• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2007.06a
• /
• pp.354-355
• /
• 2007

Process variables for manufacturing the $CuInSe_2$ thin film were established in order to clarify optimum conditions for growth of the thin film depending upon process conditions (substrate temperature, sputtering pressure, DC/RF Power), and then by changing a number of vapor deposition conditions and Annealing conditions variously, structural and electrical characteristics were measured. Thereby, optimum process variables were derived. For the manufacture of the $CuInSe_2$, Cu, In and Se were vapor-deposited in the named order. Among them, Cu and In were vapor-deposited by using the sputtering method in consideration of their adhesive force to the substrate, and the DC/RF power was controlled so that the composition of Cu and In might be 1 : 1, while the surface temperature having an effect on the quality of the thin film was changed from 100[$^{\circ}C$] to 300[$^{\circ}C$] at intervals of 50[$^{\circ}C$].

• Journal of Surface Science and Engineering
• /
• v.26 no.6
• /
• pp.316-326
• /
• 1993

Adhesion and hardeness are the most important properties of a hard coated layer which is applied to wear-resistant devices. Zr/ZrN layer was deposited on tool steel(SKH9) and stainless steel(SUS304) by a re-active D.C. magnetron sputtering technique and their microhardness and adhesion strength were measured for the films processed by changing the partial pressures of $N_2$ gas (4~10$\times$$10^{-4}$mbar) and the substrate bias voltage(0~250V). The adhesion strength was evaluated by acoustic signals through the scratch-test with the incremental applied load. As the partial pressure of $N_2$ gas and the substrate bias voltage were increased, the adhesion strength of tool steel was observed to be stronger than that of the stainless steel. The adhesion strength was generally, observed to decrease with the same tendency regardless of the kinds of substrates. The adhesion strength of tool steel was increased more and more strongly than that of stainless steel as heat-treated temperature was increased. The strength of tool steel was appeared to be high adhesion strength at $400^{\circ}C$. From the failure mode of the film during the scratch adhesion test, the cohesive failure was observed to be obvious and the adhesive failure in a minor portion in the Zr/ZrN doublelayer regardless of the kinds of substrates.

• Journal of Radiation Industry
• /
• v.5 no.1
• /
• pp.95-99
• /
• 2011

The electrical and mechanical properties of electrode for radiation detection are very important. In general, Au electrode and CZT crystal are combined to form ohmic contacts, and the best energy resolution is shown at the Au electrode. The metal contacts are fabricated by electroless deposition method, sputtering deposition method and thermal evaporation method. The electrode fabrication is easy with use of the thermal evaporation method, while an adhesive strength is weak. Thus interface materials such as Ag, Al and Ni were investigated to overcome defects generated by the this method. The thickness of the interface material between the Au electrode and the CZT crystal was 100 Angstroms, the Au electrode with thickness of 400 Angstroms was deposited. The Al+Au electrode is shown that the results of current-voltage and radiation response are similar to results of Au electrode.

• Korean Journal of Metals and Materials
• /
• v.47 no.7
• /
• pp.447-453
• /
• 2009

Isotropic conductive adhesives (ICAs) have been used or considered as an interconnect material for radio frequency identification (RFID) inlays or other flip chip assemblies due to the advantages of having a low temperature and high-speed bonding. In this work, the curing properties of commercial ICAs for the RFID tag application and the signal transmission in conductive lines that contained the ICA joints were evaluated as a function of the degree of cure at 900 MHz frequency range. The ICAs showed adequate signal transmission only after the curing process passed over the critical time. It was also found that the insertion loss of signal was more dependent on the contact states of Ag fillers in the bondline in preference to the electrical resistance of the ICA itself.

• Journal of Radiation Industry
• /
• v.4 no.4
• /
• pp.335-339
• /
• 2010

In this study, the surface of polyimide (PI) films was modified using ion implantation to enhance its adhesion to a deposited copper (Cu) layer. The surfaces of the PI films were implanted with 150 keV $Xe^+$ ions at fluences varying from $1{\times}10^{14}$ to $1{\time}10^{16}ions\;cm^{-2}$. The Cu layers were then deposited on the implanted PI. The surface properties of the implanted PI film were investigated based on the contact angle measurements, Fourier transform infrared spectroscopy (FT-IR), X-ray photoelectron spectroscopy (XPS), and atomic force microscopy (AFM). Furthermore, the adhesive strength between the deposited Cu layer and PI film was estimated through a scratch test using a nanoindenter. As a result, the surface environment of the PI film was changed by the ion implantation, which could have a significant effect on the adhesion between the deposited Cu layer and the PI.

