• Transactions of the Korean Society of Automotive Engineers
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• v.6 no.4
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• pp.56-65
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• 1998

The bonding strength evaluation of the light weight materials for an electrical vehicle has been performed through the T-peel joint test in which the design paramete- rs such as joint style, adherend type, adherend thickness, adhesive thickness, and adhesive type are considered. It is experimentally observed that the peel strength of joint increases with the increase of the adherend thickness. With the increase of the adhesive thickness, however, the peel strength of joint increases a little. Aluminum-FRP adherend combination shows such higher peel strength than that of Aluminum-Aluminum adherend combination. For the adhesive bonded joint, the results of FEM analysis agree with those of experiment. The adhesive bonded joint reinfored with a rivet gives higher peel strength than that of the joint without rivet.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.05a
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• pp.517-520
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• 2008

Recently, use of adhesive bonding technology is increased to achieve the multi-material design for lightweight structure in automobile industry. In this paper, the fracture strength of adhesive has been studied with the single lap shear test conducted at different temperatures. The joint specimens are made from Al 5052 and SPRC 440 bonded with structural epoxy adhesive. The operating temperature has been considered up to $150[^{\circ}C]$ and the single lap shear test has been conducted with 5mm/min tensile rate. Fracture strength of adhesive bonded joint has been decreased with increase of operating temperature. The fracture strength at the $100[^{\circ}C]$ was shown about half of that at room temperature.

• Korean Journal of Materials Research
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• v.20 no.12
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• pp.681-685
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• 2010

The application of flip chip technology has been growing with the trend of miniaturization of electronic packages, especially in mobile electronics. Currently, several types of adhesive are used for flip chip bonding and these adhesives require some special properties; they must be solvent-free and fast curing and must ensure joint reliability against thermal fatigue and humidity. In this study, imidazole and its derivatives were added as curing catalysts to epoxy resin and their effects on the adhesive properties were investigated. Non-isothermal DSC analyses showed that the curing temperatures and the heat of reaction were dependent primarily on the type of catalyst. Isothermal dielectric analyses showed that the curing time was dependent on the amount of catalysts added as well as their type. The die shear strength increased with the increase of catalyst content while the Tg decreased. From this study, imidazole catalysts with low molecular weight are expected to be beneficial for snap curing and high adhesion strength for flip chip bonding applications.

• Transactions of the Korean Society of Automotive Engineers
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• v.13 no.4
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• pp.129-134
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• 2005

There is a strong industrial demand for the development of light-weight vehicle to improve fuel efficiency and dynamic performance. The effective method of achieving the weight reduction is to use low-density materials such as aluminum and magnesium. In applying these materials to the vehicle, it is often required to join dissimilar materials such as aluminum and steel. However, conventional joining method, namely resistance spot welding cannot be used in joining dissimilar materials. Self·piercing rivet(SPR) and adhesive bonding is a good alternative to resistance spot welding. In this study, the impact test of double hat-shaped member made by resistance spot welding, SPR and adhesive bonding was performed. As a result, various parameters of crashworthiness were analyzed and evaluated. Also, the applicability of SPR and adhesive bonding as an alternative to resistance spot welding was suggested.

• Journal of the korean academy of Pediatric Dentistry
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• v.28 no.2
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• pp.228-237
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• 2001

It is well known that glass-ionomer cement and compomer can release fluoride which can inhibit the progression of dental caries. The purposes of this study were to evaluate whether the fluoride from fluoride-containing filling materials can penetrate the dentin bonding adhesive and the dentin bonding adhesive can increase the bond strength of resin-modified glass ionomer. The amount of fluoride release from resin-modified glass ionomer and compomer was measured during 28 days of period and statistically analyzed by t-test. The bond strength of each material with/without dentin bonding adhesive was measured and also statistically analyzed by t-test. The distribution of fluoride from each material into the tooth was explored by electron probe microanalysis system(EPMA). The experimental teeth used were second primary molars about to exfoliate. The amount of fluoride release from each material was diminished by dentin bonding adhesive during 28 days(p<0.05) and the bond strength was not increased by dentin adhesive in resin-modified glass ionomer. The bond strength of group VI was not detectable. The distribution of fluoride from each material into teeth was according to dentino-enamel junction and dispersed into pulp from pulpal floor. The widest distribution was shown in resin-modified glass ionomer cement filled without the application of dentin bonding adhesive.

