• Journal of Powder Materials
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• v.7 no.1
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• pp.12-18
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• 2000

Effects of the microstrucrure of rapidy solidified Al-Pb-Cu-Mg alloys on the wear investigated. In order to overcome the miscility gap between Al and pb under equilibrium conditions, both in the solid and the liquid states, the alloy were rapidy solidifies to produce them in a segregation-free condition. Although the Pb particles showed relatively fine dispersion in the Al matrix in all the alloys by this process. the Al-16Pb alloy was found to have the most favorable microstructure with discretre with discrete Pb particles of abount 0.5 ${\mu}$m in size. With the addition of Cu and Cu-Mg to Al-16Pb, cellular structures were newly formed; not seen in the binary Al-Pb alloy. Wear properties of the Al-Pb binary alloys measured as a function of the sliding speen, sliding distance, and applied load showed that the Al-16Pb alloy has the best wear resistance, as expected from the fine microstructural features in this alloy. The were resistance of the alloy containing Cu-and Cu-Mg was higher than that of the Al-16Pvb alloy, due to matrix strengthening by precipitation hardeing. The wear mechanism was identified by examining the traces and wear debris.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.53-53
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• 2011

As the dimension of Cu interconnects has continued to reduce, its resistivity is expected to increase at the nanoscale due to increased surface and grain boundary scattering of electrons. To suppress increase of the resistivity in nanoscale interconnects, alloying Cu with other metal elements such as Al, Mn, and Ag is being considered to increase the mean free path of the drifting electrons. The formation of Al alloy with a slight amount of Cu broadly studied in the past. The study of Cu alloy including a very small Al fraction, by contrast, recently began. The formation of Cu-Al alloy is limited in wet chemical bath and was mainly conducted for fundamental studies by sputtering or evaporation system. However, these deposition methods have a limitation in production environment due to poor step coverage in nanoscale Cu metallization. In this work, gap-filling of Cu-Al alloy was conducted by cyclic MOCVD (metal organic chemical vapor deposition), followed by thermal annealing for alloying, which prevented an unwanted chemical reaction between Cu and Al precursors. To achieve filling the Cu-Al alloy into sub-100nm trench without overhang and void formation, furthermore, hydrogen plasma pretreatment of the trench pattern with Ru barrier layer was conducted in order to suppress of Cu nucleation and growth near the entrance area of the nano-scale trench by minimizing adsorption of metal precursors. As a result, superconformal gap-fill of Cu-Al alloy could be achieved successfully in the high aspect ration nanoscale trenches. Examined morphology, microstructure, chemical composition, and electrical properties of superfilled Cu-Al alloy will be discussed in detail.

• Applied Chemistry for Engineering
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• v.35 no.1
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• pp.1-7
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• 2024

Mn-M/Al₂O₃ (M = Cu, Fe, Co, and Ce) catalysts were prepared for simultaneous oxidation of NO, CO, and CH₄, and their oxidation activities were compared. The Mn-Cu/ Al₂O₃ catalyst with the best simultaneous oxidation activity was characterized by XRD, Raman, XPS, and O₂-TPD analysis. The result of XRD indicated that Mn and Cu existed as complex oxides in the Mn-Cu/Al₂O₃ catalyst. Raman and XPS results showed that electron transfer between Mn ions and Cu ions occurred during the formation of the Mn-O-Cu bond in the Mn-Cu/Al₂O₃ catalyst. The XPS O 1s and O₂-TPD analyses showed that the Mn-Cu/Al₂O₃ catalyst has more adsorbed oxygen species with high mobility than the Mn/Al₂O₃ catalyst. The high simultaneous oxidation activity of the Mn-Cu/Al₂O₃ catalyst is attributed to these results. Gas-phase NO promotes the oxidation reactions of CO and CH₄ in the Mn-Cu/Al₂O₃ catalyst while suppressing the NO oxidation reaction. These results were presumed to be because the oxidized NO was used as an oxidizing agent for CO and CH₄. On the other hand, the oxidation reactions of CO and CH₄ competed on the Mn-Cu/Al₂O₃ catalyst, but the effect was not noticeable because the catalyst activation temperature was different.

• Journal of Powder Materials
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• v.16 no.4
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• pp.280-284
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• 2009

The pressureless sintering behavior of $Al_2O_3$/Cu powder mixtures, prepared from $Al_2O_3$/CuO and $Al_2O_3$/Cu-nitrate, has been investigated. Microstructural observation revealed that $Al_2O_3$ powders with nano-sized Cu particles could be synthesized by hydrogen reduction method. The specimens, pressureless-sintered at $1400^{\circ}C$ for 4 min using infrared heating furnace with the heating rate of $200^{\circ}C$/min, showed the relative density of above 90%. Maximum hardness of 16.1 GPa was obtained in $Al_2O_3$/MgO/Cu nanocomposites. The nanocomposites exhibited the enhanced fracture toughness of 4.3-5.7 $MPa{\cdot}m^{1/2}$, compared with monolithic $Al_2O_3$. The mechanical properties were discussed in terms of microstructural characteristics.

