• 한국표면공학회지
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• 제42권1호
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• pp.47-52
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• 2009

Cu-Ag powder having Core-Shell structure was prepared from by electroless plating method using agents such as $AgNO_3$, $NH_{4}OH$, Hydroquinone. Ag coated copper powders were analyzed using scanning electron microscopy(SEM) and energy dispersive X-ray spectrometer(EDX). The silver coating layer of copper powder was affected from various reaction conditions such as molar ratio of $NH_{4}OH$, $AgNO_3$, and pulp density. Free silver was generated below 0.1M or 0.3M and above of $NH_{4}OH$ mole ratio. Silver coating layer thickened as addition of $AgNO_3$. When the pulp density reached 12% with 0.2M $NH_{4}OH$, and 0.15M $AgNO_3$ at $4^{\circ}C$, silver was homogeneously distributed around the copper particles and free silver particles were not generated.

• Journal of Welding and Joining
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• 제23권3호
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• pp.61-67
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• 2005

Since lead (Pb)-free solders for electronics have higher melting points than that of eutectic Sn-Pb solder, they need higher soldering temperatures. In order to decrease the soldering temperature we tried to coat Sn-Bi layer on $Sn-3.5\%Ag$ solder by electroplating, which applies the mechanism of transient liquid phase bonding to soldering. During heating Bi will diffuse into the $Sn-3.5\%Ag$ solder and this results in decreasing soldering temperature. As bonding samples, the 1608 capacitor electroplated with Sn, and PCB, its surface was finished with electroless-plated Ni/Au, were selected. The $Sn-95.7\%Bi$ coated Sn-3.5Ag was supplied as a solder between the capacitor and PCB land. The samples were reflowed at $220^{\circ}C$, which was lower than that of normal reflow temperature, $240\~250^{\circ}C$, for the Pb-free. As experimental result, the joint of $Sn-95.7\%Bi$ coated Sn-3.5Ag showed high shear strength. In the as-reflowed state, the shear strength of the coated solder showed 58.8N, whereas those of commercial ones were 37.2N (Sn-37Pb), 31.4N (Sn-3Ag-0.5Cu), and 40.2N (Sn-8Zn-3Bi). After thermal shock of 1000 cycles between $-40^{\circ}C$ and $+125^{\circ}C$, shear strength of the coated solder showed 56.8N, whereas the previous commercial solders were in the range of 32.3N and 45.1N. As the microstructures, in the solder $Ag_3Sn$ intermetallic compound (IMC), and along the bonded interface $Ni_3Sn_4$ IMC were observed.

• Journal of Welding and Joining
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• 제18권6호
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• pp.74-82
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• 2000

The fluxless wetting properties of UBM-coated Si-wafer to the binary lead-free solders(Sn-Ag, Sn-Sb, Sjn-In, Sn0Bi) were estimated by wetting balance method. With the new wettability indices from the wetting curves of one side coated specimen, the wetting property estimation of UBM-coated Si-wafer was possible. For UBM of Si-chip, Au/Cu/Cr UBm was better than au/Ni/TI in the point of wetting time/ At general reflow process temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) was better than that of low melting point one(Sn-Bi, Sn-In). The contact angle of the one side coated Si-plate to the solder could be calculated from the force balance equation by measuring the static state force and the tilt angle.

• 한국초전도ㆍ저온공학회논문지
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• 제9권3호
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• pp.9-12
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• 2007

In this study. we searched for the mechanical and electrical properties of laminated coated conductors with stabilizer tape. Stabilizer tape plays a role for mechanical and electrical stability and environmental protection. Cu material stabilizer was laminated to Ag capping layer on SmBCO conductor layer. This architecture allows the wire to meet operational requirements including the stressless at cryogenic temperature and winding tension as well as mechanical bending requirements including thermal and electrical stability under fault current conditions. First, we have experimentally studied mechanical bonding properties of the laminated Cu stabilizers on SmBCO coated conductors. We have laminated SmBCO coated conductors by continuous dipping soldering process, Second, we have investigated electrical properties of the SmBCO coated conductors with stabilizer lamination. We evaluated bonding properties, peeling strength and critical current for laminated SmBCO coated conductors with Cu stabilizers.

• 대한금속재료학회지
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• 제50권8호
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• pp.563-568
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• 2012

The wetting property and reflectivity of Sn-3.5Ag solder which was dip coated on a LED lead frame were investigated. The wettability of molten solder on Cu substrate was evaluated by the wetting balance tester, and surface tension was calculated from maximum withdrawal force and withdrawal time. Temperature of the molten solder in a bath was varied in the range of $250-290^{\circ}C$. With increasing temperature, the surface tension decreased a little. The reflectivity of Sn-3.5Ag coated on a substrate became a little lower than the highest current LED lead frame reflectivity.

