• Transactions of Materials Processing
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• v.7 no.5
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• pp.465-473
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• 1998

The effect of alloying elements of Ag-Cu-Zr-X brazing alloy on the microstructure and the bond strength of $Al_2O_3/Ni-Cr$ brazed steel joint was investigated. The reaction layer, $ZrO_2$ (a=5.146 ${\AA}$ , b=5.213 ${\AA}$ , c=5.311 ${\AA}$ )was formed at the interface of $Al_2O_3/Ni-Cr$ steel joint by the redox reaction between alumina and Zr. The addition of An and Al to the Ag-Cu-Zr brazing alloy gave rise to changes in the thickness of the reaction product layer and the morphology of the brazement. Sn caused the segregation of Zr was decreased b Al the $ZrO_2$ layer formed at the Ag-Cu-Zr-Al alloy was thinner than that of $ZrO_2$ formed at the Ag-Cu-Zr-An alloy. The fracture shear strength was strongly dependent on the microstructure of the brazement. Brazing with Ag-Cu-Zr-Sn alloy resulted in a better bond strength than with Ag-Cu-Zr or Ag-Cu-Zr-Al alloy.

• Proceedings of the KIEE Conference
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• 1994.07b
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• pp.1342-1344
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• 1994

Silver-Nickel alloy has been used as a electrical contact material for low voltage, low current. Since the solubility between Ag and Ni is very low, it is difficult to produce Ag-Ni alloy by using conventional melting method and disperse Ni powder homogeneously in Ag matrix. In this study we have been produced fine Ag-Ni alloy powder by using coprecipitation method. Firstly, we have produced silver-nickel nitrate solution by dissolving the Ag and Ni ingot in nitric acid solution and then, coprecipitate (Ag, Ni)carbonate dropping Ag-Ni nitrate solution to sodium carbonate solution. (Ag, Ni) carbonate is heat-treated in $H_2$ atmosphere, $400^{\circ}C$ and it has been analysed by TGA, SEM, XRD, ICP. It is represented Silver-Nickel alloy powder in the particle range of $0.1{\sim}0.5{\mu}m$.

• Journal of the Korean Society for Heat Treatment
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• v.12 no.2
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• pp.129-135
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• 1999

The effects of Ag addition on the microstructures and mechanical properties of 7050 Al alloy were investigated. Various homogenizing and aging treatments were carried out to analyze the controversial effects of Ag in 7050 Al alloy. Transmission electron microscopy(TEM) was used for microstructural analysis. The hardening precipitates(${\eta}^{\prime}$) become finer with Ag addition. It suggests that Ag promotes easier nucleation of ${\eta}{\prime}$. The strength of overaged Ag bearing alloys are higher than that of Ag free alloy. Hardening precipitates(${\eta}^{\prime}$) in Ag bearing alloys are smaller than that of Ag free alloys, because the growth rate of ${\eta}^{\prime}$ during overaging stage is lower in Ag bearing alloys.

• Journal of Welding and Joining
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• v.16 no.3
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• pp.157-166
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• 1998

Recently as environmental pollution caused by Pb has posed a serious threat to the global environment, the trend to regulate the usage of Pb in electronic industry is one the rise. Currently, the solder alloy with high Pb content, Sn-37%Pb, is utilized in the electronic assembly therefore, the objective of this study is to develop an alternative solder alloy for the existing Sn-37%Pb solder alloy. First thing, this work choosed Sn-5%Pb-1.5%Ag, Sn-5%Pb-1.5%Ag-x%Bi(x=1~5%) for candidate solder alloys, and examined their properties such as melting range, wettability, microhardness, tensile property, oxidation behavior and microstructure. Wettability was on the same level of Sn-37%Pb. Dissolution of Pb ion in Sn-5%Pb solder was 0.46ppm. This solder alloy revealed cellular dendrite microstructure $\beta$-Sn matrix, Pb-rich phase, Ag/Sn, and Cu/Sn Intermetallic compounds. The range of solidification temperature was within 3$0^{\circ}C$. Also these alloy displayed higher tensile strength and lower elongation than Sn-37%Pb. The resistance of oxidation in Sn-5%Pb-1.5%Ag solder alloy was superior to that of Sn-37%Pb solder alloy. But that of Sn-5%Pb-1.5%Ag-5%Bi solder alloy was equal to that of Sn-37%Pb solder alloy.

