• Journal of the Korea institute for structural maintenance and inspection
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• v.19 no.1
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• pp.35-44
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• 2015

Two main parameters were examined such as CSA content and polymer-binder ratio to find effects on the strength, water absorption, chloride ion penetration depth, carbonation depth, length change and chemical resistance of polymer-modified mortar with CSA and EVA polymer powder (EVAPP). As results, compressive, flexural, tensile, adhesive strengths, and length change of the polymer-modified mortar with CSA and EVAPP increases with increasing CSA content and polymer-binder ratio, although the water absorption, chloride ion penetration depth, and carbonation depth decrease with increasing polymer-binder ratio and CSA content, and also the chemical resistance decreases. Such strength and durability development is attributed to the high tensile strength of EVA polymer and the improved bond between cement hydrates and aggregates because of the addition of EVAPP and CSA.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.490-490
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• 2011

Graphene, hexagonal network of carbon atoms forming a one-atom thick planar sheet, has been emerged as a fascinating material for future nanoelectronics. Huge attention has been captured by its extraordinary electronic properties, such as bipolar conductance, half integer quantum Hall effect at room temperature, ballistic transport over ${\sim}0.4{\mu}m$ length and extremely high carrier mobility at room temperature. Several approaches have been developed to produce graphene, such as micromechanical cleavage of highly ordered pyrolytic graphite using adhesive tape, chemical reduction of exfoliated graphite oxide, epitaxial growth of graphene on SiC and single crystalline metal substrate, and chemical vapor deposition (CVD) synthesis. In particular, direct synthesis of graphene using metal catalytic substrate in CVD process provides a new way to large-scale production of graphene film for realization of graphene-based electronics. In this method, metal catalytic substrates including Ni and Cu have been used for CVD synthesis of graphene. There are two proposed mechanism of graphene synthesis: carbon diffusion and precipitation for graphene synthesized on Ni, and surface adsorption for graphene synthesized on Cu, namely, self-limiting growth mechanism, which can be divided by difference of carbon solubility of the metals. Here we present that large area, uniform, and layer controllable graphene synthesized on Cu catalytic substrate is achieved by acetylene-assisted CVD. The number of graphene layer can be simply controlled by adjusting acetylene injection time, verified by Raman spectroscopy. Structural features and full details of mechanism for the growth of layer controllable graphene on Cu were systematically explored by transmission electron microscopy, atomic force microscopy, and secondary ion mass spectroscopy.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.482-483
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• 2011

Graphene is a good candidate for the future nano-electronic materials because it has excellent conductivity, mobility, transparency, flexibility and others. Until now, most graphene researches are focused on the nano electronic device applications, however, biological application of graphene has been relatively less reported. We have fabricated a deoxyribonucleic acid (DNA) conjugated graphene field-effect transistor (FET) and measured the electrical transport characteristics. We have used graphene sheets grown on Ni substrates by chemical vapour deposition. The Raman spectra of graphene sheets indicate high quality and only a few number of layers. The synthesized graphene is transferred on top of the substrate with pre-patterned electrodes by the floating-and-scooping method [1]. Then we applied adhesive tapes on the surface of the graphene to define graphene flakes of a few micron sizes near the electrodes. The current-voltage characteristic of the graphene layer before stripping shows linear zero gate bias conductance and no gate operation. After stripping, the zero gate bias conductance of the device is reduced and clear gate operation is observed. The change of FET characteristics before and after stripping is due to the formation of a micron size graphene flake. After combined with 30 base pairs single-stranded poly(dT) DNA molecules, the conductance and gate operation of the graphene flake FETs become slightly smaller than that of the pristine ones. It is considered that DNA is to be stably binding to the graphene layer due to the ${\pi}-{\pi}$ stacking interaction between nucleic bases and the surface of graphene. And this binding can modulate the electrical transport properties of graphene FETs. We also calculate the field-effect mobility of pristine and DNA conjugated graphene FET devices.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.386-386
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• 2011

