• 제목/요약/키워드: Al/SiC 복합재료

검색결과 198건 처리시간 0.027초

강화상의 분율에 따른 알루미늄기 복합재료의 마모거동 (Wear Behavior of Al-based Composites according to Reinforcements Volume Fraction)

  • 이광진;김균택;김영식
    • 동력기계공학회지
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    • 제15권5호
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    • pp.77-82
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    • 2011
  • SiC particulate reinforced Al matrix composites with different SiC volume fractions were fabricated by thermal spray process. And the dry sliding wear test were performed on these composites using the applied load of 10 N, rotational speed of 30 rpm, radius of rotation 15 mm. Wear tracks on the Al/SiC composites were investigated using scanning electron microscope(SEM) and energy dispersive spectroscopy (EDS). It was observed that wear behavior of Al/SiC composites and formation of MML was changed dramatically according to reinforcement volume fraction.

반응용융 침투법에 의한 $Al_2O_3/AL$복합재료의 제조 및 기계적 특성 평가 (Fabrication and mechanical properties of $Al_2O_3/AL$ composites by reactive melt infiltration)

  • 윤여범;김송희;태원필
    • 한국결정성장학회지
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    • 제7권4호
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    • pp.610-618
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    • 1997
  • 반응용침법으로 제조된 $Al_2O_3$/Al 복합재료는 900-$1200^{\circ}C$의 온도범위에서 $Al_2O_3$ 분말성형체에 용융Al을 침투시켜 제조하였다. 용융침투는 각 온도에서 잠복기를 거친후 발생하였으며, 복합재료의 성장속도는 시간에 따라 선형적으로 비례하였다. 제조된 복합재료의 주성분은 $Al_2$O$_3$와 Al이었고 소량의 Si이 탐지되었다. 복합재료의 상대밀도는 $Al_2O_3$ 입자크기가 증가함에 따라 증가하였고 용융 침투온도가 높을수록 감소하였다.

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전자패키징용 금속복합재료의 제조공정 해석 및 충격특성평가 (Fabrication Process and Impact Characteristic Analysis of Metal Matrix Composite for Electronic Packaging Application)

  • 정성욱;정창규;남현욱;한경섭
    • Composites Research
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    • 제15권1호
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    • pp.32-40
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    • 2002
  • 가압주조법을 이용하여 전자 패키징용 고부피분율 $SiC_p/Al$ 금속복합재료를 제조하였다. $SiC_p$ 예비성형체를 제조하기 위하여 예비성형체 금형을 고안하였으며, $Al_2O_{3f}$섬유 보강재를 $SiC_p$ 입자 보강재의 1/10비율로 첨가하고, 무기 성형제($SiO_2$)를 0.8% 이하로 사용하여 49~70 vol.% 의 예비성형체 제작에 성공하였다. 제조된 고부피분율 예비성형체로 금속용탕을 원활히 침투시키기 위해 온도, 가압력 등의 제조조건을 정하였으며, 이러한 새로이 고안된 금형조건을 FEM 열전도 해석에 도입하여 금속복합재료 제조시 몰드 내부에서 발생하는 온도변화를 분석하였다. 제조된 금속복합재료에 대해서는 충격특성 및 열팽창계수 특성평가를 실시하였다. 본 연구를 통해 제조된 금속복합재료의 충격흡수 에너지는 0.2~0.3J, 열팽창계수는 $8~10ppm/^{\circ}C$, 밀도는 $2.9~3.0g/cm^3$로 나타나 패기징 재료로서 적합한 특징을 가진 복합재료가 성공적으로 개발되었음을 확인하였다.

