• Clean Technology
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• v.11 no.3
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• pp.153-164
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• 2005

This study found a reliable evaluation for four kinds of pb-Free plating solutions and it's layers, through pure Sn, SnAg, SnBi and SnCu. These four kind of solutions are widely used to pb-Free plating. Hull-cell, Harring-blum, coverage, throwing power, current efficiency, stability, life-time, composition, hardness, roughness, abrasion, scratch, solderability, corrosion, contact angle, morphology, SIR(Surface insulation resistance) and Whisker test were experimented. Also, Using ICP, XRF, FE-SEM, EDS, temperature/humidity chamber, solderability tester, hardness tester, roughness tester, abrasion tester, salt spray tester, contact angle tester, SIR tester, and microscope. In this paper could be shown the systematic and various analysis for reliability about four kinds of pb-Free plating solutions, processes and it's deposit surface.

• Journal of Sensor Science and Technology
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• v.14 no.6
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• pp.369-373
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• 2005

High quality CdTe single crystal for the solar cell fabrication was grown by vertical Bridgman method. The etch pits patterns of (111) surfaces of CdTe etched by Nakagawa solution was observed the (111)A compesed of Cd atoms with typical triangle etch pits of pyramid mode. From the photoluminescence measurement on (111)A, we observed free exciton ($E_{x}$) existing only high quality crystal and neutal acceptor bound exciton ($A^{0}$,X) having very strong peak intensity. Then, the full width at half maximum and binding energy of neutral acceptor bound exciton were 7 meV and 5.9 meV, respectively. By Haynes rule, an activation enery of impurity was 59 meV. Therefore, the origins on impurity level acting as a neutral acceptor were associated Ag or Cu elements.

• Progress in Superconductivity
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• v.6 no.2
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• pp.124-128
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• 2005

Homogeneous and fine powders for Bi-2223 tape were prepared by ultrasonic spray pyrolysis (SP) method from an aqueous solution of metal nitrates. Bi-2223 precursor powders were synthesized with various solutes concentration and pyrolysis temperature. The synthesized precursor powders had a narrow particle size distribution and an average particle size was $\~{\cal}um$. The reactivity of precursor powder by SP method is very high, attributed to the fine and narrow particle size distribution. Bi-2223/Ag tape was prepared using PIT method and followed by various sintering conditions. The precursor powder by SP method promoted a very quick formation of the Bi-2223 phase for short sintering time while the secondary phase such as large AEC phase and $Ca_2PbO_4$ were minimized for SP tapes.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04b
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• pp.42-45
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• 2004

High quality CdTe single crystal for the solar cell fabrication was grown by vertical Bridgman method. The etch pits patterns of {111}surfaces of CdTe etched by Nakagawa solution was observed the {111} A composed of Cd atoms with typical triangle etch pits of pyramid mode. From the photoluminescence measurement on {111}A, we observed free exciton($E_x$) existing only higy quality crystal and neytral acceptor bound exciton($A^0$,X) having very strong peak intensity. Then, the full width at half maximum and binding energy of neutral acceptor bound exciton were 7 meV and 5.9 meV, respectively. By Haynes rule, an actibation energy of impurity was 59 meV. Therefore, the origins on impurity level acting as a neutral acceptor were associated Ag or Cu elements.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.245-247
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• 2007

Sn-base solder bump is mainly used in micro-joining for flip chip package. The quantity of intermetallic compounds that was formed between Cu pad and solder interface importantly affects reliability. In this research, micro-bump was fabricated by two binary electroplating and the intermetallic compounds(IMCs) was estimated quantitatively. When the micro Sn-Ag solder bump was made by electroplating, SiC powder was added in the plating solution for protecting of intermetallic growth. Then, the intermetallic compounds growth was decrease with increase of amount of SiC power. However, if the mount of SiC particle exceeds 4 g/L, the effect of the growth restraint decrease rapidly.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.578-578
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• 2012

Graphene, a flat one-atom-thick two-dimensional layer of carbon atoms, is considered to be a promising candidate for nanoelectronics due to its exceptional electronic properties. Most of all, future nanoelectronics such as flexible displays and artificial electronic skins require low cost manufacturing process on flexible substrate to be integrated with high resolutions on large area. The solution based printing process can be applicable on plastic substrate at low temperature and also adequate for fabrication of electronics on large-area. The combination of printed electronics and graphene has allowed for the development of a variety of flexible electronic devices. As the first step of the study, we prepared the gate electrodes by printing onto the gate dielectric layer on PET substrate. We showed the performance of graphene field-effect transistor with electrohydrodynamic (EHD) inkjet-printed Ag gate electrodes.

• International Journal of Automotive Technology
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• v.2 no.2
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• pp.47-52
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• 2001

For the wear protection of cylinder bore in aluminum cast material the internal plasma spraying technology offers a new economical solution. The size and the weight of the engine blocks significantly can be decreased in comparison with the traditional cast iron sleeves. The coefficient of friction between piston ring and cylinder wall sensitively can be reduced and the wear resistance increased from several factors. The paper gives an overview of the technology from the AlSi cast alloys for engine block to the non destructive testing technology used after the machining by diamond honing. The actual results in engines of different types also will be shown. The economical advantages of the plasma spraying (or the internal coating in cylinder bore also will be discussed in comparison with the different alternatives of technology. The aspect of the market introduction also will be discussed in this paper.

• Proceedings of the KIEE Conference
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• 1987.11a
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• pp.197-199
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• 1987

This paper is investigated on characteristics of photoresist using inorganic a-$Se_{75}Ge_{25}$. The sensitivity of negative photoresist showing insolubility against alkalie solution, with Ag-photodoped, is more prominent than that of positive photoresist used with only a-$Se_{75}Ge_{25}$. It is also showed that the contrast of negative photoresist, ${\gamma}=2.9$, is more prominent than that of positive photoresist, ${\gamma}=1.4$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05b
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• pp.12-15
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• 2003

The YBaCuO thick film was deposited by the electrophoresis in the solution with different dimension particles. The morphology of the films deposited from different particles size was compared. The powder made by sol-gel method has the submicron particles, which deposit the most smooth film, and without microcracks after sintering. After sintering of the deposited film, the zone-melting process was carried out in low oxygen partial pressure (100 Pa) and Ag was used as substrate. And the zone-melted YBaCuO was studied by XRD.

• Journal of Powder Materials
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• v.15 no.6
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• pp.466-470
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• 2008

Experiments with a URT-0.5 accelerator (0.5 MeV, 50 ns, 1 kW) generating a nanosecond electron beam for irradiation of silver nitrate in various liquid solutions (water and toluene) were performed with the aim of producing silver nanopowders. A radiochemical reaction allows making weakly agglomerated pure Ag powders with particles of 10-15 nm and 30-50 nm in size by irradiation in toluene and water respectively. The injection of the nanosecond electron beam energy to the solution is optimal. As the absorbed dose increases, the output of the radiochemical reaction does not grow, but more agglomerated powders are synthesized.