• The korean journal of orthodontics
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• v.22 no.2 s.37
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• pp.449-474
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• 1992

The purpose of this study was to evaluate the in vitro shear bond strengths to enamel and the failure sites of three ceramic brackets and one metal bracket in combination with light cured orthodontic adhesive. The brackets were divided into four groups. Each ceramic bracket group had different bonding mechanisms with adhesive. Group A; metal bracket with foil-mesh base (control group) Group B; ceramic bracket with micromechanical retention Group C; ceramic bracket with chemical bonding Group D; ceramic bracket with mechanical retention and chemical bonding. Forty extracted human lower first premolars were prepared for bonding and 10 brackets for each group were bonded to prepared enamel surfaces with $Transbond^{\circledR}$ light cured ortho dontic adhesive. Twenty four hours after bonding, the Instron universal testing machine was used to test the shear bond strength of brackets to enamel. After debonding, brackets and enamel surfaces were examined under stereoscopic microscope to determine the failure sites, Statistical analysis of the data was carried out with ANOVA test and $Scheff\acute{e}$ test using SPSS PC+. The results were as follows. 1 . There were statistically significant differences in mean shear bond strengths of three ceramic bracket groups (p < 0.05). Shear bond strengths of group C and D were significantly higher than that of group B and shear bond strength of group C was significantly higher than that of group D. 2. Group C and D both had significantly higher shear bond strengths than metal bracket (group A), but there were no significant differences in shear bond strengths between group A and B (p < 0.05). 3. The failure sites of four bracket groups were also different. Group C and D failed primarily at enamel-adhesive interface, but group A and B failed primarily at bracket base-adhesive interface. 4. Among all ceramic bracket groups, group B was very similar to metal bracket in the aspect of shear bond strength and failure site.

• Journal of Adhesion and Interface
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• v.4 no.2
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• pp.21-29
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• 2003

Hot AC anodising has been evaluated us pre-treatment for aluminium prior to structural adhesive bonding. Phosphoric and sulphuric acid hot AC anodising showed very promising adhesion promoter capabilities with durability comparable with the best standard DC anodising procedures. AC anodising does not required etching prior to anodising and offers u pre-treatment time down to 20 seconds. The interface/interphase between the aluminium substrate and the adhesive was investigated in order to get a better understanding of the involved adhesion mechanisms and to explain the long-tenn properties. The alkaline medium formed at the oxide layer/adhesive interface has been shown to induce a partial dissolution of the oxide layer leading to the formation of metallic ions which diffuse in the adhesive (EPMA measurements). The effect of diffusion of the Al ions on adhesion and joint durability is still uncertain but studies showed that pre-bond moisture affected the joints durability and to some extent the diffusion length. specially for DC anodised samples. So far no direct correlation could be established between the diffusion length d and the joints durability but new trials with better control over the elapsed time between bonding and adhesive curing are expected to help getting a better understanding of the involved mechanisms.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.4
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• pp.127-134
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• 2021

In this study, the adhesive fracturing characteristics of a DCB specimen due to single and heterogeneous bonding materials under tearing load was investigated. The experiments were conducted to examine the fracturing properties of the adhesive DCB specimen. As an experimental condition, a forced displacement of 3mm/min was applied to one side while the other side was fixed. As a result of the experiment, it was found that the AL6061-T6 material was superior to the CFRP material in terms of maximum stress, specific strength, and energy release rate when compared to the adhesive fracturing property of a single material. We tested CFRP-AL, a heterogeneous bonding material, and compared its experimental results to the results from the single materials. Based on these results, CFRP-AL with a heterogeneous bonding material was observed to have the superior structural safety compared to single materials for the mode III fracture type.

• Journal of Welding and Joining
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• v.33 no.5
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• pp.41-46
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• 2015

The snap cure NCP(non-conducive paste) adhesive material is essentially required for the high productivity flip chip bonding process. In this study, the accessibility of DEA(dielectric analysis) method for the evaluation of snap cure behavior was investigated with comparison to the isothermal DSC(differential scanning calorimetry) method. NCP adhesive was mainly formulated with epoxy resin and imidazole curing agent. Even though there were some noise in the dielectric loss factor curve measured by DEA, the cure start and completion points could be specified clearly through the data processing of cumulation and deviation method. Degree of cure by DEA method which was measured from the variation of the dielectric loss factor of adhesive material was corresponded to about 80% of the degree of cure by DSC method which was measured from the heat of curing reaction. Because the adhesive joint cured to the degree of 80% in the view point of chemical reaction reveals the sufficient mechanical strength, DEA method is expected to be used effectively in the estimation of the high speed curing behavior of snap cure type NCP adhesive material for flip chip bonding.

• Journal of the Korean Wood Science and Technology
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• v.34 no.3
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• pp.22-29
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• 2006

The overlaid panels are important materials in interior and construction with added surface layers (PVC films, decorative paper, decorative veneer). Generally, the adhesive for decorative veneer to wood-based panel is urea-formaldehyde (UF) adhesive which cause the emission of formaldehyde during not only the manufacturing process, but also service life. In this study, environment-friendly SIS-based hotmelt pressure-sensitive adhesive (PSA) was evaluated as a adhesive for bonding a decorative veneer. The various SIS-based hotmelt PSA was blended as a function of diblock content, softening point of tackifier, tackifier content, and applied to bonding the decorative veneer.