• Elastomers and Composites
• /
• v.11 no.1
• /
• pp.54-62
• /
• 1976

It has been studied the graft copolymerization of glycidyl-methacrylate monomer containing two functional groups (vinyl- & epoxyl-) to chloroprene rubber. The reaction occured in the manner of chain transfer mechanism was carried out by means of solution polymerization in toluene in the presence of benzoyl peroxide as the radical initiator. The graft copolymer obtained from this work was analyzed by using IR spectrum, and the physical properties of the polymer such as the thermal behavior were also studied according to TG-DTA methods, and the potency of adhesiveness for the purpose of commercial application was investigated. Experimental results for the graft copolymerization are summarized as follows. 1) A small amount of initiator (0.5%) and 50% of monomer showed the best result for the grafting of monomer to the polymer chain of rubber while the 15% of rubber solution was found to be most suitable to raise either for the grafting ratio or the polymerization ratio. 2) Optimum temperature for better yield of graft copolymer was proved to he at $75^{\circ}C\sim80^{\circ}C$ while those of reaction time was to be $1\sim2$ hours.

• Journal of Adhesion and Interface
• /
• v.8 no.4
• /
• pp.8-13
• /
• 2007

In this study, solvent-free waterborne polyurethanes (SWPU) were synthesized with teramethylxylene diisocyanate (TMXDI), poly(tetramethylene glycol) (PTMG) and polycarprolactone (PCL) and different mole ratio of dimethylol proponicacid (DMPA). The effect of ionic contents in the solvent-free waterborn polyurethane on thermal, mechanical properties and adhesion strength were studied. Glass transition temperature (Tg) were in range of $-70{\sim}-50^{\circ}C$ and increased as PCL contents increased in polyol. With more incorporation of PCL and DMPA contents in SWPU, tensile strength, adhesion strength and heat resistance of SWPU increased, while the elongation decreased.

• Korean Journal of Optics and Photonics
• /
• v.17 no.5
• /
• pp.480-486
• /
• 2006

Generally, IR cut-off filters for mobile phone is coated on the glass substrate at high temperature(above $300^{\circ}C$). In this work, we prepared IR cut-off filters on the poly(methyl methacrylate)(PMMA) substrates at low temperature(about $70^{\circ}C$ ). using the $CeO_2\;and\;SiO_2$ coatings by physical vapor deposition. The surface energies of coated and uncoated PMMA, and adhesive properties of IR cut-off filters coatings were examined using contact angle measurements. We demonstrate the improve of mobile phone optical system using these results.

• Journal of the Optical Society of Korea
• /
• v.19 no.3
• /
• pp.217-221
• /
• 2015

Developing a metallization that has low cost and high efficiency is essential in solar-cell industries, to replace expensive silver-based metallization. Ni/Cu two-step metallization is one way to reduce the cost of solar cells, because the price of copper is about 100 times less than that of silver. Alkaline electroless plating was used for depositing nickel seed layers on the front electrode area. Prior to the nickel deposition process, 2% HF solution was used to remove native oxide, which disturbs uniform nickel plating. In the subsequent step, a nickel sintering process was carried out in $N_2$ gas atmosphere; however, copper was plated by light-induced plating (LIP). Plated nickel has different properties under different bath conditions because nickel electroless plating is a completely chemical process. In this paper, plating bath conditions such as pH and temperature were varied, and the metal layer's structure was analyzed to investigate the adhesion of Ni/Cu metallization. Average adhesion values in the range of 0.2-0.49 N/mm were achieved for samples with no nickel sintering process.

• Journal of Dental Anesthesia and Pain Medicine
• /
• v.19 no.1
• /
• pp.11-19
• /
• 2019

Hyaluronic acid (HA) has long been studied in diverse applications. It is a naturally occurring linear polysaccharide in a family of unbranched glycosaminoglycans, which consists of repeating di-saccharide units of N-acetyl-D-glucosamine and D-glucuronic acid. It is almost ubiquitous in humans and other vertebrates, where it participates in many key processes, including cell signaling, tissue regeneration, wound healing, morphogenesis, matrix organization, and pathobiology. HA is biocompatible, biodegradable, muco-adhesive, hygroscopic, and viscoelastic. These unique physico-chemical properties have been exploited for several medicinal purposes, including recent uses in the adjuvant treatment for chronic inflammatory disease and to reduce pain and accelerate healing after third molar intervention. This review focuses on the post-operative effect of HA after third molar intervention along with its various physio-chemical, biochemical, and pharmaco-therapeutic uses.