• 한국수소및신에너지학회논문집
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• 제18권3호
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• pp.334-341
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• 2007

Al film(135.5 nm thick) with Pd film(39.6 nm thick) was made by thermal evaporation method. Electrical resistance change by hydrogen absorption and desorption was measured with four point measurement method. Even though Al film(135.5 nm thick) did not absorb any hydrogen at room temperature, Al/Pd film absorbed hydrogen at upto 640 torr pressure. Hydrogen absorption kinetics was monitored by measuring resistance change of the sample in the temperature range from $25^{\circ}C$ to $40^{\circ}C$. Absorption activation energy of Al/Pd film was about 10.7 and 17.7 kcal/mol H for 1st stage and last stage respectively at 1 torr hydrogen pressure. This activation values are bigger than that of Pd film, but are much less than that of Al film. This result indicates there is possibility that Al can be storage material for hydrogen by using Pd film evaporation on it.

• 한국전기전자재료학회논문지
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• 제17권4호
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• pp.422-425
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• 2004

In this study, the AZO thin films were prepared as a function of oxygen gas flow ratio at room temperature by FTS(Facing Targets Sputtering) apparatus using Zn:Al(metal)-Zn:Al(metal) or Zn(metal)-ZnO:Al(ceramic). The film thickness, crystalline and electric properties of AZO thin film was evaluated by $\alpha$-step, XRD and 4-point probe. In the results, the resistivity of AZO thin film was shown the lowest value about 8${\times}$10$^{-2}$ $\Omega$-cm(Zn:Al-Zn:Al), 3${\times}$10$^{-1}$ $\Omega$-cm(Zn-ZnO:Al) at the oxygen gas flow ratio 0.3. And the AZO thin film has good crystalline at oxygen gas flow ration 0.4, using Zn:Al-Zn:Al targets.

• 대한화학회지
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• 제54권4호
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• pp.380-386
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• 2010

황산 용액에서 양극산화(anodization)에 의하여 생성되는 산화피막의 생성과정(growth kinetics)과 이 피막의 전기적 성질을 전기화학적 임피던스 측정법(electrochemical impedance spectroscopy)으로 조사하였다. 산화피막은 $Al_2O_3$로 점-결함 모형(point defect model)에 따라 성장하였으며, n-형 반도체의 전기적 성질을 보였다.

• Current Photovoltaic Research
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• 제1권2호
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• pp.103-108
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• 2013

Epitaxial growth of a high-quality thin Si film is essential for the application to low-cost thin-film Si solar cells. A polycrystalline Si film was grown on a $SiO_2$ substrate at $450^{\circ}C$ by a Al-assisted crystal growth process. For the purpose, a thin Al layer was deposited on the $SiO_2$ substrate for Al-assisted crystal growth. However, the epitaxial growth of Si film resulted in a rough surface with humps. Then, we introduced a thin amorphous Si seed layer on the Al film to minimize the initial roughness of Si film. With the help of the Si seed layer, the surface of the epitaxial Si film was smooth and the crystallinity of the Si film was much improved. The grain size of the $1.5-{\mu}m$-thick Si film was as large as 1 mm. The Al content in the Si film was 3.7% and the hole concentration was estimated to be $3{\times}10^{17}/cm^3$, which was one order of magnitude higher than desirable value for Si base layer. The results suggest that Al-doped Si layer could be use as a seed layer for additional epitaxial growth of intrinsic or boron-doped Si layer because the Al-doped Si layer has large grains.

• 한국전기전자재료학회논문지
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• 제14권5호
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• pp.435-443
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• 2001

As power durable RF SAW filters, AL-(0∼2wt%)Cu alloy multi-layered thin electrodes were deposited on 42° LiTaO$_3$ piezoelectric substrates by magnetron sputtering process, and then ladder-type RF SAW filters, satisfying the electrical specification of CDMA transmission band, were fabricated through optimizing SAW resonator structures. The temperature of film electrodes in SAW filter was increased with RF power, and reached the maxima to cause a failure of SAW filters at the cut-off frequencies of the RF filter band. As RF power increases, the electrodes of Al-Cu alloy showed higher power durability than that of pure Al. The multi-layer laminated film of Al-1wt.% Cu/Cu/Al-1wt%Cu resulted in the best power durability up to 4W of RF power. Every film electrode, however, was destroyed within seconds whenever applying a critical RF power to SAW filters, regardless of the composition and structure of film electrodes. The breakdown of film electrodes under FR power seems to believe due to the fatigue of electrodes caused by repetitive cyclic stress of surface acoustic wave, which is amplified as RF power increases.

