• 한국전기전자재료학회논문지
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• 제15권2호
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• pp.141-146
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• 2002

We synthesized polypyrrole (PPy) by electrolysis of the pyrrole monomer solution containing support electrolyte, KCl and/or p-toluene sulfonic acid sodium salt (p-TS). The electrochemical behavior, was investigated using cyclic voltammetry and AC impedance. In the case of using electrolyte p-TS, the oxidation potential of the PPy was about -02 V vs Ag/AgCl reference electrode, while the potential was about 0 V for using electrolyte KCl. The falloff of the oxidation potential gave a sign of an improvement in the electron hopoing mechanism on the backbone. The AC impedance plot gave a hint of betterment of mass transport. PPy doped with p-TS improved in mass transport or diffusion. That was because the PPy doped with p-TS was more porous than PPy with KCl. We attained an effect of good kinetic parameters, in the case of PP-GOx enzyme electrodes doped with p-TS, which were determined by 58 mmol dm$\^$-3/ for apparent Michaelis constant and by 581 ㎂ for maximum current respectively.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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• pp.357-361
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• 1999

GOD electrochemically immobilized in PPy/GOD complex have an effect on redox properties of the complex. In the cyclicvoltammetry, GOD shows the redox reaction at the potential below -0.6Y vs. Ag/AgCI. That leads to new peaks in the cyclicvoltammograms in additional to typical PPy peaks. The pH of electrolyte solution during potential swing decreased to 4.4, and then increased to 10. That suggests the redox of GOD for the cycling. As the concentration of GOD was increased, the anodic wave of the new peaks was strong as much as increased. GOD obstructs the diffusion of electrolyte anion because of its net chain. Insulating property of GOD is cause that it made the faradic impedance of complex large in charge transfer. It suggests that increase of the concentration of GOD be against electrochemical coupling. Therefore, the concentration of GOD and electrochemical coupling should be dealt with each other. The apparent Michaelis-lenten constant ( K\`$_{M}$ ) was determined by 30.7 mmol d $m^{-3}$ fur the PPy/GOD complex. The value is of the same order of magnitude as that for soluble glucose oxidase from Aspergillus Niger.r.

• Bulletin of the Korean Chemical Society
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• 제14권5호
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• pp.567-574
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• 1993

Mordant Red 19(MR19) is reduced at mercury electrode at -0.67 V vs. Ag/AgCl with two electrons per molecule in pH 9.2 buffer by differential pulse polarography and linear sweep voltammetry. The peak potential is dependent on the pH of solution. The exhaustive electrolysis, however, gives 4 electrons per molecule because of the disproportionation of the unstable hydrazo intermediate. The electrochemical reduction of lanthanide-MR19 complexes is observed at more cathodic potential than that of free ligand. The difference in peak potentials between complex and free ligand varies from 75 mV for $La^{3+}$ to 165 mV for $Tb^{3+}$ and increases with increasing the atomic number of lanthanide. The electrochemical reduction of lanthanide complexes with MR19 is due to the reduction of ligand itself, and it can be potentially useful as an indirect method for the determination of lanthanides. The shape of i-E curves and the scan rate dependence indicates the presence of adsorption and the adsorption was confirmed by potential double-step chronocoulometry and the effect of standing time. Also the surface excess of the adsorbed species and diffusion coefficients are determined. The composition of the complex is determined to be 1 : 2 by spectrophotometric and electrochemical methods.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2009년도 춘계학술발표대회 논문집
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• pp.214-219
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• 2009

In high-efficiency crystalline silicon solar cells, If high-efficiency solar cells are to be commercialized. It is need to develop superior contact formation method and material that can be inexpensive and simple without degradation of the solar cells ability. For reason of plated metallic contact is not only high metallic purity but also inexpensive manufacture. It is available to apply mass production. Especially, Nickel, Copper and Silver are applied widely in various electronic manufactures as easily formation is available by plating. The metallic contact system of silicon solar cell must have several properties, such as low contact resistance, easy application and good adhesion. Ni is shown to be a suitable barrier to Cu diffusion as well as desirable contact metal to silicon. Nickel monosilicide(NiSi) has been suggested as a suitable silicide due to its lower resistivity, lower sintering temperature and lower layer stress than $TiSi_2$. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposite the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 14.68 % on $0.2{\sim}0.6{\Omega}{\cdot}cm,\;20{\times}20mm^2$, CZ(Czochralski) wafer.

• Advances in nano research
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• 제3권2호
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• pp.97-109
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• 2015

Citrate ion is a commonly used reductant in metal colloid synthesis, undergoes strong surface interaction with silver nanocrystallites. The slow crystal growth observed as a result of the interaction between the silver surface and the citrate ion makes this reduction process unique compared to other chemical and radiolytic synthetic methods. The antimicrobial effects of silver (Ag) ion or salts are well known, but the effects of citrate coated Ag nanoparticles (CAgNPs) are scant. Herein, we have isolated biofilm causative bacteria and fungi from drinking water PVC pipe lines. Stable CAgNPs were prepared and the formation of CAgNPs was confirmed by UV-visible spectroscopic analysis and recorded the localized surface plasmon resonance of CAgNPs at 430 nm. Fourier transform infrared spectroscopic analysis revealed C=O and O-H bending vibrations due to organic capping of silver responsible for the reduction and stabilization of the CAgNPs. X-ray diffraction micrograph indicated the face centered cubic structure of the formed CAgNPs, and morphological studies including size (average size 50 nm) were carried out using transmission electron microscopy. The hydrodynamic diameter (60.7 nm) and zeta potential (-27.6 mV) were measured using the dynamic light scattering technique. The antimicrobial activity of CAgNPs was evaluated (in vitro) against the isolated fungi, Gram-negative and Gram-positive bacteria using disc diffusion method and results revealed that CAgNPs with 170ppm concentration are having significant antimicrobial effects against an array of microbes tested.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.463-463
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• 2008

The glass frit has been used in transparent dielectric, barrier rib and electrode of PDP (Plasma display panel). In PDP fabrication, the firing temperature of glass frit is normally 550~$580^{\circ}C$ with conventional heating. However, there are a problem that silver in electrode is diffused throughout the transparent dielectric. For inhibiting the Ag diffusion we considered use of the microwave heating. We investigated firing of glass frit compared between conventional and microwave heating. After firing by two types of heating, the diffusion of silver is determined using a optical microscope and UV-spectrometer. Based on the our results, the microwave heating should be a candidate to heating source for high efficacy in PDP.

