• 마이크로전자및패키징학회지
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• 제15권4호
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• pp.87-92
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• 2008

본 논문에서는 Cu위에 Zn를 전기도금 한 후, Sn-3.5Ag 솔더와 반응에 의해서 형성되는 계면의 금속간 화합물의 변화를 관찰하였으며, 그에 따른 계면의 충격 신뢰성을 분석하였다. Sn-3.5Ag 솔더와 Zn 표면층이 반응하는 동안, Zn 표면층은 솔더 내부로 들어가며, 그 양은 Zn의 도금 두께에 비례하였다. 특히, Zn가 솔더 내로 들어가면서, 계면에서 Cu-Sn 금속간화합물을 억제하는 대신, $Cu_5Zn_8$와 $Ag_5Zn_8$이 형성되고, 이로 인해 계면의 충격 신뢰성이 크게 증가하였다. 또한, 솔더 내에 Zn가 약 3.8wt%정도 들어갔을 때 가장 우수한 계면 신뢰성을 유도하였다.

• 한국재료학회지
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• 제9권7호
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• pp.747-752
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• 1999

Sn-3.5Ag, Sn-3.5Ag-lZn Eoa납과 Cu기판과의 계면반응 및 접합특성에 관하여 검토하였다. Eoa납과 Cu기판이 접합된 시편은 $100^{\circ}C$와 $160^{\circ}C$에서 60일간 열처리하였으며, 전단하중을 가하여 강도를 측정하였다. $150^{\circ}C$에서 열처리에 따른 계면반응층의 두게는 Sn-3.5Ag/Cu계면이 Sn-3.5A9-IZn/Cu계면보다 빠르게 성장하였으며, 반응생성물 성장은$ t_{1/2}$에 비례하여 체적 확산 경향을 나타냈다. 계면 반응생성물은 Sn-3.5Ag/Cu계면의 경우 $Cu_{6}Sn_{5}$상이 형성되었고, $Ag_3Sn$상은 반응층 내부 및 반응층과 땜납의 계면에 석출하였으며, Zn을 첨가한 경우에는 계면에 $Cu_{6}Sn_{5}$ 상과 함께 $Cu_{5}Zn_{8}$상이 형성되었다. 땜납/기판의 전단강도는 Sn-3.5Ag합금에 Zn을 1% 첨가하면 증가하였으며, 열처리를 한 경우에는 감소하였다.

• 한국주조공학회지
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• 제28권4호
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• pp.184-189
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• 2008

Ag-Cd alloy has been widely used as an electrical contact material, since Ag-Cd alloy has a good wear resistance and stable contact resistance. But nowadays Ag-Cd alloy is not considered as electrical contact material any more due to detrimental effect on environments. Currently, active researches are being performed on ($Ag-SnO_2$ and $Ag-SnO_{2}-In_{2}O_{3}$) as an alternative solution which can fix the remaining environmental problems. However, $In_{2}O_{3}$ is relatively expensive and Ag-Sn alloy has low wear resistance. Our recent research results show that Ag-X%Zn-Y%Sn has similar physical and chemical properties. In the present study, so we tried to change and to optimize the Zn oxide content to over 6 wt% and Sn oxide content with 0.5, 1.0, 1.5 wt%. Results obtained from the experiments on the Ag-X%ZnO-Y%$SnO_2$ are discussed.

• 한국주조공학회지
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• 제22권2호
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• pp.89-96
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• 2002

This study examined the effects of adding Zn to Sn-3.5Ag solder on the microstructure changes and behavior of interface reaction of the solder joint with Cu substrate. The solder/Cu joints were examined with microscope to observe the characteristics of microstructure changes and interfacial reaction layer with aging treatment for up to 120 days at $150^{\circ}C$. Results of the microstructure changes showed that the microstructures were coarsened with aging treatment, while adding 1%Zn suppresses coarsening microstructures. The Sn-3.5Ag/Cu had a fast growth rate of the reaction layer in comparison with the Sn-3.5Ag-1Zn at the aging temperature of $150^{\circ}C$. Through the SEM/EDS analysis of solder joint, it was proved that intermetallic layer was $Cu_6Sn_5$ phase and aged specimens showed that intermetallic layer grew in proportion to $t^{1/2}$, and the precipitate of $Ag_3Sn$ occur to both inner layer and interface of layer and solder. In case of Zn-containing composite solder, $Cu_6Sn_5$ phase formed at the side of substrate and Cu-Zn-Sn phase formed at the other side in double layer. It seems that Cu-Zn-Sn phase formed at solder side did a roll of banrier to suppress the growth of the $Cu_6Sn_5$ layer during the aging treatment.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.481-486
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• 2002

