• 열처리공학회지
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• 제17권4호
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• pp.236-240
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• 2004

Effect of plasma power on PECVD process were investigated in this study. TiN and TiCN films were deposited on nitrided STD11 steel with 600W, 1,200W and 1,600W plasma power. As the plasma power was increased, the preferred orientation was reinforced from (200) to (111) and the hardness of films was improved. The low plasma power was, however, effective for improving of adhesion force of films. Regarding above properties, TiN and TiCN films were deposited by gradient plasma power. It was possible to get high hardness as well as adhesion force through gradient plasma power.

• 한국산학기술학회논문지
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• 제5권5호
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• pp.433-437
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• 2004

The MmSH is a process of injecting ABS to produce innovated physical properties compared to the conventional injection process. Physical properties such as thickness and adhesion strength of Ni plate electrolessly coated on a conventional and a MmSH injected ABS have been studied in the pH range 4~8. Thickness of the plate on the MmSH and the conventionally injected ABS appeared to be directly proportional to pH. The ABS processed by the conventional injection showed adhesion strength corresponded to ASTM 4B above pH 5. On the other hand, the ABS processed by the MmSH injection showed a superior adhesion strength corresponded to ASTM 5B above pH 6. It was calculated the shielding effectiveness of above 50 dB in all conditions.

• 한국표면공학회지
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• 제29권3호
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• pp.186-194
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• 1996

In this study, ceramic film was coated by a sol-gel process for increasing the adhesion strength between the substrate and copper layer. TEOS and ATSB were used as starting solution of metallic alkoxide. As a result, amorphous-like diffraction pattern after heat treatment at $1200^{\circ}C$ was obtained using X-ray diffractometer. The more contants of $Al_2O_3$ gave rise to the futher advanced cracks. A maximum adhesion strength of 250gf was measured under the condition of 30 Wt.% $Al_2O_3$, which is 5 times greater than that of uncoated one of the ceramic film.

• 반도체디스플레이기술학회지
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• 제15권4호
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• pp.67-72
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• 2016

In this study, the texturing and the emitter formation processes were carried out with the wafer adhesion method to increase the productivity and reduce the production cost of the multi-crystalline silicon solar cell. After fabricating $156{\times}156mm$ solar cell according to the wafer adhesion method, the operation characteristics were analyzed and compared with those of the solar cell fabricated by the standard process method. In the case of a solar cell formed by the wafer adhesion method, it showed Jsc of $32.87mA/cm^2$, Voc of 0.612V, FF of 78.04% and efficiency of 15.71% respectively. The efficiency of the solar cell formed by the wafer adhesion method was 0.1% higher than that of the solar cell formed by the standard method. In addition, the productivity of the texturing and the emitter formation processes is expected to be approximately doubled. Therefore, it is expected that the manufacturing cost of the multi-crystalline solar cell can be reduced due to the improved productivity compared with the standard process.

• Journal of the Optical Society of Korea
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• 제18권6호
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• pp.753-761
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• 2014

We propose a two-step UV irradiation procedure to fabricate polymer-dispersed liquid crystal (PDLC) films by lamination. During the first UV treatment, before lamination, the UV-curable monomers coated on one film substrate are solidified through photo-polymerization as the phase separation between the liquid crystals and the monomers. Introducing an adhesion-enhancement layer on the other plastic substrate and controlling the UV irradiation conditions ensure that UV-induced cross-linkable functional groups remain on the surfaces of the photo-polymerized layers. Thereby, the adhesion stability between the top and bottom films is much improved during a second (post-lamination) UV treatment by further UV-induced cross-linking at the interface. Because the adhesion-enhancement and PDLC layers prepared by the bar-coating process are solidified before lamination, the PDLC droplet distribution and the cell gap between the two plastic substrates remain uniform under the lamination pressure. This ensures that the voltage-controlled light transmittance is uniform across the entire sample.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.61-62
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• 2006

In this paper, it was demonstrated that organic thin- film transistors (OTFTs) were fabricated with the organic adhesion layer between an organic semiconductor and a gate insulator by vapor deposition polymerization (VDP) processing. In order to form polymeric film as an adhesion layer, VDP process was also introduced instead of spin-coating process, where polymeric film was co-deposited by high-vacuum thermal evaporation from 6FDA and ODA followed by curing. The saturated slop in the saturation region and the subthreshold nonlinearity in the triode region were c1early observed in the electrical output characteristics in our organic thin film transistors using the staggered-inverted top-contact structure. Field effect mobility, threshold voltage, and on-off current ratio in 15-nm-thick organic adhesion layer were about $0.5\;cm^2/Vs$, -1 V, and $10^6$, respectively. We also demonstrated that threshold voltage depends strongly on the delay time when a gate voltage has been applied to bias stress.