• 마이크로전자및패키징학회지
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• 제26권3호
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• pp.81-88
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• 2019

본 연구에서는 그래핀 산화(graphene oxide, GO) 분말 첨가가 ball grid array(BGA) 패키지와 printed circuit board(PCB)간 Sn-3.0Ag-0.5Cu(SAC305) 무연솔더 접합부의 electromigration(EM) 수명에 미치는 영향에 대하여 보고 하였다. 솔더 접합 직후, Ni/Au표면처리된 패키지 접합계면에서는 $(Cu,Ni)_6Sn_5$가 생성되었으며 organic solderability preservative(OSP) 표면처리 된 PCB 접합계면에서는 $Cu_6Sn_5$ 금속간화합물(intermetallic compound, IMC)이 생성되었다. $130^{\circ}C$, $1.0{\times}10^3A/cm^2$ 전류밀도 하에서 EM 수명평가 결과, GO를 첨가하지 않은 솔더 접합부의 평균 파괴 시간은 189.9 hrs으로 도출되었고, GO를 첨가한 솔더 접합부의 평균 파괴 시간은 367.1 hrs으로 도출되었다. EM에 의한 손상은 패키지 접합계면에 비하여 pad 직경이 작은 PCB 접합계면에서 전자 유입에 의한 Cu의 소모로 인하여 발생하였다. 한편, 첨가된 GO는 하부계면의 $Cu_6Sn_5$ IMC와 솔더 사이에 분포하는 것을 확인하였다. 따라서, SAC305 무연솔더에 첨가된 GO가 전류 집중 영역에서 Cu의 빠른 확산을 억제하여 우수한 EM 신뢰성을 갖는 것으로 생각된다.

• 콘크리트학회논문집
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• 제26권1호
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• pp.71-78
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• 2014

사용후핵연료의 중간저장시설인 콘크리트 캐스크(cask)는 해안부근에 입지할 가능성이 크기 때문에 염해에 대한 문제가 크게 우려된다. 그리고 염해에 의한 철근의 부식 및 균열발생은 철근콘크리트구조물의 방사선 차폐기능뿐 아니라 구조성능 저하의 주요 원인이기 때문에 염해에 대한 평가는 매우 중요한 사항이다. 특히 염해환경과 함께 콘크리트 캐스크 내부에서는 사용후핵연료의 발열에 의해 $60^{\circ}C$정도의 고온 환경이 예상되기 때문에 고온에서의 염해에 대한 검토가 요구되지만, 기존 콘크리트 구조물의 염해평가에서는 온도에 대한 영향이 전혀 고려되어 있지 않아 고온에서 염해에 노출된 철근콘크리트구조물들의 내구설계 및 수명예측을 위해 참고할 만한 자료가 거의 없다. 이 연구에서는 다양한 온도환경에서의 염수(NaCl)침지시험을 통해 콘크리트의 염화물이온 확산계수를 측정하고 염화물이온 확산계수와 온도의 관계를 규명하고자 하였다. 실험 결과, 콘크리트의 염화물이온 확산계수는 온도의 증가에 따라 현저히 증대하여 고온환경에서의 염해 발생가능성이 매우 큰 것으로 조사되었다. 또한 크리트의 염화물이온 확산계수는 물시멘트(W/C)비가 낮아질수록 감소하였고, 이 경향은 온도가 증가(고온환경)하여도 동일하게 나타났다. 염화물이온 확산계수의 온도의존성은 아레니우스식(Arrhenius equation)으로 나타내어졌고 회귀분석 결과, 확산계수의 대수 값은 절대온도의 역수와 선형관계를 나타내었다. 또한 온도의존성을 나타내는 활성화에너지(activation energy)는 물시멘트(W/C)비가 낮을수록 높게 나타났다.

• 한국산학기술학회논문지
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• 제9권1호
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• pp.9-15
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• 2008

모꾸메가네는 나무결 모양을 낼 수 있는 고부가가치가 가능한 장신구 소재이며 서로 다른 금속을 가공하기 위해 융점이 다른 두 가지 이상 금속을 적층하여 붙인 잉곳 제작이 필수적이다. 기존의 모꾸메가네용 잉곳은 숯을 이용한 환원성 분위기에서 경험에 근거한 육안 판별로 만들어져서 접합의 신뢰성과 후속 가공 도중 층간 분리가 일어나는 분제가 있었다. $900^{\circ}C$에서 2.5kg의 압력을 가하면서 진공 열처리로를 이용하여 90% 이상 접합율이 가능한 조건을 확인하였다. 계면에서의 계면 확산계수가 통상의 벌크 확산계수보다 100배 향상되는 것을 확인하였고 이종 접합시에 계면 확산계수를 확인하여 $700^{\circ}C$의 저온에서 10분동안 진공열처리, 90% 이상 접합율을 가진 모꾸메가네용 잉곳을 성공적으로 제조하였다. 제조된 잉곳으로 핸드폰 외장용 모꾸메가네 시작품을 성공적으로 제조할 수 있었다.