• Journal of Chest Surgery
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• v.42 no.5
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• pp.649-652
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• 2009

A 75-year-old man presented with worsening dyspnea and intermittent dysphagia of one month's duration. A plain chest X-ray showed severe tracheal indentation by the right superior mediastinal mass. A chest CT established the diagnosis of a saccular aneurysm arising from the right proximal subclavian artery. Resection of the aneurysm and arterial revascularization was done through a median sternotomy with supraclavicular extension. Aneurysm wall and thrombus culture results were negative and pathology showed an atherosclerotic aneurysm. After the operation, dyspnea and dysphagia were reduced, but he died of advanced stomach cancer 8 months later.

• Proceedings of the KSME Conference
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• 2000.11a
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• pp.105-110
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• 2000

The Micromechanics test is new test method which uses comparatively smaller specimen than that required in conventional material tests. There are several methods, such as small-specimen creep test, the continuous indentation test, and small punch(SP) test. Among them, the small punch(SP) test method has been applied to many evaluation fields, such as a ductile-brittle transition temperature, stress corrosion cracking, hydrogen embrittlement, and fracture properties of advanced materials like FGM or MMC. In this study, the small punch(SP) test is performed to evaluate the mechanical properties at high/low temperature from $-196^{\circ}C$ to $650^{\circ}C$ and the material degradation for virgin and aged materials of 9Cr1MoVNb steel which has been recently developed. The ${\Delta}P/{\Delta}{\delta}$ parameter defined a slope in plastic membrane stretching region of SP load-displacement curve decreases according to the increase of specimen temperature, and that of aged materials is higher than the virgin material in all test temperatures. And the material degradation degrees of aged materials with $630^{\circ}C$ -500hrs and $630^{\circ}C$ -1000hrs are $36^{\circ}C$ and $38^{\circ}C$ respectively. These behaviors are good consistent with the results of hardness($H_v$) and maximum displacement(${\delta}_{max}$).

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.31 no.10
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• pp.73-78
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• 2003

MEMS technology in the field of aerospace engineering is more important with light weight and high resolution. Therefore the investigation of thin films properties is issued and the residual stress of thin filrns is one of the important problems to solve. Ion implantation without thermal annealing is applied for the stress gradient relaxation of LPCVD polysilicon films used as the structural part in MEMS. He+ and Ar+ ion implantations reduce the stress gradient of polysilicon films. The property modification of polysilicon films by ion implantation is also investigated. The elastic modulus and hardness of polysilicon films with ion implantation is studied by CSM method which is an advanced nano-indentation method. Ion implantation decreases the elastic modulus and hardness of polysilicon films. However, they are improved with increasing ion dose.

• The Journal of Advanced Prosthodontics
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• v.8 no.6
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• pp.479-488
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• 2016

PURPOSE. The aim of this study was to test the modulus of elasticity (E) across the interfaces of yttria stabilized zirconia (YTZP) / veneer multilayers using nanoindentation. MATERIALS AND METHODS. YTZP core material (KaVo-Everest, Germany) specimens were either coated with a liner (IPS e.max ZirLiner, Ivoclar-Vivadent) (Type-1) or left as-sintered (Type-2) and subsequently veneered with a pressable glass-ceramic (IPS e.max ZirPress, Ivoclar-Vivadent). A $5{\mu}m$ (nominal tip diameter) spherical indenter was used with a UMIS CSIRO 2000 (ASI, Canberra, Australia) nanoindenter system to test E across the exposed and polished interfaces of both specimen types. The multiple point load - partial unload method was used for E determination. All materials used were characterized using Scanning Electron Microscopy (SEM) and X - ray powder diffraction (XRD). E mappings of the areas tested were produced from the nanoindentation data. RESULTS. A significantly (P<.05) lower E value between Type-1 and Type-2 specimens at a distance of $40{\mu}m$ in the veneer material was associated with the liner. XRD and SEM characterization of the zirconia sample showed a fine grained bulk tetragonal phase. IPS e-max ZirPress and IPS e-max ZirLiner materials were characterized as amorphous. CONCLUSION. The liner between the YTZP core and the heat pressed veneer may act as a weak link in this dental multilayer due to its significantly (P<.05) lower E. The present study has shown nanoindentation using spherical indentation and the multiple point load - partial unload method to be reliable predictors of E and useful evaluation tools for layered dental ceramic interfaces.

