• Journal of Korea Foundry Society
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• v.30 no.2
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• pp.76-82
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• 2010

Effect of reaction time and sludge formation on the thickness of die soldering reaction layer has been studied in Al-9Si-0.3Mg casting alloy. Ternary ${\alpha}_{bcc}-Al_8Fe_2Si$ and ${\alpha}_{hcp}-Al_8Fe_2Si$ intermetallic compounds formed at the interface of SKD61 tool steel by interaction diffusion of Al, Fe and Si atoms after 0.5hr and 6hr immersion time, respectively. Binary ${\eta}-Fe_2Al_5$ additionally formed at the interface of SKD61 tool steel after 10hr immersion time. Thickness of soldering reaction layer in die surface increased as immersion time increased from 0.5hr to 24hr. Sludge formation was ascertained in the samples which were immersed in the melts more than 10hr. Reaction of die soldering after sludge formation was more accelerated than that of before sludge formation due to a decrease in Fe content, followed by higher diffusion rate of Al in the melt by sludge formation.

• Journal of Powder Materials
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• v.2 no.3
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• pp.238-246
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• 1995

The purpose of this study is to establish powder metallurgy (P/M) fabrication processes for high performance 2XXX Al composites reinforced with SiC whiskers. Rapidly solidified 2XXX Al powders produced by commercial atomization technique were mixed with SiC whiskers. The results of mixing processes indicated that fluidized zone mixing technique was considerably effective for the large scale production of the mixture of Al powders and whiskers. In order to consolidate these $Al-SiC_w$ mixtures into $Al-SiC_w$ composite billets, a vacuum hot press was set up, and hot processing variables were investigated. Using the hot pressing temperature of $620^{\circ}C$ under the pressure of 50 MPa, good quality $Al-SiC_w$ composite billets having relatively homogeneous microstructure and sound Al/sic interfacial bonding were obtained. Composite billets were then extruded to bars having relatively homogeneous microstructures at the extrusion temperature of 450~500$^{\circ}C$ under the extrusion pressure of 700~ 1000 MPa. Mechanical properties of the extruded bars were found to be comparable with those of the composite processed by Advanced Composite Materials Corp. To improve mechanical properties of the composites, elimination of coarse intermetallic compounds, uniform distribution of reinforcements, and minimization of whisker breakage are suggested.

• Journal of the Korean Society for Heat Treatment
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• v.13 no.6
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• pp.391-397
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• 2000

Addition of Ca element and nonequilibrium heat treatment which promotes shape modification of eutectic Si and ${\beta}$ intermetallic compound were conducted to improve the mechanical properties of Al-Si-Cu alloy. Modification of eutectic Si and dissolution of needle-shape ${\beta}$ intermetallic compounds were possible by nonequilibrium heat treatment in which specimens were held at $505^{\circ}C$ for 2 hours in Al-Si-Cu alloy with Fe. Owing to the decrease in aspect ratio of eutectic Si by the heat treatment of the alloy with 0.33wt.% Fe, the increase in elongation was prominent to be more than double that in the as-cast specimen. Dissolution of needle-shape ${\beta}$ intermetallic compounds in the alloy with 0.85wt.% Fe led to the improvement of tensile strength as the length of ${\beta}$ compounds decreased to 50%.

• Transactions of Materials Processing
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• v.9 no.4
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• pp.389-394
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• 2000

The studies on gram size refinement for rheocast processing of hypereutectic Al-18%Si alloys have been investigated in the present study. To increase the efficiency of mechanical stirring, sieve type stirrer are newly designed and implemented for rheocasting of hypereutectic Al-18%Si alloy. Mechanical stirring of semi-solid slurry by using sieve type mechanical stirrer results in morphological changes of the primary Si particles, from angular rod shape to near spherical shape and uniform distribution of proeutectic Si. The remarkable spheroidization of Primary Si Particles and distributional uniformity of proeutectic Si show well the efficiency of sieve type mechanical stirring method which can accelerate the coalescence-fracture-wear of the individual particles by strong turbulent flow between lattices during rotation of sieve type stirrer.

• Journal of Korea Foundry Society
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• v.41 no.5
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• pp.419-433
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• 2021

Al-Si-Cu alloys benefit from the addition of copper for better hardness and strength through precipitation hardening, which results in remarkably strong alloys. However, the addition of copper expands the solidification range of Al-Si-Cu alloys, and due to this, these alloys become more prone to hot tearing, which is one of the most common and serious fracture phenomena encountered during solidification. The conventional evaluation method of the hot tearing properties of an alloy is a relative and qualitative analysis approach that does not provide quantitative data about this phenomenon. In the present study, the mold itself part of a device developed in Instone et al. was partially modified to obtain more reliable quantitative data pertaining to the hot tearing properties of an Al-Si-Cu casting alloy. To assess the influence of Cu element, four levels of Cu contents were tested (0.5, 1.0, 3.0, and 5.0 wt.%) in the Al-Si-Cu system alloy and the hot tearing properties were evaluated in each case. As the Cu content was increased, the hot tearing strength decreased to 2.26, 1.53, 1.18, and 1.04 MPa, respectively. At the moment hot tearing occurred, the corresponding solid fraction and solidification rate decreased at the same temperature due to the increase in the solid-liquid coexistence range as the Cu content increased. The morphology of the fracture surfaces was changed from dendrites to dendrites covered with residual liquid, and CuAl₂ phases were observed in the vicinity of hot tearing.