• Journal of Technologic Dentistry
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• v.24 no.1
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• pp.65-71
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• 2002

This study was performed to observe the microhardness change of the surface and the bonding strength between the porcelain and alloy specimens in order to investigate the effects of appended indium, tin and copper on interfacial properties of Au-Pd-Ag alloys. The hardness of castings was measured with a micro-Vicker's hardness tester. The interfacial shear bonding strength between alloy specimen and fused porcelain was measured with a mechanical testing system(MTS 858.20). The microhardness of Au-Pd-Ag alloy was increased by adding indium and tin, but not increased by adding copper. The shear bonding strength of Au-Pd-Ag-Sn alloy and Au-Pd-Ag-Cu alloy showed 87MPa, 57MPa. The higher concentration of adding elements showed the higher shear bonding strength.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.256-258
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• 2003

Two Si wafers are bonded with indium-silver alloy using diffusion bonding method. When silver and indium thin films are contacted, they diffuse into each other and form inter-metallic compounds like $AgIn_2$, $Ag_2In$, $Ag_3In$ etc. These compounds are determined by ratio of two metals. From phase diagram of Ag-In alloy, we can get the ratio of $Ag_2In$, that has high melting point about 700$^{\circ}C$, approximately 2:1. This ratio was made by controlling of film thickness. And bonding was executed by annealing and adding pressures at a time. The joint of these wafers had been observed by SEM. And we had also seen the EDS (Energy Dispersive Spectroscopy) data to analysis the component of samples.

• The Journal of Korean Academy of Prosthodontics
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• v.27 no.1
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• pp.123-141
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• 1989

The purpose of this study was to investigate the tendency of color change of ceramic, and its mechanism un der the influence of Pd-Ag alloy. The specimens were made by firing porcelain on tile metal plates cast with Au-Pt alloy, Pd-Cu alloy and Pd-Ag alloy. In the case of Pd-Ag alloy, specimens were fired under three different conditions as follows, 1) without protection, 2) protection with ceramic metal conditioner, 3) protection with carbon block. For the specimens of element analysis, a barrier was constructed with platinum foil between metal plate and ceramic. Color change was measured with colorimeter and elemental changes in ceramic were calculated with DC argon plasma emission spectrophotometer. The results were as follows : 1. Color change of ceramic by Pd-Ag alloy was negligible in hue, but decreased in value and increased in chroma (yellow discoloration). 2. Color change of ceramic by Pd-Ag alloy was appeared through vapor transport mechanism. 3. As the protection method for the color change of ceramic by Pd-Ag alloy, application of ceramic metal conditioner was superior to utilization of carbon block.

• Journal of Korea Foundry Society
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• v.28 no.4
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• pp.184-189
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• 2008

Ag-Cd alloy has been widely used as an electrical contact material, since Ag-Cd alloy has a good wear resistance and stable contact resistance. But nowadays Ag-Cd alloy is not considered as electrical contact material any more due to detrimental effect on environments. Currently, active researches are being performed on ($Ag-SnO_2$ and $Ag-SnO_{2}-In_{2}O_{3}$) as an alternative solution which can fix the remaining environmental problems. However, $In_{2}O_{3}$ is relatively expensive and Ag-Sn alloy has low wear resistance. Our recent research results show that Ag-X%Zn-Y%Sn has similar physical and chemical properties. In the present study, so we tried to change and to optimize the Zn oxide content to over 6 wt% and Sn oxide content with 0.5, 1.0, 1.5 wt%. Results obtained from the experiments on the Ag-X%ZnO-Y%$SnO_2$ are discussed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.6
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• pp.561-565
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• 2007

Because of a good wear resistance and a stable contact resistance, Ag-CdO is widely used as electrical contact material. But, the Cd-oxide mainly exists as a coarse particle and adversely affected to environment. As a reason, $Ag-SnO_2$ alloy has been developed. The Sn-oxide maintains stable and fine particle even at high temperature. In order to investigate the effect of Misch metal (Mm) additional that affects the formation of the oxide and the formation of fine matrix Ag, we studied the microstructures and properties of Ag-Sn-In(-Mm) material fabricated by rapid solidification process. The experimental procedure were melting using high frequency induction, melt spinning, and internal oxidation. The Mm addition makes Ag matrix more fine than no Mm addition. The reason is that the addition of Misch metal decreased a latent heat of fusion of alloy, as a result the rapid solidification effect of alloy is increased. The maximum hardness shows at 0.3 wt%Mm. after that the hardness is decreased until 0.4 wt% Mm, but still larger than no Mm addition alloy. At 0.5 wt% Mm alloy, the precipitation of Misch metal causes a decrease of hardness than no Mm addition alloy.

• Korean Journal of Metals and Materials
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• v.46 no.7
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• pp.443-448
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• 2008

Contact materials are used in many electrical devices. Ag-Cd alloy has been widely used in electrical part, because Ag-Cd alloy has a good wear resistance and stable contact resistance. But nowadays Ag-Cd alloy isn't being used because of environmental challenges. Currently new research is being done on ($Ag-SnO_2$ and $Ag-SnO_2-In_2O_3$) as an alternative solution to fix any remainly environmental challenges. However $In_2O_3$ is more expensive and Ag-Sn alloy has low wear resistance. According to our research data Zn has a similar physical and chemical property. In this work, so we changed and optimized the Zn oxide to over 4 and added Sn oxide ratio 0.5, 1.0, 1.5wt%. Conclusions from the data recorded from the experiment of $Ag-ZnO-SnO_2$ are as follows.