• Journal of Korean Society of Industrial and Systems Engineering
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• v.19 no.38
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• pp.105-115
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• 1996

According to the manual of shoemaking, the urethane adhesive for dress shoe applicable to the cementing process in KS G 3116 has been steadily developed. The evaluation test result of urethane adhesive, which is a mathematical model of men's shoe on shoemaking, is presented. Also, the quality test result of urethane adhesive, which is a list of experiment for field application and a model of assembling component in each unit process is introduced.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.121-124
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• 2003

A new form-joining process with the aid of an adhesive is proposed in which an epoxy adhesive is applied to a sheet metal pair, and before it cures the pair is clinched to cause the geometric constraint in the form of a protrusion. In order to reduce the forming load and the height of protrusions, a new die and punch set with a very small clearance was devised to reduce the depth of drawing and the forming load. Taguchi method was employed to find the optimal values of design parameters. To implement each case of the orthogonal array, the finite element method was used. The experiments showed that on the tensile-shear test, the bonding strength of the new form-joining process with an epoxy adhesive is approximately the same as that of the resistance spot welding; and in comparison with the other two form-joining processes with an epoxy adhesive, the height of protrusions was reduced by more than 65 percent and the forming load by 50 percent.

• Journal of the Korean Society for Precision Engineering
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• v.33 no.2
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• pp.149-155
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• 2016

In this study, we investigated the adhesive strength by molecular weight, mixture ratio, coating thickness, lamination temperature and aging condition of adhesive in manufacture process of Nylon-Aluminum for secondary aluminum pouch. It found that as the molecular weight of adhesive gets lower, the adhesive strength increases. In the mixture ratio, as the content of hardener get higher and as the content of solvent get lower, the adhesive strength increases. Also, as the coating thickness of adhesive get thicker, the adhesive strength increase. In addition, the adhesive strength is higher at 90 degrees of lamination temperature. So, it found that 90 degrees of lamination temperature is appropriate. In the aging condition when aged for 5 days, it found that the reaction and curing of adhesive is sufficient by measuring the adhesive strength.

• Transactions of Materials Processing
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• v.13 no.4
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• pp.342-349
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• 2004

The form-joining process (or clinching) uses a set of die and punch to impose the plastic deformation-induced geometric constraint on a sheet metal pair. The joining strength from the process ranges 50-70 percent of that of the resistance spot welding. In this paper, a new form-joining process with the aid of an adhesive is proposed in which an epoxy adhesive is applied to a sheet metal pair, and before it cures the pair is clinched to cause the geometric constraint in the form of a protrusion. In order to reduce the forming load and the height of protrusions, a new die and punch set with a very small clearance is devised to reduce the depth of drawing and the forming load. Taguchi method is employed to find the optimal values of design parameters. To implement each case of the orthogonal array, the finite element method is used. The experiments show that in the tensile-shear test, the bonding strength of the new form-joining process with an epoxy adhesive is approximately the same as that of the resistance spot welding; and in comparison with the other two form-joining processes with an epoxy adhesive, the height of protrusions is reduced by more than 65 percent and the forming load by 50 percent.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.11
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• pp.115-120
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• 2021

In this study, cigarettes, which are an essential element in the production of tobacco, are generally not cylindrical. The main materials used for cigarettes are generally hemp and pulp. For the production of cylindrical cigarettes, the cigarettes or cylinders are mounted via gluing. This adhesive is a vinyl acetate emulsion, a high-temperature melt adhesive, and is adhered in a cylindrical shape immediately after being linearly applied to the inner surface of the paper roll or a local part. These adhesives are greatly affected by the atmospheric temperature of the manufacturing space in summer and winter. In the summer, even if the adhesive is temporarily adhered, the coagulation time of the adhesive is long, and problems such as deterioration of the adhesive state occur. in the winter, there is a problem that the temperature of the manufacturing space is low and the adhesive force of the adhesive is poor, resulting in defective adhesive products. In order to solve these problems, another heat transfer device is utilized to cure the remaining adhesive to ensure higher adhesiveness.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.3
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• pp.14-19
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• 2008