• Journal of the Korean Vacuum Society
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• v.3 no.1
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• pp.59-64
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• 1994

극소전자 디바이스의 고집적화와 더불어 박막배선의 선폭은 0.5$\mu$m이하까지 축소되며 초고집적 submicron 박막금속화가 진행되고 있다. 미세회로에 적용되어지는 배선재료는 인가되는 고전류밀도로 인하여 electromigration 에 의한 결함이 쉽게 발생한다는 단점이있다. 금속박막 전도체위의 dielectric overlayer는 electromigration 에 대한 passivation 효과를 보여 극소전자 디바이스의 평균수명을 향상시 킨다.본 연구에서는 박막금속화에서 dielectric overlayer의 passivation 효과를 알아보기 위하여 약 3000 $\AA$ 두께의 Al,Al-1%Si, Ag 그리고 Cu 박막배선위에 증착하여 SiO2절연보호막의 유무에 따른 박막배선 의 수명변화 및 신뢰도를 측정하였다. 박막배선에 인가된 전류밀도는 1x106 A/cm2와 1x107 A/cm2 이었다. SiO2 dielectric overlayer는 Al,Al-1%Si Ag. Cu 박막배선에서는 electromigration에 대한 보호막 혀과를 보이며 평균수명을 모두 향상시킨다. SiO2 passivation 효과는 Al, Ag, Cu 박막중 Cu 박막배선에서 가 장 크게 나타났다. SiO2 dielectric overlayer가 형성되지 않은 경우 Al 박막배선의 수명이 가장 긴 것으 로 나타났으나 SiO2 가 형성된 경우는 Cu 박막배선의 수명이 가장 길게 나타났다.

• Journal of Powder Materials
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• v.12 no.4 s.51
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• pp.296-302
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• 2005

In order to improve mechanical properties, the hypereutectic Al-20 wt%Si based prealloy powder was prepared by gas atomization process. Microstructure and compressibility of the atomized Al-Si powder were investigated. The average powder size was decreased with increasing the atomization gas pressure. Size of primary Si particles of the as-atomized powder was about $5-8\;\mu{m}$. The as-atomized Al-Si powder such as AMB 2712 and AMB 7775 to increase compressibility and sinterability. Relative density of the mixed powder samples sintered at $600^{\circ}C$ was reached about 96% of a theoretical density.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.10a
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• pp.89-92
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• 2004

This paper is concerned with the drawing process of Al-Si wire. In this study, the finite-element model established in previous work was used to analyze the effects of various forming parameters, which included the reduction in area, the semi-die angle, the aspect ratio and the inter-particle spacing of the Si in drawing processes. The finite-element results gave the consolidation condition. From the results of analysis, the effects of each forming parameter were determined. It is possible to obtain the important basic data which can be guaranteed in the fracture prevention of Al-Si wire by using FEM simulation.

• Journal of Korea Foundry Society
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• v.15 no.3
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• pp.262-271
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• 1995

It is well known what is impossible to refine primary and eutectic Si simultaneously by addition of both Cu-P and Sr(or Na). Because of the formation of compound $Sr_3P_2(or Na_3P)$ in the melt, in the result, both effects disappear. In this study Al-Cu-P alloy that comprises AlP compounds inside is added in the melt with Sr simultaneously. As AlP compounds that act on nucleation sites of primary Si are not formed but added directly an the melt, it is difficult to form $Sr_3P_2$ by reaction with Sr. Therefore it is possible to refine primary and eutectic Si simultaneously in the general casting process by use of Al-Cu-P alloy and Sr.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2002.04b
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• pp.11-11
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• 2002

Plastic deformation was observed by TEM around the intragranular SiC particles in the $Al_2O_3$ matrix for $Al_2O_3/SiC$ nanocomposite system. The dislocations are generated at selected planes and there is a tendency for the dislocations to form a subgrain boundary structure with low-angel grain boundaries and networks. In this study, dislocation generated in the $Al_2O_3$ matrix during cooling down from sintering temperatures by the highly localized thermal stresses within and/or around SiC particles caused from the thermal expansion mismatch between $Al_2O_3$ matrix and SiC particle was observed. In monolithic $Al_2O_3$ and $Al_2O_3/SiC$ microcomposite system. These phenomena is closely related to the plastic relaxation of the elastic stress and strain energy associated with both thermal misfitting inclusions and creep behaviors. The plastic relaxation behavior was explained by combination of yield stress and internal stress.