탄소나노튜브는 큰 길이 대 직경 비와 뛰어난 전기적 특성으로 인해 차세대 전계 방출 소자로 주목 받고 있다. 실질적인 전계방출 디스플레이로의 응용을 위한 대면적 제작과 유리 기판 사용을 위해 이용되었던 페이스트(paste)법은 높은 전기장 하에서 장시간 전계방출시 탄소나노튜브 전계방출원과 페이스트(paste)간의 낮은 접착력 때문에 발생하는 탄소나노튜브의 탈루현상(omission)과 유기물질(organic paste)에서 발생하는 탈기체(out-gassing) 문제점이 있었다. 최근 이런 문제점을 개선하기 위해 유기물질(organic paste)를 대체하여 금속바인더(metal binder) 물질을 사용한 결과들이 보고되고 있다. 본 연구에서는 유리기판 위에 제작된 탄소나노튜브 전계방출원의 수명 향상을 위하여 금속바인더와 후속 열처리법의 변화에 따른 전계방출 안정성을 분석하였다. 금속바인더는 접합층/ 접착층(soldering layer/ adhesive layer)으로 구성되어 있으며, 일반적인 소다석회유리(soda-lime glass)에 스퍼터(DC magnetron sputtering system)를 이용하여 증착하였다. 접착층은 유리기판과 접합층의 접착력 향상을 위해 사용되며, 접합층은 기판과 탄소나노튜브 전계방출원을 접합하는 역할과 전계방출 측정시 전극이 되기 때문에 우수한 전기 전도성과 내산화성을 필요로 한다. 본 실험에서는 일반적으로 유리기판과 접착력이 좋다고 알려진 Cr, Ti, Ni, Mo을 접착층으로 사용하였으며, 접합성과 전기전도성, 내산화성이 뛰어난 귀금속 계열의 금속을 접합층으로 사용하였다. 탄소나노튜브를 1,2-디클로로에탄(1,2-dichloroethane, DCE)에 분산시킨 용액을 스프레이방법을 이용하여 증착시켰으며, 후속 열처리 방법을 통하여 접합층과 결합시켰다. 금속바인더와 후속 열처리법의 변화에 따른 접착력과 표면형상(morphology)의 변화를 주사전자현미경(scanning electron microscopy)를 이용하여 분석하였으며, 다이오드 타입에 디씨 바이어스(DC bias)를 사용하여 전계방출특성을 측정하였다[1,2].

• Korean Journal of Materials Research
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• v.5 no.8
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• pp.929-935
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• 1995

In order to develop COG (Chip On Glass) technology for LCD module interconnecting the driver IC to Al pad electrode on the glass substrate, Anisotropic Conductive Adhesive(ACA) process, the most promising one among COG technologies, was investigated. ACA process was carried out by two steps, dispensing of ACA resin in the bonding area and curing by W radiation. Load on the chip was ranged from 2.0 to 15kg and the chip was heated at about 12$0^{\circ}C$. In resin, the density of conductive particles coated with Au or Ni at the surface were 500, 1000, 2000 and 4000 particles/$\textrm{mm}^2$, and the diameter of particles were 5, 7 and 12${\mu}{\textrm}{m}$. As a result of the experiments, ACA process using ACA particle of diameter and density of 5${\mu}{\textrm}{m}$ and 4000 particles/$\textrm{mm}^2$ respectively shows optimum characteristic with the stabilzed bonding properties and contact resistance.

• Textile Coloration and Finishing
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• v.29 no.3
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• pp.162-170
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• 2017

Fastener tapes are widely used as auxiliary materials in textile products, and military textiles products are also applied. However, in Korea, the HL3-WA class of KS K 1309 was applied to military uniforms without consideration of the operating environment. Instead of adopting the standard of initial strength for Korean military uniforms, the US military applied the value after 3 washings, and presented different properties according to the items. Also in Japan, the standard was applied differently according to products in general clothing. The purpose of this study in to examine the quality level of fastener tapes used for military materials. The changes of tensile shear strength and peel strength of military and commercial fastener tape were studied after washing. As a result, the initial strength of the current military fastener tapes was higher than commercial one, but the strength retention rate was rapidly decreased as the number of washing. So it was confirmed that the decrease in strength was relatively lower than commercial one. It is necessary to improve the durability by adjusting the adhesive strength to suit the purpose of the product, and it is necessary to consider the priority of maintaining the durability according to the initial performance and repeated use according to the use environment, respectively.

