• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2004.05b
• /
• pp.34-37
• /
• 2004

It is well known that Ag-CdO alloy for electrical contactor has been widely used in weak or middle electric current field. But it is necessary to decrease Cd contents without decrease of contactor property because Cd is harmful to human body. The present work has been carried out to investigate effects of Mm (misch metal) addition on the property of Ag-CdO alloy for electrical contactor. As the results of present works, hardness and strength was improved and arc resistance was improved, also, in spite of decrease Cd contents by the Mm addition. It was estimated that Ag-oxide particle was refined by Mm addition.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2002.05a
• /
• pp.183-188
• /
• 2002

With the contact pad consisted of $0.5{\mu}{\textrm}{m}$ $Au/5{\mu}{\textrm}{m}$ Ni/Cu layers on a conventional ball grid array(BGA) substrate, metallurgical reaction properties between the pad and In-15(wt.%)Pb-5Ag solder alloy were studied after reflow and solid aging. In as-reflow condition, thin AuIn$_2$or Ni$_{28}$In$_{72}$ intermetallic layer was formed at the solder/pad interface according to reflow time. Dissolution of the Au layer into the molten solder was remarkably limited in comparison with eutectic Sn-37Pb alloy. After solid aging of 300 hrs, thickness of In-Ni layer increased to about $2{\mu}{\textrm}{m}$ in the both as-reflow case. It was observed that In atoms diffuse through the AuIn$_2$phase to react with underlaying Ni layer. The metallurgical reaction properties between In-l5Pb-7Ag alloy and Au/Ni surface finish were analysed to result in suppression of Au-embrittlement in the solder joints.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2000.11a
• /
• pp.57-57
• /
• 2000

Brazing characteristics of the LTCC(Low Temperature Co-fired Ceramics)/ Kovar(Fe-Ni-Co alloy) was investigated. Kovar is one of the typical material for the lid of MCM and packages. In case of alumina package, Brazing process is done by higher temperature profile than 800 $^{\circ}C$ and Ag-Cu alloy. But, LTCC has sintering temperature near 850 $^{\circ}C$. So, it is difficult to use the same process as alumina brazing. The adhesion strength of the brazed part is affected by brazing alloy and metallization properties between conductor pattern and LTCC material. We investigated brazing characteristics of the LTCC/Kovar using various brazing alloys(Ag-Cu, Au-Sn) and process conditions. And, we examined the influence of the glass contents in conductor on the brazing characteristics of the LTCC/Kovar.

• Journal of the Korean Ceramic Society
• /
• v.36 no.8
• /
• pp.835-842
• /
• 1999

Si3N4 -Si3N4 joints were made using Ag-Cu-Ti and Ag-Cu-In-Ti via brazing method and the change in joint strength was investigated after heat treatment at $400^{\circ}C$ or $650^{\circ}C$ for up to 2000h. The initial strength of as-brazed joints with Ag-Cu-In-Ti was lower but the reduction of the strength was less dramatic than that with Ag-Cu-Ti. The joints made of a new brazing alloy Au-Ni-Cr-Mo-Fe which is developed for high temperature applications were heat-treated at $650^{\circ}C$ for 1000h. As the heat treatment time increased the bond strength increased. The results of the joining system with Mo or Cu interlayer showed that the strength of the joint with Mo interlayer was higher but the system incurred problems in joint production Also it was found from oxidation experiment that Ti and In affected the oxidation resistance of brazing alloy.

• Journal of Technologic Dentistry
• /
• v.21 no.1
• /
• pp.27-41
• /
• 1999

The Ag-Pd-Cu alloys containing a small amount of Au is commonly used for dental purposes, because this alloy cheaper than Au-base alloys for clinical use. However, the most important characteristic of this alloy is age-hardenability, which is not exhibited by other Ag-base dental alloys. The specimens used were Ag-30Pd-10Cu ternary alloy and Au addition alloy. These alloys were melted and casted by induction electric furnace and centrifugal casting machine in Ar atmosphere. These specimens were solution treated for 2hr at $800^{\circ}C$ and were then quenched into iced water, and aged at 350-$550^{\circ}C$ Age-hardening characteristic of the small Au-containing Ag-Pd-Cu dental alloys were investigated by means of hardness testing, X-ray diffraction and electron microscope observations, electrical resistance, differential scanning calorimetric, energy dispersed spectra and electron probe microanalysis. Principal results are as follows ; Maximum hardening occured in two co-phases of ${\alpha}_2$ + PdCu In stage II, decomposition of the $\alpha$ solid solution to a PdCu ordered phase($L1_o$ type) and an Ag-rich ${\alpha}_2$ phase occurred and a discontinuous precipitation occurred at the grain boundary. From the electron microscope study, it was concluded that the cause of age-hardening in this alloy is the precipitation of the PdCu redered phase, which has AuCu I type face-centered tetragonal structure. Precipitation procedure was ${\alpha}{\to}{\alpha}_1+PdCu{\to}{\alpha}_2+PdCu$ at Pd/Cu = 3 Pd element of Ag-Pd-Cu alloy is more effective dental alloy on anti-corrosion and is suitable to isothermal ageing at $450^{\circ}C$.