• Transactions of Materials Processing
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• v.7 no.5
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• pp.465-473
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• 1998

The effect of alloying elements of Ag-Cu-Zr-X brazing alloy on the microstructure and the bond strength of $Al_2O_3/Ni-Cr$ brazed steel joint was investigated. The reaction layer, $ZrO_2$ (a=5.146 ${\AA}$ , b=5.213 ${\AA}$ , c=5.311 ${\AA}$ )was formed at the interface of $Al_2O_3/Ni-Cr$ steel joint by the redox reaction between alumina and Zr. The addition of An and Al to the Ag-Cu-Zr brazing alloy gave rise to changes in the thickness of the reaction product layer and the morphology of the brazement. Sn caused the segregation of Zr was decreased b Al the $ZrO_2$ layer formed at the Ag-Cu-Zr-Al alloy was thinner than that of $ZrO_2$ formed at the Ag-Cu-Zr-An alloy. The fracture shear strength was strongly dependent on the microstructure of the brazement. Brazing with Ag-Cu-Zr-Sn alloy resulted in a better bond strength than with Ag-Cu-Zr or Ag-Cu-Zr-Al alloy.

• Journal of the Korean Society for Heat Treatment
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• v.20 no.5
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• pp.243-249
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• 2007

The age hardening behavior and mechanical properties of an extruded Al-Zn-Mg-(Cu)-0.1 wt.%Sc alloy were investigated with the Sc addition and ageing temperature. The results showed that the $Al_3Sc$ compounds were formed by Sc addition and distributed preferentially along the extrusion direction. The age hardening of Al-Zn-Mg-Cu-0.1 wt.%Sc alloy which was treated by T6 process was more significant than that of Al-Zn-Mg-0.1 wt.%Sc alloy. The tensile property of Al-Zn-Mg-Cu+0.1 wt.%Sc alloy was also higher than that of Al-Zn-Mg-0.1 wt.%Sc alloy, which is 691 MPa and 584 MPa in strength and 9% and 11% in elongation, respectively.

• Journal of the Korean Society for Heat Treatment
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• v.14 no.2
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• pp.96-102
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• 2001

$Al_2O_3$-copper alloy has been successfully made by gas atomization, mechanical alloying and hot pressing. In order to investigate microstructure and phase, it has been studied by using scanning electron microscope, transmission electron microscope and X-ray diffractometor. Mechanical properties have been examined using hardness tester and compressive tester according to annealing temperature. Although comparatively large Cu-Al powders are milled, the reaction between Cu-Al and $Cu_2O$ occurs and very fine $Al_2O_3$ particles in the matrix particles (5-10nm) are obtained. Compressive strength of this alloy is more than that of GlidCop Al60.

• Journal of Fisheries and Marine Sciences Education
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• v.15 no.1
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• pp.115-122
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• 2003

Generally, material for radiator of automobile is composed of Al-alloy, but part of radiator material is still composed of Cu. Specially, Al-alloy replaces Cu and Cu-alloy as cooling and heating system material for light weight. Therefore, galvanic electronic cell is formed between Al-alloy and Cu for automobile radiator material, and Al-alloy corrosion is accelerated. So, in this study, galvanic corrosion test of Al-alloy coupling with Cu was carried out in distilled water, tap water, polluted environment and non-freezing solution. And thus corrosion potential and galvanic currrent density of Al-alloy coupling with Cu is investigated.

• Journal of the Korean Ceramic Society
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• v.32 no.1
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• pp.106-112
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• 1995

In order to examine the effect of CuO and Al2O3 addition on the electrical conductivity of ZnO, both Al2O3 (0, 1, 2, 5, 10at.%) and CuO (1, 5at.%) were added to ZnO. Al2O3 addition (~2at.% Al) increased the total electrical conductivity of ZnO which was already decreased by CuO doping effect Above solid solubility of Al (~2at.%), ZnAl2O4 formed and the total electrical conductivity decreased due to the decrease of sintered density. Impedance measurements were used to know the reason and degree of contribution of three resistive elements, ZnO grain, ZnO/CuO, and ZnO/ZnO grain boundaries, to the total electrical conductivity changed.

• Journal of Powder Materials
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• v.20 no.2
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• pp.114-119
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• 2013

In the DBC (direct bonding of copper) process the oxygen partial pressure surrounding the AlN/Cu bonding pairs has been controlled by Ar gas mixed with oxygen. However, the direct bonding of Cu with sound interface and good adhesion strength is complicated process due to the difficulty in the exact control of oxygen partial pressure by using Ar gas. In this study, we have utilized the in-situ equilibrium established during the reaction of $2CuO{\rightarrow}Cu_2O$ + 1/2 $O_2$ by placing powder bed of CuO or $Cu_2O$ around the Cu/AlN bonding pair at $1065{\sim}1085^{\circ}C$. The adhesion strength was relatively better in case of using CuO powder than when $Cu_2O$ powder was used. Microstructural analysis by optical microscopy and XRD revealed that the interface of bonding pair was composed of $Cu_2O$, Cu and small amount of CuO phase. Thus, it is explained that the good adhesion between Cu and AlN is attributed to the wetting of eutectic liquid formed by reaction of Cu and $Cu_2O$.