• Korean Journal of Materials Research
• /
• v.24 no.8
• /
• pp.429-433
• /
• 2014

As the fabrication technology used in FPDs(flat-panel displays) advances, the size of these panels is increasing and the pattern size is decreasing to the um range. Accordingly, a cleaning process during the FPD fabrication process is becoming more important to prevent yield reductions. The purpose of this study is to develop a FPD cleaning system and a cleaning process using a two-phase flow. The FPD cleaning system consists of two parts, one being a cleaning part which includes a two-phase flow nozzle, and the other being a drying part which includes an air-knife and a halogen lamp. To evaluate the particle removal efficiency by means of two-phase flow cleaning, silica particles $1.5{\mu}m$ in size were contaminated onto a six-inch silicon wafer and a four-inch glass wafer. We conducted cleaning processes under various conditions, i.e., DI water and nitrogen gas at different pressures, using a two-phase-flow nozzle with a gap distance between the nozzle and the substrate. The drying efficiency was also tested using the air-knife with a change in the gap distance between the air-knife and the substrate to remove the DI water which remained on the substrate after the two-phase-flow cleaning process. We obtained high efficiency in terms of particle removal as well as good drying efficiency through the optimized conditions of the two-phase-flow cleaning and air-knife processes.

• International Journal of Precision Engineering and Manufacturing
• /
• v.9 no.2
• /
• pp.8-10
• /
• 2008

Chemical mechanical polishing (CMP) is a very precise planarization technique where a wafer is polished by a slurry-coated pad. A slurry is dropped on the rotating pad surface and is supplied between the wafer and the pad. This research aims at reducing the slurry consumption and removing waste particles quickly from the wafer. To study the roles of grooves, slurry flows were simulated using the volume of fluid method (two-phase model for air and slurry) for pads with no grooves, and for pads with circular grooves.

• The KSFM Journal of Fluid Machinery
• /
• v.6 no.3 s.20
• /
• pp.58-63
• /
• 2003

The performance of turbo pump drops rapidly and it gets into break-down when the void fraction reaches above the threshold value because the impeller flow passage is choked up with air bubbles. Phenomenological understanding of break-down and pumping recovery mechanisms under air-water two-phase flow conditions are therefore important for pump designers and essential assignment for researchers. In this paper, we investigated the characteristics of break-down and pumping recovery due to entrained air occurring inside a screw-type centrifugal pump which has a wide flow passage mainly through the findings of suction and discharge pressures, rotational speed, flow rate measurements and visualization.