• Journal of Adhesion and Interface
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• v.7 no.4
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• pp.24-27
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• 2006

International standards claim the best possible reliability in industrial manufacturing processes. This is also essential for the application with manual applicators. The application of adhesives with manual applicators is one of the most frequently used application techniques. The range of application reaches from the building of prototypes in the automobile industry over the use in single or small-batch manufacturing up to applications in crafts enterprises. Conventional manual applicators for adhesives and sealants don't fulfill the demands in international standards for the best possible reliability. Only the worker is able to control the quality and the quantity of the bond. A velocity-controlled manual applicator solves these restrictions. Special sensors and micro controllers calculate the flow-rate, the velocity and the location of the manual applicator. This leads to stable and repeatable application processes which are claimed in international standards. The location of the bond can be compared with the nominal value, so that it is possible to check the quality of the bond during application. Furthermore there is the potential to document the data of the manufacturing process.

• Journal of Adhesion and Interface
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• v.7 no.4
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• pp.10-12
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• 2006

The successful use of adhesively bonded parts depends on the defect-free bond of the components. Therefore it is necessary to detect relevant faults and defects in an early state of the production. A 100% test should be pursued, but especially at complicated structures the detection of defects is not easy. Possible testing methods, which show a high potential for the NDT of adhesively bonded parts, are thermography based NDT methods. At present mainly two different procedures of active thermography are being used: Pulse and Lock-In Thermography. With pulse thermography the examined material is warmed up with a short energy pulse (light, eddy current or ultrasonic pulse) and the heat response is recorded after a certain time. The result is an infrared image which indicates material defects in different depths. This paper presents a variety of images showing the capability of Lock-In Thermography to image subsurface defects. Several examples of adhesives joints qualify the ultrasonic Lock-In-Thermography for the in-process quality control for adhesive bonded components.

• Proceedings of the KSME Conference
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• 2001.11a
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• pp.204-209
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• 2001

In this research, the effects of fiber stacking sequence on damage behaviors of FML(Fiber Metal Laminates) subject to indentation loading. SOP (Singly Oriented Ply) FML and angle ply FML were fabricated to study fiber orientation effects and angle ply effects. FML were fabricated by using 1050 aluminum laminate and carbon/epoxy prepreg. To increase adhesive bonding strength, Al laminate was etched using FPL methods. The static indentation test were conducted by using UTM(5ton, Shimadzu) under the 2side clamped conditions. During the tests, load and displacement curve and crack initiation and propagation behaviors were investigated. As fiber orientation angle increases, the crack initiation load of SOP FML increases because the stiffness induced by fiber orientation is increased. The penetration load of SOP FML is influenced by the deformation tendency and boundary conditions. However, the macro-crack of angle ply FML was initiated by fiber breakage of lower ply because angle plies in Angle ply FML prevents the crack growth and consolidation. The Angle ply FML has a critical cross-angle which prevent crack growth and consolidation. Damage behavior of Angle ply FML is changed around the critical cross-angle.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.6
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• pp.89-94
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• 2016

Consumer orientation requires that companies understand consumer needs and produce products that meet their expectations. This study proposes a new additive method that creates a polymer/metal bonding layer and thus can lighten the weight of helmets to develop a consumer-oriented 3D printing helmet. The composite solution is experimentally prepared with copper formate and a photopolymer resin. Stereolithography apparatus and photothermal reactions are introduced to fabricate an adhesive hybrid layer of copper metal and polymer. A UV pulse laser with a 355 nm wavelength was installed to simplify this process. Resistance, adhesion, and accuracy were investigated to evaluate the properties of the layer produced.

• 한국태양에너지학회:학술대회논문집
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• 2012.03a
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• pp.475-479
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• 2012

Thermal energy storage (TES) systems using Microencapsulated phase change material (MPCM) have been recognized as one of the most advanced energy technologies in enhancing the energy efficiency and sustainability of buildings. We examined a way to incorporate MPCMs with building materials through application for wood-based flooring. Wood-based flooring is commonly used for floor finish materials of residential buildings in Korea. However, wood-based flooring has not performed the characteristic of heat storage. This study is aimed at manufacturing high thermal efficiency wood flooring by increasing its heat storage using MPCM. As a result, this study confirmed that MPCM is dispersed well in adhesive through the scanning electron microscopy analysis. From the differential scanning calorimetry analysis, it can be confirmed that this composite has the characteristic of a thermal energy storage material. Also, we analyzed how this composition was formed by physical combination through the Fourier transform infrared analysis. Also, we confirmed the bonding strength of the material by using the universal testing machine.

• Journal of Magnetics
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• v.20 no.4
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• pp.444-449
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• 2015

Soft magnetic composites (SMCs) are especially suitable for the construction of low-cost, high-performance motors with 3-D magnetic fields. The main advantages of SMCs is that the iron particles are insulated by the surface coating and adhesive used for composite bonding, the eddy-current loss is much lower than that in laminated steels, especially at higher frequencies, and the hysteresis loss becomes the dominant component of core losses. These properties enable machines to operate at higher frequencies, resulting in reduced machine size and weight. In this paper, 3-D topologies are proposed that enable the application of SMCs to effectively reduce losses in high-speed permanent magnet (PM) motors. In addition, the electromagnetic field characteristics of the motor topologies are evaluated and compared using a non-linear finite element method (FEM) based on 3-D numerical analysis, and the feasibility of the motor designs is validated.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.57-64
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.51-59
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.1-6
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• 2014

The demand for fine-pitch devices is increasing due to an increase in I/O pin count, a reduction in power consumption, and a miniaturization of chip and package. In addition non-scalability of Cu pillar/Sn cap or Pb-free solder structure for fine-pitch interconnection leads to the development of bumpless interconnection system. Few bumpless interconnect systems such as BBUL technology, SAB technology, SAM technology, Cu-toCu thermocompression technology, and WOW's bumpless technology using an adhesive have been reviewed in this paper: The key requirements for Cu bumpless technology are the planarization, contamination-free surface, and surface activation.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.2
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• pp.13-20
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• 2008

This paper describes the methods of spacer-fabrication for wafer-level CIS(CMOS Image Sensor) assembly. We propose three methods using SU-8, PDMS and Si-interposer for the spacer-fabrication. For SU-8 spacer, novel wafer rotating system is developed and for PDMS(poly-dimethyl siloxane) spacer, new fabrication-method is used to bond with alignment of glass/PDMS/glass structure. And for Si-interposer, DFR(Dry Film Resist) is used as adhesive layer. The spacer using Si-interposer has the strongest bonding strength and the strength is 32.3MPa with shear.