보강재에 도금된 Cu층이 Al/SiC복합재료의 젖음성에 미치는 영향 (Wetting improvement of SiC/Al Metal Matrix Composite by Cu Surface Treatment)

  • 이경구;조규종;이도재
    • 한국재료학회지
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    • 제11권5호
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    • pp.398-404
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    • 2001
  • SiC 보강재 표면에 도금된 Cu금속층이 Al/SiC복합재료의 젖음성에 미치는 영향을 검토하였다. 보강재에 대한 금속층의 도금은 무전해도금법을 이용하였으며, Al/SiC 복합재료의 제조는 텅스텐 발열체 진공로의$ 670^{\circ}C$~$900^{\circ}C$에서 제조하여 보강재와 기지간의 접촉부위를 촬영하여 젖음성을 측정하였다 젖음성 측정 결과 보강재에 도금된 Cu층은 젖음성을 향상시켰고, 젖음성의 개선은 보강재에 도금된 금속층과 기지간의 반응에 의해 계면에너지를 변화시킴으로서 나타난 결과이며. 반응을 통한 산화피막의 배제도 영향을 미친 것으로 판단된다

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전자 패키징용 금속복합재료의 온도에 따른 열팽창 특성 (Analysis of Temperature dependent Thermal Expansion Behavior in MMCs for Electronic packaging)

  • 정성욱;남현욱;정창규;한경섭
    • 한국복합재료학회:학술대회논문집
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    • 한국복합재료학회 2002년도 춘계학술발표대회 논문집
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    • pp.73-76
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    • 2002
  • This study developed SiC/Al composites for electronic packaging to which reinforcements were added with the volume fractions of 49%, 56% and 63% by the squeeze casting method. 0.8 wt.% of the inorganic binder as well as the $Al_2O_3$ fiber and SiC particles with the volume fraction of 1:10 were added to the SiC/Al composites For the produced SiC/Al composites, the CTEs (coefficients of thermal expansion) were measured from 30 to $300^{\circ}C$ and compared with the FEM numerical simulation to analyze the temperature dependent properties. The experiment showed the CTEs of SiC/Al composites that were intermediate values of those of Rule of Mixture and Turner's Model. The CTEs were close to Turner's Model in the room temperature and approached the Rule of Mixture as the temperature increases. These properties analyzed from the difference of the average stress acting between the matrix and the reinforcements proposed in this study

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SiC 휘스커 강화 Al2O3 복합재료의 고인화 (Toughening of SiC Whisker Reinforced Al2O3 Composite)

  • 김연직;송준희
    • 한국재료학회지
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    • 제14권9호
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    • pp.649-654
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    • 2004
  • In this paper, the fracture toughness and mechanisms of failure in a random SiC-whisker/$Al_{2}O_3$ ceramic composite were investigated using in situ observations during mode I(opening) loading. $SiC_{w}/Al_{2}O_3$ composite was obtained by hot press sintering of $Al_{2}O_3$ powder and SiC whisker as the matrix and reinforcement, respectively. The whisker and powder were mixed using a turbo mill. The composite was produced at SiC whisker volume fraction of $0.3\%$. Compared with monolithic $Al_{2}O_3$, fracture toughness enhancement was observed in $SiC_{w}/Al_{2}O_3$ composite. This improved fracture toughness was attributed to SiC whisker bridging and crack deflection. $SiC_{w}/Al_{2}O_3$ composite exhibited typically brittle fracture behavior, but a fracture process zone was observed in this composite. This means that the load versus load-line displacement curve of $SiC_{w}/Al_{2}O_3$ composite from a fracture test may involve a small non-linear region near the peak load.

전자패키지용 경사조성 Al-$SiC_{p}$ 복합재료의 열 . 기계적 변형특성 해석 (Thermomechanical Analysis of Functionally Gradient Al-$SiC_{p}$ Composite for Electronic Packaging)

  • 송대현;최낙봉;김애정;조경목;박익민
    • 한국복합재료학회:학술대회논문집
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    • 한국복합재료학회 2000년도 춘계학술발표대회 논문집
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    • pp.175-183
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    • 2000
  • The internal residual stresses within the multilayered structure with shan interface induced by the difference in thermal expansion coefficient between the materials of adjacent layers often provide the source of failure such as delamination of interfaces and etc. Recent development of the multilayered structure with functionally graded interface would be the solution to prevent this kind of failure. However a systematic thermo-mechanical analysis is needed fur the customized structural design of multilayered structure. In this study, theoretical model for the thermo-mechanical analysis is developed for multilayered structures of the Al-$SiC_p$ functionally graded composite for electronic packaging. The evolution of curvature and internal stresses in response to temperature variations is presented for the different combinations of geometry. The resultant analytical solutions are used for the optimal design of the multilayered structures with functionally graded interface as well as with sharp interface.

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