In the semiconductor IC(Integrated Circuit) package, the top surface of silicon chip is directly attached to the area of the leadframe with a double-sided adhesive layer, in which the base layer have the upper adhesive layer and the lower adhesive layer. The IC package structure has been known to encounter a thermo-mechanical failure mode such as delamination. This failure mode is due to the residual stress on the adhesive surface of silicon chip and leadframe in the curing-cooling process. The induced thermal stress in the curing process has an influence on the cooling residual stress on the silicon chip and leadframe. In this paper, for the minimization of the chip surface damage, the adhesive topologies on the silicon chip are studied through the finite element analysis(FEA).

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1640-1644
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• 2006

The first issue that should be overcome in copper process is its poor adhesive strength between pure copper film and glass substrate. In this study, defining the adhesive strength of pure copper film on various substrates and clarifying the key deposition parameters are presented for the investigation of copper process. First, using different kinds of surface plasma treatments were studied and the results showed that the adhesive strength was not improved even though the roughness of glass substrate surface was increased. Second, adding an adhesive layer between glass substrate and pure copper film was used to enhance the adhesion. Based on the data in the present paper, adopting copper alloy film as an adhesive layer can have capability preventing peeling problem in copper process. Besides, Cu/Cu alloy structure could be etched with the same etchant with better taper angle than the one with single layer of Cu. Unlike Cu/Mo structure, there is no residual problem for Cu/Cu alloy structure during etching process. Finally, this structure was examined in electrical test without significant difference in comparison with the conventional metal process.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.10 s.181
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• pp.2520-2528
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• 2000

Mechanical and physical properties of composite materials make a great difference due to their cure process condition. In order to clarify the effect of cure process condition on the microscopic damage behavior and failure mechanism of Carbon/Epoxy composites, three point bend test has been performed. For this purpose, two kinds of specimens with single adhesive and multiple adhesive layers were prepared. For single adhesive layer, four different types of specimen were used, that is, non-sanding, sanding, cocured, laminated specimens. Three different types of specimen were also used for the multiple adhesive layer, non-sanding, sanding, cocured specimens. Acoustic emission technique has also been employed to monitor the damage progresses associated with each micro-failure mechanism. The characteristics of AE parameters associated with micro-failure mechanism of each specimen were discussed.

• Elastomers and Composites
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• v.57 no.2
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• pp.48-54
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• 2022

A polymeric adhesion promoter was synthesized to improve the adhesive strength of the Ni lead frame/epoxy composite. Poly(itaconic acid-co-acrylamide) (IAcAAM) was prepared by copolymerizing itaconic acid and acrylamide. We compared the adhesive strength between the Ni lead frame and epoxy composite according to the molecular weight of IAcAAM. The molecular weight of IAcAAM was controlled using an initiator, which made it possible to use IAcAAM in the epoxy molding compound (EMC) manufacturing process by modulating the melting temperature. The adhesive strength of Ni lead frame/epoxy composite increased with the addition of IAcAAM to the epoxy composite. In addition, as the molecular weight of IAcAAM increased, the adhesive strength of the Ni lead frame/epoxy composite slightly increased. We confirmed that IAcAAM with an appropriate molecular weight can be used in the EMC manufacturing process and increase the adhesive strength of the Ni lead frame/epoxy composite.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.05a
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• pp.131-135
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• 2003

The form-joining process (or clinching) uses a set of die and punch to impose the plastic deformation-induced geometric constraint on a sheet metal pair, But their joining strength ranges 50-70 percent of that of the resistance spot welding. In this paper, a new form-joining process with the aid of adhesive is proposed in which an epoxy adhesive is applied to a sheet metal pair, to improve joining strength. The strength and mechanical properties of the new process are discussed and compared for other joining processes.