We have investigated the effects of plating materials for Cu lead (Sn-lOPb, AwPdJNi, Sn-3.5Ag, Sn-3Bi and Sn-0.7Cu) on properties of QFP joints using a Sn-8Zn-3Bi solder. The results were compared with the joints using Sn-3. 5Ag-0. 7Cu and Sn-37Pb solders. As a result, the joints with the Sn-3.5Ag, Sn-3Bi and Sn-0.7Cu plated Cu lead had the reliability comparable to those of the Sn-3.5Ag-0.7Cu and Sn-37Pb soldered joints with respect to the joint strength after the high temperature holding tests at 348K to 423k. In particular, the joint with the Sn-3.5Ag plated Cu lead had the best reliability. This is caused by the low growth rate of a Cu-Sn interfacial reaction layer that degrades the joint strength of the soldered joints. Consequently, the Sn-3.5Ag plating was found to be most feasible plating for the Sn-8Zn-3Bi soldered joint.

• 대한금속재료학회지
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• 제46권7호
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• pp.443-448
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• 2008

Contact materials are used in many electrical devices. Ag-Cd alloy has been widely used in electrical part, because Ag-Cd alloy has a good wear resistance and stable contact resistance. But nowadays Ag-Cd alloy isn't being used because of environmental challenges. Currently new research is being done on ($Ag-SnO_2$ and $Ag-SnO_2-In_2O_3$) as an alternative solution to fix any remainly environmental challenges. However $In_2O_3$ is more expensive and Ag-Sn alloy has low wear resistance. According to our research data Zn has a similar physical and chemical property. In this work, so we changed and optimized the Zn oxide to over 4 and added Sn oxide ratio 0.5, 1.0, 1.5wt%. Conclusions from the data recorded from the experiment of $Ag-ZnO-SnO_2$ are as follows.

• 한국세라믹학회지
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• 제38권3호
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• pp.287-292
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• 2001

본 실험은 목적은 CRT(Cathode Ray Tube)용 청색 형광체인 ZnS:Ag 분말 표면에 액상법으로 SnO$_2$를 균일하게 코팅하는 공정조건을 연구하는 것이다. 용매로서 물을 사용하고, Sn의 공급물질로서 SnCl$_4$.4$H_2O$, 침전 촉매로서 CO(NH$_2$)$_2$를 각각 사용하여, 균일 침전 방법으로 ZnS:Ag 분말표면에 SnO$_2$를 코팅할 수 있었다. 초기에 첨가되는 SnCl$_4$.4$H_2O$의 량이 Sn/Zn의 몰비기준으로 0.017인 경우에 ZnS:Ag 분말표면에 Sn(OH)$_4$가 균일하게 코팅되지만, 그 이상 첨가되면 과량의 Sn(OH)$_4$가 입자들 사이에 응집되었다. 코팅된 Sn(OH)$_4$는 비정질 구조로 규명되었으며, 이를 SnO$_2$결정상으로 전이시키기 위하여 300~$700^{\circ}C$ 범위 내에서 열처리를 행하였다. 비정질 Sn(OH)$_4$는 20$0^{\circ}C$이하에서 탈수되었고 45$0^{\circ}C$부터 SnO$_2$로 결정화되기 시작하였다. 순수한 ZnS의 경우, 50$0^{\circ}C$이하에서는 상변화가 없으나, $600^{\circ}C$에서 일부 산화되었으며 $700^{\circ}C$에서는 완전히 ZnO로 산화되므로, ZnS의 산화방지 및 SnO$_2$의 결정화를 동시에 만족하는 최고 열처리온도는 50$0^{\circ}C$로 규명되었다. 그러나 ZnS에 SnO$_2$가 코팅된 시편의 경우에는 $600^{\circ}C$가 되어도 ZnS 상이 거의 산화되지 않았고, $700^{\circ}C$에서도 ZnS와 ZnO 상이 공존한 것으로 보아 SnO$_2$코팅이 ZnS의 산화를 억제하는 것으로 나타났다.

