• Biomedical Science Letters
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• v.24 no.1
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• pp.30-34
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• 2018

Silver (Ag) has been widely used in commercial products and medical fields since ancient times because of its antibacterial effect. It is harmless and non-toxic to the human body. For this reason, recent research has actively evaluated antimicrobial activity using silver (Ag). In this study, we investigated the inhibitory effect of a silver-based compound, silver phosphate ($Ag_3PO_4$) on the growth of Staphylococcus aureus and the activation of human immunity. First, the inhibitory effect of $Ag_3PO_4$ on the growth of Staphylococcus aureus was confirmed by a growth curve and a colonyounting method. As a result, the growth inhibitory effect increased as the concentration of $Ag_3PO_4$ increased. Specifically, treatment with $5{\mu}g/mL$ of $Ag_3PO_4$ resulted in no bacteria growth, and the colony-counting method showed a remarkable inhibition. In addition, the expression of cytokine IL-8 by $Ag_3PO_4$ was examined to investigate the cellular immune system activation by $Ag_3PO_4$. After pretreatment of Staphylococcus aureus for 1 hour with $50{\mu}g/mL$ $Ag_3PO_4$, an increased IL-8 mRNA expression resulted. In cells treated with $Ag_3PO_4$, we found that the expression of IL-8 was enhanced in a time-dependent fashion compared to non-treated cells. These results indicate that $Ag_3PO_4$ induces antimicrobial activity against Staphylococcus aureus and activates human immunity. These results are expected to contribute to the future study of the mechanism of silver (Ag) and silver-based compounds in relation to antibacterial activity.

• Proceedings of the Materials Research Society of Korea Conference
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• 2007.05a
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• pp.34.1-34.1
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• 2007

• Proceedings of the KWS Conference
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• 2001.05a
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• pp.271-272
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• 2001

• Proceedings of the Korean Vacuum Society Conference
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• 1995.02a
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• pp.057-58
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• 1995

극소전자 디바이스의 고집적화에 의해 박막배선의 선폭은 0.5$mu extrm{m}$ 이하로 축소되고 있고 상대적으로 높은 전류밀도가 흐르게 된다. 높은 전류밀도하에서는 현재 일반적으로 사용되고 있는 Al을 기본으로 하는 박막배선에서의 electromigration에 의한 결함 발생 그리고 비교적 낮은 전기전도도가 심각한 문제점으로 제기된다. 본 연구에서는 Al과 고전기전도도 물질인 Ag, Cu, 그리고 Au 박막배선에 대해 electromigration에 대한 저항성, 즉 activation energy를 측정 비교함으로써 차세대 극소전자 디바이스를 위한 박막배선재료로서의 가능성을 알아보고자 한다. Electromigration test 및 activation energy를 구하기 위해 순수 Ag, Cu, Al, Au 박막배선을 0.05$\mu\textrm{m}$ 두께, 100$\mu\textrm{m}$ 선폭, 그리고 5000$\mu\textrm{m}$ 길이로 SiO2 열산화막 처리된 pp-Si(100) 기판 위에 진공 증착시켰다. 가속화 실험을 위해 인가된 d.c. 전류밀도는 2$\times$106A/$ extrm{cm}^2$ 이었고, Al과 Au에서는 6$\times$106A/$\textrm{cm}^2$이었다. 실온에서 24$0^{\circ}C$까지의 온도범위에서 d.c.인가후의 저항변화를 측정하여 Median-Time-to-Failure(MTF)를 구한 후 Black 방정식을 이용하여 activation energy를 측정하였다. Activation energy는 Cu가 1.34eV로서 가장 높게 나타났고 Au가 1.01eV, Al이 0.66eV, Ag가 0.29eV의 순으로 측정되었다. 따라서 Cu와 Au 박막배선의 경우 Al보다 electromigration에 대한 저항력이 강한 고활성화에너지 특성을 갖는 고전기전도도 재료로서 차세대 극소전자 디바이스를 위한 대체 박막배선재료로서의 가능성을 보인다.

• Journal of Hydrogen and New Energy
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• v.8 no.3
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• pp.137-141
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• 1997

The effects of Ag addition to Zr-based hydrogen storage alloys ($Zr_{0.7}Ti_{0.3}V_{0.4}Ni_{1.2}Mn_{0.4}$, $Zr_{0.7}Ti_{0.3}V_{0.4}Ni_{1.2}Mn_{0.3}Cr_{0.1}$ and $Zr_{0.6}Ti_{0.4}V_{0.4}Ni_{1.2}Mn_{0.3}Fe_{0.1}$) on the electrode properties were examined. Ag-free and Ag-added Ze-based alloys were prepared by arc melting, crushed mechanically, and subjected to the electrochemical measurement. In $Zr_{0.7}Ti_{0.3}V_{0.4}Ni_{1.2}Mn_{0.4}$ alloy, 0.08 wt% Ag addition to the alloy improved the activation rate. Also Ag addition improved both activation property and discharge capacity in $Zr_{0.7}Ti_{0.3}V_{0.4}Ni_{1.2}Mn_{0.3}Cr_{0.1}$. For these Ag-added alloys, discharge capacities with the change of charge-discharge current density(10mA, 15mA and 30mA) are almost constant. Showing very high rate capability, discharge capacity of $Zr_{0.6}Ti_{0.4}V_{0.4}Ni_{1.2}Mn_{0.3}Fe_{0.1}$ alloy increased by Ag addition to the alloy. When the amount of Ag addition in $Zr_{0.7}Ti_{0.3}V_{0.4}Ni_{1.2}Mn_{0.4}$ alloy increased too much, the electrode properties became worse. Unveiling mechanism of effect of Ag addition is now progressing in our laboratory.

