• Title/Summary/Keyword: Adhesion promoter

Search Result 51, Processing Time 0.015 seconds

The Physical and Thermal Properties Analysis of the VOC Free Composites Comprised of Epoxy Resin, and Dicyandiamide (VOC Free Epoxy Resin/Dicyandiamide 경화물의 배합비 변화에 따른 물리적 특성 및 열적특성 분석)

  • Kim, Daeyeon;Kim, Soonchoen;Park, Young IL;Kim, Young Chul;Lim, Choong-Sun
    • Clean Technology
    • /
    • v.21 no.1
    • /
    • pp.76-82
    • /
    • 2015
  • Volatile organic compounds (VOC) free adhesives have been interested by many scientists and engineers due to environmental regulations and the safety of industrial workers. In this work, a series of composites composed with bisphenol A epoxy resin used as solvent, dicyandiamide, and promoter were prepared to investigate the most appropriate molar ratio for steel-steel adhesion. The cured test specimen of each composite were measured with universal testing machine (UTM) to figure out mechanical properties such as tensile strength, Young’s modulus, and elongation. Furthermore, the lap shear strength of the specimen was tested with UTM while impact resistance was measured with Izod impact tester. The composite whose molar ratio of epoxy resin to curing agent is 1 : 0.9 (sample 3), showed better tensile strength, coefficient of elastic modulus, elongation, and impact strength than other composites did. The highest tanδ from dynamic mechanical analysis (DMA) was observed from sample 2 (epoxy resin: dicy = 1 : 0.7) while sample 3 showed slightly lower tanδ than that of 2. The morphology of the fracture surface of the cured composites from SEM showed that the number of subtle lines on the surface caused by impact increase as the contents of amine curing agent accrete. Furthermore, the viscosity change of sample 5 (epoxy resin: dicy = 1 : 1.3) was observed to confirm its storage stability.