• 환경생물
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• 제27권1호
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• pp.88-94
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• 2009

안토시아닌(Anthocyanin)은 플라보노이드계 화합물의 한 부류로 항산화, 항암 및 항궤양, 항당뇨, 중금속해독, 시력보호, 콜레스테를 저하 등의 다양한 생리활성을 가지는 것으로 보고되어 있다. 죽상경화과정은 염증성 사이토카인의 분비 또는 혈관손상으로 인한 백혈구의 부착과 이동을 통해 시작된다. 본 연구는 이러한 죽상경화의 초기과정에서 안토시아닌 혼합물 중 single compound인 delphinidin chloride (DC) 인간혈관 내피세포주(HUVEC, human umbilical vein endothelial cell line)에서 백혈구 부착과 관련이 있는 ICAM-1 (Intraceliular Adhesion Molecule-1)과 VCAM-1 (Vascular Adhesion Molecule-1) 발현에 미치는 영향에 대해 조사하였다. 세포독성이 없는 농도에서 TNF-$\alpha$에 의해 유도된 혈관 내피세포에 대한 단핵구의 부착정도를 측정하기 위해 monocyte-endothelial cell adhesion assay와 광학현미경을 이용한 형태학적 관찰을 한 결과 DC가 처리농도 의존적으로 부착을 억제하였다. 내피세포로부터 TNF-$\alpha$에 의해 유도된 세포부착 분자인 VCAM-1과 ICAM-1의 발현에 대한 영향을 western blot analysis 및 RT-PCR방법으로 비교 분석한 결과 VCAM-1과 ICAM-1의 단백질과 mRNA수준에서의 발현이 농도 의존적으로 감소되었다. 이러한 결과들을 종합해 볼 때 안토시아닌 중에서 DC를 실험한 결과 DE는 TNF-$\alpha$에 의해 유도된 내피세포의 ICAM-1과 VCAM-1 발현 억제효과를 확인할 수 있었다.

• 한국표면공학회지
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• 제45권1호
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• pp.8-14
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• 2012

The effects of the alkali surface modification process on the adhesion strength between electroless-plated Cu and polyimide films were investigated. The polyimide surfaces were effectively modified by alkali surface treatments from the hydrophobic to the hydrophilic states, and it was confirmed by the results of the contact angle measurement. The surface roughness increased by alkali surface treatments and the adhesion strength was proportional to the surface roughness. The adhesion strength of Cu/polyimide interface treated by KOH + EDA (Ethylenediamine) was 874 gf/cm which is better than that treated by KOH and KOH + $KMnO_4$. The results of XPS spectra revealed that the alkali treatment formed oxygen functional groups such as carboxyl and amide groups on the polyimide films which is closely related to the interfacial bonding mechanism between electroless-plated Cu and polyimide films. It could be suggested that the species and contents of functional group on polyimide films, surface roughness and contact angle were related with the adhesion strength of Cu/polyimide in combination.

• 접착 및 계면
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• 제14권3호
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• pp.111-116
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• 2013

본 연구에서는 신발에 사용되는 고무부품의 접착에 있어서 버핑 및 용매 세척 등의 표면처리 공정을 대체하기 위하여, 플라즈마 처리를 통한 표면 및 접착특성을 알아보았다. 플라즈마 처리 시 분사노즐과 고무 시편과의 거리가 감소할수록 접촉각은 감소하였으며, 플라즈마 처리속도가 증가함에따라 접촉각은 증가하였다. 고무 시편의 표면조도 측정결과 플라즈마 처리 후 Ra 값은 20%, Rz 값은 16%가 증가하는 결과를 나타내었다. 플라즈마 발생 노즐과 고무시편과의 거리가 증가함에 따라 접착력은 감소하고, 플라즈마 처리속도가 증가함에 따라 접착력은 감소하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.561-562
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• 2006

The purpose of this study was to investigate the root cause of adhesion of silica and ceria particles during Poly-Si, TEOS, and SiN CMP process, respectively. The zeta-potentials of abrasive particles and wafers were observed negative surface charges in the alkaline solutions. SAC and STI patterned wafers have intermediate values of their composition surface's zeta potentials. The theoretical interaction force and adhesion force of silica and ceria particle were calculated in solution with acidic, neutral and alkaline pH. A stronger attractive force was calculated for silica and ceria particles on wafers in acidic solutions than in alkaline solutions. The theoretical interaction forces of the SAC and STI patterned wafers have intermediate values of their constitution wafer's values. The adhesion forces is observed lower values in alkaline solutions than in acidic solutions. And the ceria particle has lower adhesion than that of the silica particle.