• Journal of Welding and Joining
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• v.20 no.1
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• pp.97-102
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• 2002

The growth kinetics of intermetallic compound layers formed between the eutectic Sn-3.5Ag solder and the Cu and Ni/Cu pad by solid stateisothermal aging were examined. The interfacial reaction between the eutectic Sn-3.5Ag solder and the Cu and Ni/Cu pad was investigated at 70, 120, 150, $170^{\circ}C$ for various times. The intermetallic compound layer was composed of two phase: $Cu_6Sn_5$(${\varepsilon}-phase$) adjacent to the solder and $Cu_6Sn_5$(${\varepsilon}-phase$) adjacent to the copper and on solder/Ni pad the intermetallic compound layer was $Ni_3Sn_4$. Because the values of time exponent(n) have approximately 0.5, the layer growth of the intermetallic compound was mainly controlled by volume diffusion over the temperature range studied. The apparent activation energy for layer growth of total Cu-Sn($Cu_6Sn_5 + Cu_6Sn$), $Cu_6Sn_5$, $Cu_3Sn$ and $Ni_3Sn_4$ intermetallic compound were 64.82kJ/mol, 48.53kJ/mol, 89.06kJ/mol and 71.08kJ/mol, respectively.

• Korean Journal of Materials Research
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• v.19 no.11
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• pp.569-575
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• 2009

In this study, the effects of silver treatment and activation on the physical and chemical properties of spherical activated carbon (SAC) were studied. The textural properties of SAC were characterized by BET surface area, XRD, SEM, iodine adsorption, strength intensity, pressure drop and antibacterial effects. BET surface areas of SACs decreased with an increase of the amount of PR before and after activation, and the BET surface areas of SACs were found to be about 2-3 times the size of those before activation. The XRD patterns showed their existing state as stable Ag crystals and carbon structure. The Ag particles are seaweedlike and uniform, being approximately 5-10 μm in size deposited on the surface of activated carbon. All of the samples had much more iodine adsorption capability after activation than before activation. The strength values of SACs increased with an increase of the amount of PR, and there was a smaller drop in the strength values of SACs with silver treatment than with non-silver treatment after activation. The Ag-SAC composites showed strong antibacterial activity against Escherichia coli (E. Coli).

• Journal of Microbiology and Biotechnology
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• v.26 no.9
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• pp.1542-1550
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• 2016

This is the first report that paromomycin, an antibiotic derived from Streptomyces sp. AG-P 1441 (AG-P 1441), controlled Phytophthora blight and soft rot diseases caused by Phytophthora capsici and Pectobacterium carotovorum, respectively, in chili pepper (Capsicum annum L.). Chili pepper plants treated with paromomycin by foliar spray or soil drenching 7 days prior to inoculation with P. capsici zoospores showed significant (p < 0.05) reduction in disease severity (%) when compared with untreated control plants. The disease severity of Phytophthora blight was recorded as 8% and 50% for foliar spray and soil drench, respectively, at 1.0 ppm of paromomycin, compared with untreated control, where disease severity was 83% and 100% by foliar spray and soil drench, respectively. A greater reduction of soft rot lesion areas per leaf disk was observed in treated plants using paromomycin (1.0 μg/ml) by infiltration or soil drench in comparison with untreated control plants. Paromomycin treatment did not negatively affect the growth of chili pepper. Furthermore, the treatment slightly promoted growth; this growth was supported by increased chlorophyll content in paromomycin-treated chili pepper plants. Additionally, paromomycin likely induced resistance as confirmed by the expression of pathogenesis-related (PR) genes: PR-1, β-1,3-glucanase, chitinase, PR-4, peroxidase, and PR-10, which enhanced plant defense against P. capsici in chili pepper. This finding indicates that AG-P 1441 plays a role in pathogen resistance upon the activation of defense genes, by secretion of the plant resistance elicitor, paromomycin.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.2
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• pp.346-351
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• 1997

The creep characteristics of an Al-5wt.% Ag alloy including the stress exponent, the activation energy for creep and the shape of the creep curve were investigated at a normalized shear stress extending from $ 10^{-5}{\;}to{\;}3{\times}10^{-4}$ and in the temperature range of 640-873 K, where silver is in solid solution. The experimental results shows that the stress exponent is 4.6, the activation energy is 141 kJ/mole, and the stacking fault energy is $180{\;}mJ/m^2$, suggesting that the creep behavior of Al-5 wt.% Ag is similiar to that reported for pure aluminum, and that under the current experimental conditions, the alloy behaves as a class II(metal class). The above creep characteristics obtained for Al-5 wt.% Ag are discussed in the light of prediction regarding deformation mechanisms in solid solution alloys.

• Proceedings of the Materials Research Society of Korea Conference
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• 2006.05a
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• pp.25.2-25.2
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• 2006