• Journal of the Microelectronics and Packaging Society
• /
• v.26 no.4
• /
• pp.133-140
• /
• 2019

The effects of thermal cycle conditions on the bonding strength and crack propagation behaviors in electroplated Cr/electroplated Ni-P coatings were systematically evaluated. 1^st heat treatment was performed at 500℃ for 3 hours after electroplating Ni-P, and then, 2^nd heat treatment was performed at 750℃ for 6 hours after electroplating Cr. The measured bonding strength by ASTM C633 were around 25.6 MPa before thermal cycling, while it increased to 47.6 MPa, after 1,000 cycles. Increasing thermal cycles led to dominant fail mode with cohesive failure inside adhesive, which seemed to be closely related to the increasing bonding strength possibly not only due to higher Cr surface roughness, but also to penetrated channeling crack density. Also, increasing density of penetrated channeling cracks in electroplating Cr layer led to slightly stronger bonding strength due to mechanical interlocking effects of adhesive inside channeling cracks.

• Restorative Dentistry and Endodontics
• /
• v.40 no.1
• /
• pp.68-74
• /
• 2015

Objectives: This study examined the effects of additional acid etching on the dentin bond strength of one-step self-etch adhesives with different compositions and pH. The effect of ethanol wetting on etched dentin bond strength of self-etch adhesives was also evaluated. Materials and Methods: Forty-two human permanent molars were classified into 21 groups according to the adhesive types (Clearfil SE Bond [SE, control]; G-aenial Bond [GB]; Xeno V [XV]; Beauti Bond [BB]; Adper Easy Bond [AE]; Single Bond Universal [SU]; All Bond Universal [AU]), and the dentin conditioning methods. Composite resins were placed on the dentin surfaces, and the teeth were sectioned. The microtensile bond strength was measured, and the failure mode of the fractured specimens was examined. The data were analyzed statistically using two-way ANOVA and Duncan's post hoc test. Results: In GB, XV and SE ($pH{\leq}2$), the bond strength was decreased significantly when the dentin was etched (p < 0.05). In BB, AE and SU (pH 2.4 - 2.7), additional etching did not affect the bond strength (p > 0.05). In AU (pH = 3.2), additional etching increased the bond strength significantly (p < 0.05). When adhesives were applied to the acid etched dentin with ethanol-wet bonding, the bond strength was significantly higher than that of the no ethanol-wet bonding groups, and the incidence of cohesive failure was increased. Conclusions: The effect of additional acid etching on the dentin bond strength was influenced by the pH of one-step self-etch adhesives. Ethanol wetting on etched dentin could create a stronger bonding performance of one-step self-etch adhesives for acid etched dentin.

• Structural Engineering and Mechanics
• /
• v.53 no.5
• /
• pp.1017-1030
• /
• 2015

In this study, the finite element method was used to analyze the distribution of the adhesive shear stresses in the single-lap bonded joint of two plates 2024-T3 aluminum with and without defects. The effects of the adhesive properties (shear modulus, the thickness and the length of the adhesive were highlighted. The results prove that the shear stresses are located on the free edges of the adhesively bonding region, and reach maximum values near the defect, because the concentration of high stress occurs near this area.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2009.10a
• /
• pp.218-220
• /
• 2009

We proposed an enhanced substrate-assembling technique using adhesive patterned spacers for flexible liquid crystal displays (LCDs). The negative photoresister was used for the rigid columnar spacers and the strong substrate-bonding agent. The proposed technique is expected to be a good candidate for manufacturing method of flexible LCDs.

• The korean journal of orthodontics
• /
• v.43 no.2
• /
• pp.96-100
• /
• 2013

Objective: To evaluate the effects of contamination by either blood or a hemostatic agent on the shear bond strength (SBS) of orthodontic buttons. Methods: We used 45 freshly extracted, non-carious, impacted third molars that were divided into 3 groups of 15. Each tooth was etched with 37% phosphoric acid gel for 30 s. Human blood or the blood stopper agent was applied to the tooth surface in groups I and II, respectively. Group III teeth were untreated (controls). Orthodontic buttons were bonded to the teeth using light-curing composite resin. After bonding, the SBS of the button was determined using a Universal testing machine. Any adhesive remaining after debonding was assessed and scored according to the modified adhesive remnant index (ARI). ANOVA with post-hoc Tukey's test was used to determine significant differences in SBS and Fisher's exact test, to determine significant differences in ARI scores among groups. Results: ANOVA indicated a significant difference between groups (p < 0.001). The highest SBS values were measured in group III ($10.73{\pm}0.96$ MPa). The SBS values for teeth in groups I and II were significantly lower than that of group III (p < 0.001). The lowest SBS values were observed in group I teeth ($4.17{\pm}1.11$ MPa) (p < 0.001). Conclusions: Contamination of tooth surfaces with either blood or hemostatic agent significantly decreased the SBS of orthodontic buttons. When the contamination risk is high, it is recommended to use the blood stopper agent when bonding orthodontic buttons on impacted teeth.