• The Journal of Advanced Prosthodontics
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• v.5 no.1
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• pp.36-43
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• 2013

PURPOSE. The objective of this study was to compare the fracture toughness ($K_{Ic}$) obtained from the single edge V-notched beam (SEVNB) and the fractographic analysis (FTA) of a glass-infiltrated and a zirconia ceramic. MATERIALS AND METHODS. For each material, ten bar-shaped specimens were prepared for the SEVNB method ($3mm{\times}4mm{\times}25mm$) and the FTA method ($2mm{\times}4mm{\times}25mm$). The starter V-notch was prepared as the fracture initiating flaw for the SEVNB method. A Vickers indentation load of 49 N was used to create a controlled surface flaw on each FTA specimen. All specimens were loaded to fracture using a universal testing machine at a crosshead speed of 0.5-1 mm/min. The independent-samples t-test was used for the statistical analysis of the $K_{Ic}$ values at ${\alpha}$=0.05. RESULTS. The mean $K_{Ic}$ of zirconia ceramic obtained from SEVNB method ($5.4{\pm}1.6\;MPa{\cdot}m^{1/2}$) was comparable to that obtained from FTA method ($6.3{\pm}1.6\;MPa{\cdot}m^{1/2}$). The mean $K_{Ic}$ of glass-infiltrated ceramic obtained from SEVNB method ($4.1{\pm}0.6\;MPa{\cdot}m^{1/2}$) was significantly lower than that obtained from FTA method ($5.1{\pm}0.7\;MPa{\cdot}m^{1/2}$). CONCLUSION. The mean $K_{Ic}$ of the glass-infiltrated and zirconia ceramics obtained from the SEVNB method were lower than those obtained from FTA method even they were not significantly different for the zirconia material. The differences in the $K_{Ic}$ values could be a result of the differences in the characteristics of fracture initiating flaws of these two methods.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.73-77
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• 2017

Recently, fingerprint sensors have widely used for personal information security, and require quality evaluation to reduce an error of their recognition rate. Quality of fingerprint sensors is evaluated by variation of their electrical resistance introducing by contacts between a probe tip and a sensor electrode, Investigation on the materials compatability and structure optimization of probe is required to reduce deformation of sensor electrode for repeatability of quality testing. Nickel, steel(SK4), beryllium copper, and phosphor bronze were considered as probe materials, and beryllium copper was the most appropriate for materials of probe tips, considering indentation and contact resistance while being contacted probe tips on electrodes. Probes of an inspection part were manufactured with the single-unit structure for physical damage prevention and parallel processing capability. Inspection repeatability was evaluated by voltage variation of fingerprint sensors when the specific current was applied. A single-unit inspection part with beryllium copper probe tips showed excellent repeatability within ${\pm}0.003V$ of its voltage variation.

• Journal of the Korean institute of surface engineering
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• v.46 no.2
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• pp.68-74
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• 2013

For the coating of diamond films on WC-Co tools, a buffer interlayer is needed because Co catalyzes diamond into graphite. W and Ti were chosen as candidate interlayer materials to prevent the diffusion of Co during diamond deposition. W or Ti interlayer of $1{\mu}m$ thickness was deposited on WC-Co substrate under Ar in a DC magnetron sputter. After seeding treatment of the interlayer-deposited specimens in an ultrasonic bath containing nanometer diamond powders, $2{\mu}m$ thick nanocrystalline diamond (NCD) films were deposited at $600^{\circ}C$ over the metal layers in a 2.45 GHz microwave plasma CVD system. The cross-sectional morphology of films was observed by FESEM. X-ray diffraction and visual Raman spectroscopy were used to confirm the NCD crystal structure. Micro hardness was measured by nano-indenter. The coefficient of friction (COF) was measured by tribology test using ball on disk method. After tribology test, wear tracks were examined by optical microscope and alpha step profiler. Rockwell C indentation test was performed to characterize the adhesion between films and substrate. Ti and W were found good interlayer materials to act as Co diffusion barriers and diamond nucleation layers. The COFs on NCD films with W or Ti interlayer were measured as less than 0.1 whereas that on bare WC-Co was 0.6~1.0. However, W interlayer exhibited better results than Ti in terms of the adhesion to WC-Co substrate and to NCD film. This result is believed to be due to smaller difference in the coefficients of thermal expansion of the related films in the case of W interlayer than Ti one. By varying the thickness of W interlayer as 1, 2, and $4{\mu}m$ with a fixed $2{\mu}m$ thick NCD film, no difference in COF and wear behavior but a significant change in adhesion was observed. It was shown that the thicker the interlayer, the stronger the adhesion. It is suggested that thicker W interlayer is more effective in relieving the residual stress of NCD film during cooling after deposition and results in stronger adhesion.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.2 s.35
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• pp.121-128
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• 2005

