 프린팅한 모델은 밀링 방법으로 가공한 모델보다 정확하였다. 디자인 소프트웨어의 활용도에 따라 보철치료의 진단, 임시 보철물의 제작, 의치의 제작이 가능하였다. 교정에서는 투명 교정 모델과 브라켓 간접 부착을 위한 트레이 제작이 가능하였다. 임플란트 수술에 있어서 CT를 기반으로 한 정확한 위치에 임플란트를 식립하는 가이드 제작에 활용하고 있다. 출력 방식의 발전으로 인하여 3D 프린터의 출력시간이 계속적으로 단축되고 있으며, 이로 인해 치과 진료실 내에서 3D 프린터가 기존의 전통적인 가공 방법을 대체할 수 있을 것으로 기대한다.