• Journal of Dental Rehabilitation and Applied Science
• /
• v.16 no.2
• /
• pp.113-122
• /
• 2000

The reinforced composte resin as the esthetic operative material continuously has been studied because the porcelain fused metal prosthesis is widely used for its excellent esthetics, rigidity and marginal integrity, but it has low fracture resistance against the tensile strength and stress, attrition of the opposite teeth. The reinforced composite resin is well adapt with the dental alloy but it is low the shear bond strength with the dental alloy vs the porcelain fused metal prosthesis, and then has been studied continuously. The purpose of the study was to examine how metal was the higher shear bond strength among the dental alloy was used to the reinforced composite resin and to find the effect that the particle size of sandblasting influenced the shear bond strength. We built up the reinforced composite resin with 4 mm in diameter, 3 mm in height on circular alloy with 5 mm in diameter, 2 mm in height. Type II gold, type IV gold, and Ag-Pd alloy was used as alloys and $50{\mu}m$, $110{\mu}m$, $250{\mu}m$ of the particle size was sandblasted at each alloy in bonding between alloy and resin. We made 90 secimens of 10 per each group and we measured the shear bond strength using the Instron($M100EC^{(R)}$, Mecmesin Co., England). The obtained results were as follows : 1. In comparison among each alloys, Ag-Pd alloy had the highest shear bond strength and the shear bond strength was decreased significantly in the sequence of the type II gold and type IV gold(P<0.001). 2. In comparison according to the size of sandblasting particle, (1) In Ag-Pd alloy, shear bond strength was decreased in the sequence of $110{\mu}m$, $250{\mu}m$, $50{\mu}m$ and there were significant difference in all the group. (P<0.05) (2) In type II gold, it was decreased in the sequence of $250{\mu}m$, $50{\mu}m$, $110{\mu}m$ and there were significant difference. (P<0.05) (3) In type IV gold, it was decreased in the sequence of $110{\mu}m$, $50{\mu}m$, $250{\mu}m$. There were significant difference between the group of $110{\mu}m$ and $50{\mu}m$, the group of $110{\mu}m$ and 250, but there were no significant difference in the group of $50{\mu}m$ and $250{\mu}m$. 3. The highest shear bond strength according to the size of sandblasting particle was $110{\mu}m$ in Ag-Pd alloy and type IV gold, $250{\mu}m$ in type II gold.

• Korean Journal of Dental Materials
• /
• v.43 no.4
• /
• pp.343-349
• /
• 2016

This experiment was carried out to examine whether the post-firing heat treatment is effective in increasing the hardness of metal-ceramic alloy of the Pd-Au-Ag-Sn system. Precipitation hardening by holding at $600^{\circ}C$ after simulated complete porcelain firing in a metal-ceramic alloy of the Pd-Au-Ag-Sn system was examined by observing the change in hardness, crystal structure, and microstructure using a hardness test, X-ray diffraction (XRD), and field emission scanning electron microscopy (FE-SEM). The hardness of the alloy increased apparently by holding the specimen at $600^{\circ}C$ for 30 min after simulated complete porcelain firing. The formation of fine grain interior precipitates during holding at $600^{\circ}C$ caused the formation of lattice strain in the grain interior, resulting in apparent hardening. The faster cooling rate (stage 0) during simulated complete porcelain firing resulted in more effective precipitation hardening during holding at $600^{\circ}C$. From the above results, an appropriate post-firing heat treatment, such as holding at $600^{\circ}C$ for 30 min after complete porcelain firing may increase the durability of metal-ceramic prostheses composed of Pd-Au-Ag-Sn alloy.