• The Journal of Korean Academy of Prosthodontics
• /
• v.36 no.2
• /
• pp.336-354
• /
• 1998

Traditionally, many kinds of mechanical bonding techniques were used for bonding resins to the surface of the metal alloys. If there is a seperation between resin and metal junction by stress accumulation and temperature change of oral cavity, the cracks or crazing may occur, accompanied by failure of resin bonding to metal. This study was designed to compare the shear bond strength of the type IV gold alloy and Cr-Co alloy surfaces treated with various methods and thermocycling. Universal Instron (Model 1000) and scanning electron microscope (JEOL, Japan) was used to record the shear bond strength of 5 groups. Forty specimens were made for each group ; group 1 was treated with sandblasting only, group 2 was coated with V-primer after sandblasting, group 3 was coated with Metal primer, group 4 wase coated with MR Bond and group 5 was coated with silane. After treated with various methods, thermocycling was done for half of the each group. The surfaces of failed pattern were observed with SEM. The results were as follows : 1. Shear bond strength of the group 1 was lower than that of another groups in type IV gold alloys and bond strength of the group 1, 2 were lower than that of group 3, 4, 5 in Cr-Co alloys. 2. Shear bond strength of the gold alloy with resin was higher than that of Cr-Co alloy when specimens were coated with V-primer. 3. Shear bond strength of the Co-Cr alloys with resin was higher than that of gold alloys when specimens were coated with Metal primer. 4. The bond strength of all specimens did not decreased significantly after thermocycling. 5. Adhesive failures were found in group 1 and Cr-Co alloy in group 2, but adhesive and cohesive failures were found in another groups.

• The Journal of Advanced Prosthodontics
• /
• v.7 no.6
• /
• pp.446-453
• /
• 2015

PURPOSE. To compare the push-out bond strength of feldspar and zirconia-based ceramic inlays bonded to dentin with different resin cements following simulated aging. MATERIALS AND METHODS. Occlusal cavities in 80 extracted molars were restored in 2 groups (n=40) with CAD/CAM feldspar (Vitablocs Trilux forte) (FP) and zirconia-based (Ceramill Zi) (ZR) ceramic inlays. The fabricated inlays were luted in 2 subgroups (n=20) with either etch-and-bond (RelyX Ultimate Clicker) (EB) or self-adhesive (RelyX Unicem Aplicap) (SA) resin cement. Ten inlays in each subgroup were subjected to 3,500 thermal cycles and 24,000 loading cycles, while the other 10 served as control. Horizontal 3 mm thick specimens were cut out of the restored teeth for push out bond strength testing. Bond strength data were statistically analyzed using 1-way ANOVA and Tukey's comparisons at ${\alpha}=.05$. The mode of ceramic-cement-dentin bond failure for each specimen was also assessed. RESULTS. No statistically significant differences were noticed between FP and ZR bond strength to dentin in all subgroups (ANOVA, P=.05113). No differences were noticed between EB and SA (Tukey's, P>.05) bonded to either type of ceramics. Both adhesive and mixed modes of bond failure were dominant for non-aged inlays. Simulated aging had no significant effect on bond strength values (Tukey's, P>.05) of all ceramic-cement combinations although the adhesive mode of bond failure became more common (60-80%) in aged inlays. CONCLUSION. The suggested cement-ceramic combinations offer comparable bonding performance to dentin substrate either before or after simulated aging that seems to have no adverse effect on the achieved bond.

• The Journal of the Korean dental association
• /
• v.50 no.7
• /
• pp.377-383
• /
• 2012

Recently, ceramic materials have become a popular choice for dentists performing esthetic indirect restorations. The longevity and success of ceramic dental restorations depends on the adhesive procedures of resin cements. However, dental ceramics can be classified in various ways, depending on the compositions. Also, the applications for resin cement require multiple clinical steps. Therefore, understanding the different ceramic substrates involved in each procedure, as well as the proper adhesive steps for the resin cements is important to us for long-term clinical success.

• Journal of the korean academy of Pediatric Dentistry
• /
• v.33 no.3
• /
• pp.377-387
• /
• 2006

The objective of this study was to evaluate the influence of multiple adhesive coatings on the thickness of hybrid and adhesive layer and shear bond strength(SBS) of self-etch adhesives and self-etch primer adhesives. The buccal or lingual crown dentin of extracted human molars was used. Self-etch adhesives or self-etch primer adhesives were applied 1, 2 and 3 times on the dentin before light curing. In another group adhesives were reapplied after light curing first layer. Treated surfaces were prepared to measure the thickness of hybrid and adhesive layer with SEM, and shear bond strength to dentin using an Instron machine. The following results were obtained : 1. The adhesive layers increased with the number of coatings(p<0.05) with all adhesives. Adpor Prompt L-Pop and Xeno III were significantly thinner than self-etch primer adhesives (p<0.05). 2. The thickness of hybrid layers increased with the number of coatings (p<0.05). 3. The shear bonding strength of Unifil Bond and Clearfill SE Bond were higher than Scotchbond Multipurpose Plus and Adpor Prompt L-Pop (p<0.05), and similar with Xeno III. 4. The shear bond strength increased significantly with the number of coatings in Adpor Prompt L-Pop(p<0.05), but decreased at 3 times in AdheSE Bond(p>0.05). 5. In Adpor Prompt L-Pop and Xeno III, the shear bond strength decreased when adhesives were reapplied after curing the first adhesive layer.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.22 no.3
• /
• pp.199-204
• /
• 2009

The effect of temperature on ACF thermocompression bonding for FPD assembly was investigated, It was found that Au bumps on driver IC's were not bonded to the glass substrate when the bonding temperature was below $140^{\circ}C$ so bonds were made at temperatures of $163^{\circ}C$, $178^{\circ}C$ and $199^{\circ}C$ for further testing. The bonding time and pressure were constant to 3 sec and 3.038 MPa. To test bond reliability, FPD assemblies were subjected to thermal shock storage tests ($-30^{\circ}C$, $1\;Hr\;{\leftrightarrow}80^{\circ}C$, 1 Hr, 10 Cycles) and func! tionality was verified by driver testing. It was found all of FPDs were functional after the thermal cycling. Additionally, Au bumps were bonded using ACF's with higher conductive particle densities at bonding temperatures above $163^{\circ}C$. From the experimental results, when the bonding temperature was increased from $163^{\circ}C$ to $199^{\circ}C$, the curing time could be reduced and more conductive particles were retained at the bonding interface between the Au bump and glass substrate.