• 한국세라믹학회지
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• 제54권3호
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• pp.249-256
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• 2017

We design Ge-Al multilayer assemblies as anode materials for Li-ion batteries, in which Ge and Al thin films are alternately deposited by a radio sputtering method. By sandwiching Ge layers between Al layer, the cyclability, rate capability, and capacity of Ge are improved significantly. The success of the Ge-Al multilayer is attributed to the Al films. To maintain the integrity of electrical contact, Al acts as an elastic layer, which can expand or shrink with the Ge film upon lithiation or delithiation. In addition, the presence of the Al film on the surface can prevent direct contact of Ge and electrolyte, thereby reducing the growth of a SEI layer. Importantly, with high electrical and ionic conductivities, the Al film provides efficient electrical and ionic routes for electrons and Li-ions to access the Ge film, promoting a high specific capacity and high rate capability for Ge.

• 한국수소및신에너지학회논문집
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• 제17권2호
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• pp.234-240
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• 2006

Al film(135.5 nm thick) with Pd film(39.6 nm thick) on the top of it was made by thermal evaporation method. Hydrogen absorption of Al/Pd film was measured by quartz crystal microbalance(QCM) method at room temperature. The sample was activated by hydrogen absorption and desorption cycling at room temperature. Hydrogen was introduced into the film by increasing hydrogen gas pressure step by step up to 640 torr at room temperature. Hydrogen concentration reached up to 25% at $5{\sim}10$ torr. But at high pressure the concentration decreased. This strange tendency was not understood yet. Further study is needed to find out the mechanism of hydrogen absorption in Al in Al/Pd film.

• 한국표면공학회지
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• 제1권1호
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• pp.14.1-18
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• 1967

The characteristics of sulfuric acid anodized layer was studied under various Conbitions, acid concentration : 5-20%, temperature : 5-25$^{\circ}C$, bath voltate : 16 volts , bath agitain : mech agitation : mechanical . The Al+++ ion increase in anodizing baty, the film thickness under microscope, the comparative porosity and the thickness were determined. It was found that film thickness and the porosithy which are the main factors of determining andoized layet quality, rule the corrosing and abrasiion tesistance of the film, and that the porosity is increasing in the outerlayer. The formation mechanism was assumed as follows : The film thickness -increase is due to OH_ ion diffusion into compact non-conductive layer and Al+ + OH_ \longrightarrowAl(OH), Al(OH)+ + OH_ \longrightarrowAl(OH)+$_2$ , Al(OH)+$_2$ + OH_ \longrightarrowAl(OH)$_3$., the strong adhesion force is alse due to Al(OH) or Al(OH)$_2$ in transtion layer. And the pore-nucleation is produced by volume change between Al and Al$_2$O$_3$ and activated H$_2$O gas created by large reaction heat of Al+(x) +OH_ \longrightarrowAl(OH)x.

• 한국진공학회지
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• 제8권1호
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• pp.31-35
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• 1999

본 연구에서는 반도체 소자에서 일렉트로마이그레이션에 기인하는 Al-1%Si 박막배선의 길이 변화에 따른 수명시간 의존도를 조사하였다. 사용된 Al-1%Si 박막배선은 표준 사진식각 공정(standard photolithography process)을 사용하여 제작된 직선형 패턴이다. 직선형 패턴은 100에서 1600 $mu extrm{m}$ 범위의 길이 변화를 갖도록 제작하였다. Ti underlayer가 없는 시편보다 Ti underlayer가 있는 시편에서 Al-1%Si 박막배선의 수명시간이 더 길게 나타났다. Ti underlayer를 갖는 시편에서 electromigration에 대한 저항성을 향상시키는 것으로 사료되어진다. Al-1%Si 박막배선의 길이에 의존하는 수명시간은 800$\mu\textrm{m}$ 이하에서 포화되는 경향을 나타내었다.

• 한국재료학회지
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• 제14권5호
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• pp.328-333
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• 2004

Transparent ZnO:Al conductor films for the optoelectronic devices were deposited by using the capacitively coupled DC magnetron sputtering method. The effect of Al doping concentration and discharge power on the electrical and optical properties of the films was studied. The film resistivity of $8.5${\times}$10^{-4}$ $\Omega$-cm was obtained at the discharge power of 40 W with the ZnO target doped with 2 wt% $Al_2$$_O3$. The transmittance of the 840 nm thick film was 91.7% in the visible waves. Increasing doping concentration of 3 wt% $Al_2$$O_3$ in ZnO target results in significant decrease of film resistivity, which may be due to the formation of $Al_2$$O_3$ particles in the as-deposited ZnO:Al film and the reduced ZnO grain sizes. Increasing DC power from 40 to 60 W increases deposition rate by more than 50%, but can induce high defect density in the film, resulting in higher film resistivity.