• The Journal of Korean Academy of Prosthodontics
• /
• v.41 no.1
• /
• pp.1-19
• /
• 2003

The surface of metals should be as smooth as possible for optimum comfort, oral hygiene, low plaque retention, and resistance to corrosion. In this study five specimens of each precious metal(type III gold alloy, ceramic gold alloy, and Ag-Pd alloy) were divided into five groups according to finishing and polishing procedures : group 1(sandblaster), group 2(group 1+stone), group 3(group 2+brown rubber), group 4(group 3+green rubber), and group 5(group 4+rouge). Six specimens of each non-precious metal(Co-Cr alloy, Ni-Cr alloy, and Co-Cr-Ti alloy) were divided into six groups: group 1(sandblaster), group 2(group 1+hard stone), group 3(group 2+electrolytic polisher), group 4(group 3+brown hard rubber point), group 5(group 4+green hard rubber point), and group 6(group 5+rouge). Considering factors affecting the rate of abrasion, the same dentist applied each finishing and polishing procedure. In addition, the surface roughness of enamel, resin, and porcelain was evaluated. The effect of finishing and polishing procedures on surface roughness of precious and non-precious metals, enamel, resin, and porcelain was evaluated by means of Atomic Force Microscope(AutoProbe CP. Park Scientific Instruments, U.S.A.) that can image the three dimensional surface profile and measure average surface roughness values of each sample at the same time. The obtained results were as follows : 1. According to finishing and polishing procedures, the surface roughness of type III gold alloy, ceramic gold alloy, and Ag-Pd alloy was decreased in the order of group 1, 2, 3, 4, and 5 (P<0.01). 2. According to finishing and polishing procedures. the surface roughness of Co-Cr alloy, Ni-Cr alloy, and Co-Cr-Ti alloy was decreased in the order of group 1, 2, 3, 4, 5, and 6 (p<0.01). 3. There was not statistically significant difference in the surface roughness among three metals of precious metals in group 1 but was significant difference in group 2, 3, 4, and 5 (P<0.05). 4. There was not statistically significant difference in the surface roughness among three metals of non-precious metals in all groups. 5. When the surface roughness of the smoothest surface of each metal, enamel. porcelain, and resin was compared, porcelain was the smoothest and the surface roughness was decreased in the order of Ni-Cr alloy. Co-Cr alloy. Co-Cr-Ti alloy, resin. Ag-Pd alloy, ceramic gold alloy type III gold alloy, and enamel (P<0.01). The results of this study indicate that the finishing and polishing procedures should be carried out in a logical, systematic sequence of steps and the harder non-precious metals may be less resistance to abrasion than are the softer precious metals.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.21 no.2
• /
• pp.346-351
• /
• 1997

The creep characteristics of an Al-5wt.% Ag alloy including the stress exponent, the activation energy for creep and the shape of the creep curve were investigated at a normalized shear stress extending from $ 10^{-5}{\;}to{\;}3{\times}10^{-4}$ and in the temperature range of 640-873 K, where silver is in solid solution. The experimental results shows that the stress exponent is 4.6, the activation energy is 141 kJ/mole, and the stacking fault energy is $180{\;}mJ/m^2$, suggesting that the creep behavior of Al-5 wt.% Ag is similiar to that reported for pure aluminum, and that under the current experimental conditions, the alloy behaves as a class II(metal class). The above creep characteristics obtained for Al-5 wt.% Ag are discussed in the light of prediction regarding deformation mechanisms in solid solution alloys.

• Korean Journal of Metals and Materials
• /
• v.47 no.8
• /
• pp.500-507
• /
• 2009

Pb-free solder has recently been used in electronics in efforts to meet environmental regulations, and a number of Pb-free solder alloy choices beyond the near-eutectic SnAgCu solder are now available. With increased demand for thin and portable electronics, the high cost of alloys containing significant amounts of silver and their poor mechanical shock performance have spurred the development of low Ag SnAgCu solder, which provides improved mechanical performance at a reasonable cost. Although low Ag SnAgCu solder exhibits significantly higher fracture resistance under high-strain rates, little thermal fatigue data exist for this solder. Therefore, it is necessary to investigate thermal fatigue reliability of low Ag SnAgCu solder under variation of thermal stress in order to allow its implementation in electronic products with high reliability requirements. In this study, the reliability of Sn0.3Ag0.7Cu(SAC0307), a low Ag solder alloy, is discussed and compared with that of Sn3Ag0.5Cu(SAC305). Three sample types and six samples size are evaluated. Mechanical properties and microstructure of the solder joint are investigated under thermal shock cycles. It was observed that the mechanical strength of SAC0307 dropped slightly with thermal cycling relative to that of SAC305. This reveals that the failure mode of SAC0307 is different from that SAC305 under this critical condition.