• 한국표면공학회지
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• 제46권4호
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• pp.153-157
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• 2013

The defect like the void or seam is frequently generated in the PCB (Printed Circuit Board) Via-Filling plating inside via hole. The organic additives including the accelerating agent, inhibitor, leveler, and etc. are needed for the copper Via-Filling plating without this defect for the plating bath. However, the decomposition of the organic additive reduces the lifetime of the plating bath during the plating process, or it becomes the factor reducing the reliability of the Via-Filling. In this paper, the interaction of each organic additives and the decomposition of additive were discussed. As to the accelerating agent, the bis (3-sulfopropyl) disulfide (SPS) and leveler the Janus Green B (JGB) and inhibitor used the polyethlylene glycol 8000 (PEG). The research on the interaction of the organic additives and decomposition implemented in the galvanostat method. The additive decomposition time was confirmed in the plating process from 0 Ah/l (AmpereHour/ liter) to 100 Ah/l with the potential change.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2005년도 ICCAS
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• pp.809-812
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• 2005

Battery is an energetic collector of solar cell system. Battery which is used in the system must have many qualities in the followings. The battery must be "Deep Cycle Battery" type. In addition, the battery is Cleary indicated the percentage of DOD. The indication of DOD is used for calculation other valve used in solar cell system. Currently, the percentage of DOD of battery is fixed by battery manufacture. If users would like to calculate is introduced % DOD, the users have to check the battery at least 12 months. This article is introduced battery deep of discharge meter by using theory of lead acid battery under deep cycle type and including the theory of DC. Current and internal resistance of battery. The data used for analyzing are collected according to the theories. The data will be calculated by monitor unit and controller systems.