Solder joints in microelectronic devices are frequently operated at an elevated temperature in service. They also experience plastic deformation caused by temperature excursion and difference in thermal expansion coefficients. Deformed solders can go through a recovery and recrystallization process at an elevated temperature, which would alter their microstructure and mechanical properties. In this study, to predict the changes in mechanical properties of Pb-free solder joints at high temperatures, the high temperature microhardness of several Pb-free and composite solders was measured as a function of temperature, deformation, and annealing condition. Solder alleys investigated include pure Sn, Sn-0.7Cu, Sn-3.5Ag, Sn-3.8Ag-0.7Cu, Sn-2.8Ag-7.0Cu (composite), and Sn-2.7Ag-4.9Cu-2.9Ni (composite). Numbers are all in wt.$\%$ unless specified otherwise. Solder pellets were cast at two cooling rates (0.4 and $7^{\circ}C$/s). The pellets were compressively deformed by $30\%$ and $50\%$ and annealed at $150^{\circ}C$ for 2 days. The microhardness was measured as a function of indentation temperature from 25 to $130^{\circ}C$. Their microstructure was also evaluated to correlate with the changes in microhardness.

• Journal of the Korean Vacuum Society
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• v.18 no.3
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• pp.203-207
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• 2009

Copper is known as a replacement for aluminum wire which is used for semiconductor. Because specific resistance of Cu ($1.67{\mu}{\Omega}$-cm) is lower than that of Al ($2.66{\mu}{\Omega}$-cm), Cu reduce RC delay time. Although melting point of Cu($1085^{\circ}C$) is higher than melting point of Al, Cu have characteristic to easily react with Silicon(Si) in low temperature, and it isn't good at adhesive strength with Si. For above these reason, research of diffusion barrier to prevent reaction between Cu and Si and to raise adhesive strength is steadily advanced. Our study group have researched on W-C-N (tungsten-carbon-nitrogen) Diffusion barrier for preventing diffusion of Cu through semiconductor. By recent studies, It's reported that W-C-N diffusion barrier can even precent Cu and Si diffusing effectively at high temperature. In this treatise, we vaporized different proportion of N into diffusion barrier to research Cu's Electromigration based on the results and studied surface hardness in the heat process using nano scale indentation system. We gain that diffusion barrier containing nitrogen is more stable for Cu's electromigration and has stronger surface hardness in heat treatment process.

• The Journal of Advanced Prosthodontics
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• v.13 no.6
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• pp.385-395
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• 2021

PURPOSE. To characterize the microstructure of three yttria partially stabilized zirconia ceramics and to compare their hardness, indentation fracture resistance (IFR), biaxial flexural strength (BFS), and fatigue flexural strength. MATERIALS AND METHODS. Disc-shaped specimens were obtained from 3Y-TZP (Vita YZ HT), 4Y-PSZ (Vita YZ ST) and 5Y-PSZ (Vita YZ XT), following the ISO 6872/2015 guidelines for BFS testing (final dimensions of 12 mm in diameter, 0.7 and 1.2 ± 0.1 mm in thicknesses). Energy-dispersive X-ray spectroscopy (EDX), X-ray diffraction (XRD) and scanning electron microscopy (SEM) analyses were performed, and mechanical properties were assessed by Vickers hardness, IFR, quasi-static BFS and fatigue tests. RESULTS. All ceramics showed similar chemical compositions, but mainly differed in the amount of yttria, which was higher as the amount of cubic phase in the diffractogram (5Y-PSZ > 4Y-PSZ > 3Y-TZP). The 4Y- and 5Y-PSZ specimens showed surface defects under SEM, while 3Y-TZP exhibited greater grain uniformity on the surface. 5Y-PSZ and 3Y-TZP presented the highest hardness values, while 3Y-TZP was higher than 4Y- and 5Y-PSZ with regard to the IFR. The 5Y-PSZ specimen (0.7 and 1.2 mm) showed the worst mechanical performance (fatigue BFS and cycles until failure), while 3Y-TZP and 4Y-PSZ presented statistically similar values, higher than 5Y-PSZ for both thicknesses (0.7 and 1.2 mm). Moreover, 3Y-TZP showed the highest (1.2 mm group) and the lowest (0.7 mm group) degradation percentage, and 5Y-PSZ had higher strength degradation than 4Y-PSZ group. CONCLUSION. Despite the microstructural differences, 4Y-PSZ and 3Y-TZP had similar fatigue behavior regardless of thickness. 5Y-PSZ had the lowest mechanical performance.