• ETRI Journal
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• 제41권6호
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• pp.820-828
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• 2019

A highly reliable conductive adhesive obtained by transient liquid-phase sintering (TLPS) technologies is studied for use in high-power device packaging. TLPS involves the low-temperature reaction of a low-melting metal or alloy with a high-melting metal or alloy to form a reacted metal matrix. For a TLPS material (consisting of Ag-coated Cu, a Sn96.5-Ag3.0-Cu0.5 solder, and a volatile fluxing resin) used herein, the melting temperature of the metal matrix exceeds the bonding temperature. After bonding of the TLPS material, a unique melting peak of TLPS is observed at 356 ℃, consistent with the transient behavior of Ag₃Sn + Cu₆Sn₅ → liquid + Cu₃Sn reported by the National Institute of Standards and Technology. The TLPS material shows superior thermal conductivity as compared with other commercially available Ag pastes under the same specimen preparation conditions. In conclusion, the TLPS material can be a promising candidate for a highly reliable conductive adhesive in power device packaging because remelting of the SAC305 solder, which is widely used in conventional power modules, is not observed.

• 한국주조공학회지
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• 제14권3호
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• pp.274-284
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• 1994

SiC fibers were coated with Cu, Ag and Ni metallic thin films by magnetron sputtering in order to improve wetting properties between Al matrix and SiC fiber. The wetting behavior of metal coated SiC fiber by pure Al has been studied at $670^{\circ}C{\sim}900^{\circ}C$ range for $10{\sim}90min$. under vacuum atmosphere. Besides, the effect of coated film thickness on the wettability has been investigated. The wetting behavior and interfacial reaction between Al and SiC fibers were analysed with optical microscope and SEM (scanning electron microscope). The wetting behavior of the as-received SiC fiber with Al melt was not uniform, indicated by the contact angles from less than $90^{\circ} to more Al melt was appeared in the initial stage of reation. It was considered that the metallic thin film played an important role in reducing the interfacial free energy and breaking down the aluminum oxide film by eutectic reaction with Al melt. However the wettability of Ni coated SiC fiber was not improved as much as that of Cu or Ag coated SiC fiber. The improvement of wettability by coating thickness is clearly showed in $1{\mu}m$ coated SiC fiber compared with $0.25{\mu}m$ coated SiC.

• 한국전기전자재료학회논문지
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• 제29권6호
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• pp.370-375
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• 2016

In this paper, we investigated the electrical properties of crystalline silicon solar cell fabricated with Ni/Cu/Ag plating. The laser process was used to ablate silicon nitride layer as well as to form the selective emitter. Phosphoric acid layer was spin-coated to prevent damage caused by laser and formed selective emitter during laser process. As a result, the contact resistance was decreased by lower sheet resistance in electrode region. Low sheet resistance was obtained by increasing laser current, but efficiency and open circuit voltage were decreased by damage on the wafer surface. KOH treatment was used to remove the laser damage on the silicon surface prior to metalization of the front electrode by Ni/Cu/Ag plating. Ni and Cu were plated for each 4 minutes and 16 minutes and very thin layer of Ag with $1{\mu}m$ thickness was plated onto Ni/Cu electrode for 30 seconds to prevent oxidation of the electrode. The silicon solar cells with KOH treatment showed the 0.2% improved efficiency compared to those without treatment.

• 멤브레인
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• 제34권1호
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• pp.50-57
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• 2024

본 실험에서는 α-Al₂O₃ 지지체에 무전해도금을 이용하여 Pd-Ag-Cu 분리막을 제조하였다. Pd, Ag, Cu는 각각 무전해도금을 통해 지지체 표면에 코팅하였고, 합금의 형성을 위해 무전해도금 중간에 H₂, 500℃의 조건에서 18 h 동안 열처리를 진행하였다. 이를 통해 제조된 Pd-Ag-Cu 분리막은 SEM을 통해 표면을 관찰하였으며, Pd 분리막의 두께는 7.82 ㎛, Pd-Ag-Cu 분리막의 두께는 3.54 ㎛로 측정되었다. EDS와 XRD 분석을 통해 Pd-Ag-Cu 합금이 Pd-78%, Ag-8.81%, Cu-13.19%의 조성으로 형성된 것을 확인하였다. 기체투과 실험은 H₂ 단일가스와 H₂/N₂ 혼합가스에서 실험을 진행하였다. H₂ 단일가스에서 측정한 수소 분리막의 최대 H₂ flux는 Pd 분리막의 경우 450℃, 4 bar에서 74.16 ml/cm²·min이고, Pd-Ag-Cu 분리막의 경우 450℃, 4 bar에서 113.64 ml/cm²·min인 것을 확인하였고, H₂/N₂ 혼합가스에서 측정한 separation factor의 경우 450℃, 4 bar에서 각각 2437, 11032의 separation factor가 측정되었다.

• Journal of Welding and Joining
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• 제19권2호
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• pp.176-181
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• 2001

Reflow soldering characteristics of Sn-3.5Ag and Sn-37Pb balls for BGA(Ball grid Array) were investigated. Diameter of 0.76mm ball was set on a Cu/Ni/Au-coated pad and reflowed in air with changing peak soldering temperature and conveyor speed. Peak temperatures were changed from 240 to 28$0^{\circ}C$ for Sn-3.5Ag, and from 220 to 26$0^{\circ}C$ for Sn-37Pb balls. As results, heights of solder balls increased and widths decreased with peak soldering temperature. Through aging treatment at 10$0^{\circ}C$ for 1.000 hrs, average hardness of Sn-3.5Ag balls bonded at 25$0^{\circ}C$ cecreased from 14.90Hv to 12.83Hv And with same aging conditions, average shear strength of Sn-3.5Ag balls bonded at 26$0^{\circ}C$ decreased from 1727gf to 1650gf.