• 한국주조공학회지
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• 제18권6호
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• pp.570-577
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• 1998

An investigation has been conducted to describe solidification characteristics in Sn-Zn binary system and Sn-Zn-Ag ternary system added by Ag produced by the continuous casting process using heated mold as a basic study for developing Pb-free solder materials. To obtain the continuous casting rods with mirror surface and near net shape at higher casting speed, water flow rates must be increased and mold temperature must be lowered. However, surface tearing in the casting rods occured at lower continuous casting speed while break out occured at higher continuous casting speed even if optimum conditions such as water flow rate and heated mold temperature are determined. Primary ${\alpha}Sn$ and eutectic structure in unidirectioally solidified Sn-Zn alloys were finer with increased casting speed. But, directionality may not be expected for primary Zn in hypereutectic Sn-Zn alloy. It was found that the addition of $0.2{\sim}0.8%$ Ag promoted the growth of primary ${\alpha}Sn$ dendrites. The changes of tensile strength and elongation in Sn-Zn binary alloys were not observed while the increase of tensile strength and the decrease of elongation in Sn-Zn-Ag ternary alloys were observed with increased casting speed.

• 마이크로전자및패키징학회지
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• 제12권1호
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• pp.35-40
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• 2005

전자 부품에 인체에 유해한 납을 사용하지 않기 위해서 Sn을 주 원소로 한 무연 솔더 합금의 개발이 활발히 진행되고 있다. 무연 솔더 합금의 열역학적, 기계적 특성은 많이 연구되었으나 산화 거동에 대해서는 거의 연구가 되어있지 않다. 따라서 본 연구에서는 Sn 및 Sn-0.7Cu, Sn-3.5Ag, Sn-lZn, Sn-9Zn 합금에 대해 $150^{\circ}C$ 산화 거동을 연구하였다. 전기화학적 환원 분석을 통해 표면에 형성된 산화물의 종류와 양을 분석하여 합금 원소에 따른 산화 거동을 비교하였고 XPS 표면분석을 통하여 환원 실험 결과를 뒷받침하였다. 또한 합금 원소에 따른 산화물 성장 속도를 비교하였다. Sn-0.7Cu 와 Sn-3.5Ag의 경우 Sn의 산화와 비슷한 거동을 보였다. 산화 초기에는 SnO가 형성되고 산화가 진행됨에 따라 SnO 와 $SnO_2$가 같이 존재하되 $SnO_2$가 우세하게 성장하였다. Zn를 포함한 Sn 합금의 경우 ZnO와 $SnO_2$가 형성되었다. Zn의 첨가로 인해 $SnO_2$의 형성이 촉진되었고 SnO는 억제하는 것을 발견하였다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2008년도 추계학술대회 논문집
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• pp.313-316
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• 2008

This work sought to examine the suitability of twin roll strip casting for Ag-27%Cu-25%Zn-3%Sn brazing alloy (BAg-7A) and to investigate the mechanical properties and microstructure of the strip. The effect of aging heat treatment on the properties was also studied,. This new manufacturing process has applications in the production of the brazing alloy. XRD and microstructural analysis of the Ag-27%Cu-25%Zn-3%Sn strip represented eutectic microstructure of a Cu-rich phase and a Ag-rich matrix regardless of heat treatment. The results of mechanical tests showed tensile strength of 470MPa, a significant enhancement, and an 18% elongation of the twin roll casted strip, due mainly to the solid solution strengthening of Zn atoms (${\sim}20%$) in the Cu-rich phases. Tensile results showed gradually decreasing strengths and increasing elongation with aging heat treatment. Microstructural evolution and fractography were also investigated and related to the mechanical properties.