• Analytical Science and Technology
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• v.29 no.6
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• pp.300-304
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• 2016

The asphalt antistripping agents were synthesized from ethylenediamine (ED) or N,N'-bis(2-hydroxyethyl)ethylenediamine (HEED) with three different fatty acids. The formation of amide bonds were successfully performed and confirmed by FT-IR and $^1H-NMR$ data. The adhesive properties of antistripping agents were compared in terms of contact angle and BBS test. The reaction product of ED with waste animal fat exhibited the most hydrophobic by the contact angle measurement, and the strongest water resistance of 94 % by BBS test. However, the reaction product of ED with waste vegetable oil showed the strongest absolute bond strength of ca. 3610 and 3227 kPa for before and after water conditioning, respectively. For the bond strength in general, the reaction products of ED were superior to HEED reaction products, and the reaction products of animal fat and waste vegetable oil were superior to those of pure soybean oil.

• Steel and Composite Structures
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• v.35 no.4
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• pp.463-474
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• 2020

In this paper, the influence of adding multi-walled carbon nanotube (MWCNT) on the pull behavior of steel and GFRP bars in ultra-high-performance concrete (UHPC) was examined experimentally and numerically. For numerical analysis, 3D nonlinear finite element modeling (FEM) with the help of ABAQUS software was used. Mechanical properties of the specimens, including Young's modulus, tensile strength and compressive strength, were extracted from the experimental results of the tests performed on standard cube specimens and for different values of weight percent of MWCNTs. In order to consider more realistic assumptions, the bond between concrete and bar was simulated using adhesive surfaces and Cohesive Zone Model (CZM), whose parameters were obtained by calibrating the results of the finite element model with the experimental results of pullout tests. The accuracy of the results of the finite element model was proved with conducting the pullout experimental test which showed high accuracy of the proposed model. Then, the effect of different parameters such as the material of bar, the diameter of the bar, as well as the weight percent of MWCNT on the bond behavior of bar and UHPC were studied. The results suggest that modifying UHPC with MWCNT improves bond strength between concrete and bar. In MWCNT per 0.01 and 0.3 wt% of MWCNT, the maximum pullout strength of steel bar with a diameter of 16 mm increased by 52.5% and 58.7% compared to the control specimen (UHPC without nanoparticle). Also, this increase in GFRP bars with a diameter of 16 mm was 34.3% and 45%.

• Polymer(Korea)
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• v.38 no.5
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• pp.682-686
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• 2014

To prepare transparent acrylic pressure sensitive adhesives (PSAs), terpolymer syrups were photopolymerized from 2- ethylhexyl acrylate and 2-hydroxyethyl acrylate with third monomer having different chemical structure. After polymerization, 1,6-hexanediol diacrylate as a crosslinker and a photoinitiator were added and then UV-irradiated to prepare the PSAs. The adhesion performances and optical characteristics of the PSAs were investigated. Their adhesion performance was dependent on the composition of monomers in the polymer chain but optical properties were maintained at a suitable level. The PSAs prepared by bulky and heteroatom-containing monomers such as IBOA, THFA, and ACMO showed better adhesion performance than others.

• Journal of the Semiconductor & Display Technology
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• v.15 no.4
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• pp.10-15
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• 2016

In this paper, novel ball grid array (BGA) interconnection process using solderable anisotropic conductive adhesives (SACAs) with low-melting-point alloy (LMPA) fillers have been developed to enhance the processability in the conventional capillary underfill technique and to overcome the limitations in the no-flow underfill technique. To confirm the feasibility of the proposed technique, BGA interconnection test was performed using two types of SACA with different LMPA concentration (0 and 4 vol%). After the interconnection process, the interconnection characteristics such as morphology of conduction path and electrical properties of BGA assemblies were inspected and compared. The results indicated that BGA assemblies using SACA without LMPA fillers showed weak conduction path formation such as solder bump loss or short circuit formation because of the expansion of air bubbles within the interconnection area due to the relatively high reflow peak temperature. Meanwhile, assemblies using SACA with 4 vol% LMPAs showed stable metallurgical interconnection formation and electrical resistance due to the favorable selective wetting behavior of molten LMPAs for the solder bump and Cu metallization.