• 제목/요약/키워드: Adhesion process

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이성분계 혼합 폴리우레탄 수분산체의 제조 및 접착 특성 연구 (Preparation and Adhesion Characteristics of Binary Blended Waterborne Polyurethane)

  • 김은지;백인규;박재형
    • 접착 및 계면
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    • 제19권1호
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    • pp.5-12
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    • 2018
  • 본 연구는 선처리제 공정을 생략하고 우수한 접착 특성을 가지는 합성피혁용 스킨(skin) 수지제조에 관한 것으로 이성분계 혼합 폴리우레탄 수분산체를 제조하여 이에 대한 선처리제(primer)를 생략한 접착 시편의 접착특성을 평가하는 것이다. 이성분계 혼합 폴리우레탄 수분산체의 제조는 에스터(ester)계 폴리우레탄 수지(PU-T)와 카보네이트(carbonate)계 폴리우레탄 수지(PU-C)를 각각 합성하고 이를 배합함으로써 최종 수지를 얻었다. 선처리제를 생략한 접착시편의 접착강도 측정결과, 우수한 상태접착강도 (Ethylene vinyl acetate(중창): $4.2kg_f/cm$, 고무(겉창) : $4.4kg_f/cm$)를 가짐을 확인할 수 있었다. 이는 신발 제조 공정에서 필수불가결하게 사용되었던 선처리제(primer) 공정을 생략가능하게 함으로써 공정의 단축과 선처리제(primer)에서 발생되는 휘발성유기화합물 (VOCs)의 감소를 가져와 친환경적인 장점을 지닌다.

분자동역학 시뮬레이션을 이용한 다이아몬드 나노임프린트 리소그라피에서의 점착에 관한 연구 (A Study on Adhesion in Diamond Nanoimprint Lithography Using Molecular Dynamics Simulation)

  • 김광섭;강지훈;김경웅
    • 한국윤활학회:학술대회논문집
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    • 한국윤활학회 2004년도 학술대회지
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    • pp.83-89
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    • 2004
  • In this paper, molecular dynamics simulations are performed to analyze the adhesion between a diamond mould and a copper substrate in diamond nanoimprint lithography. The diamond nanoimprint lithography process is simplified as punch-type nanoindentation. The copper substrates are assumed to monocrystalline and defect free and consist of $22500\~80000$ atoms depending on their dimension. The diamond moulds consist of 916 or 2414 atoms, which is assumed to be rigid. The consistent results lot the maximum normal force and the adhesion force are obtained regardless of the size of substrates and the adhesion hysteresis is shown in all cases. It is found that the friction acting on the sidewalls of the mould affects the adhesion significantly when the mould is released from the substrate.

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Electrical Effects of the Adhesion Layer Using the VDP Process on Dielectric

  • Lee, Dong-Hyun;Pyo, Sang-Woo;Hyung, Gun Woo;Kim, Young-Kwan
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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    • pp.1313-1316
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    • 2005
  • In the present paper, it was investigated that adhesion layer on gate insulator could affect the electrical characteristics for the organic thin film transistors (OTFTs). The polyimide (PI) as organic adhesion layer was fabricated by using the vapor deposition polymerization (VDP) processing . It was found that electrical characteristics improved comparing OTFTs using adhesion layer to another. We researched adhesion layer as a function of thickness. For inverted-staggered top contact structure, field effect mobility, threshold voltage, and on-off current ratio of OTFTs using adhesion layer of PI 15 nm thickness on the gate insulator with a thickness of 0.2 ${\mu}m$ were about 0.5 $cm^2/Vs$, -0.8 V, and $10^6$, respectively.

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Electrical Characteristics of Bottom-Contact Organic Thin-Film-Transistors Inserting Adhesion Layer Fabricated by Vapor Deposition Polymerization and Ti Adhesion Metal Layer

  • Park, Il-Houng;Hyung, Gun-Woo;Choi, Hak-Bum;Kim, Young-Kwan
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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    • pp.958-961
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    • 2007
  • The electrical characteristics of organic thin-filmtransistor (OTFTs) can be improved by inserting adhesion layer on gate dielectrics. Adhesion layer was used as polymeric adhesion layer deposited on inorganic gate insulators such as silicon dioxide $(SiO_2)$ and it was formed by vapor deposition polymerization (VDP) instead of spin-coating process. The OTFTs obtained the on/off ratio $of{\sim}10^4$, threshold voltage of 1.8V, subthreshold slop of 2.9 V/decade and field effect mobility about $0.01\;cm^2/Vs$.

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Activated Rap1A Induces Osteoblastic Differentiation and Cell Adhesion

  • Kim, Hyeseon;Jeon, Taeck J.
    • 통합자연과학논문집
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    • 제9권3호
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    • pp.171-176
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    • 2016
  • Rap1 is a key regulator of cell adhesion and migration. Although increasing evidence indicates that the Rap1 signaling pathway is involved in the process of bone remodeling, the mechanism by which Rap1 regulates osteoblastic differentiation and cell adhesion remains unknown. Here, we investigated the morphological characteristics and osteoblastic differentiation of cells expressing constitutively activated form of Rap1A (Rap1ACA) or Rap1 GTPase activating protein Rap1GAP and found that activated Rap1 induces osteoblastic differentiation and cell adhesion as well as cell spreading. When osteoblastic differentiation was induced, Rap1ACA cells showed considerably higher levels of calcium deposits than the wild-type and Rap1GAP-overexpressing cells did. Rap1ACA cells showed increased spreading and size, as well as strong cell adhesion and significantly decreased growth rates. F-actin staining using phalloidin revealed several thin thread-like filopodia around the protrusions in Rap1ACA cells, which possibly contribute to the increased cell adhesion.

DLC 박막과 복합처리(Nitriding/DLC)한 박막의 기계적 특성 비교 (Mechanical Properties of DLC Films and Duplex Plasma Nitriding/DLC Coating Treatment Process)

  • 박현준;김민채;김상섭;문경일
    • 한국표면공학회지
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    • 제53권6호
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    • pp.306-311
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    • 2020
  • In this work, diamond-like carbon (DLC) films are coated onto plasma nitrided AISI 4140 steel by DC-pulsed PECVD. One problem of DLC films is their very poor adhesion on steel substrates. The purpose of the nitriding was to enhance adhesion between the substrate and the DLC films. The white layer formation is avoided. Plasma nitriding increased adhesion from 8 N for DLC coating to 25 N for duplex coating. Duplex plasma nitriding/DLC coating was proven to be more effective in improving the adhesion. The purpose of the bond layer was to enhance adhesion between the substrate and the DLC films.

폴리카보네이트에서의 표면개질 조건과 DC-Bias Sputtering 증착에 따른 Cu 밀착성 (Adhesion of Cu on Polycarbonate with the Condition of Surface Modification and DC-Bias Sputtering Deposition)

  • 배길상;엄준선;이인선;김상호;고영배;김동원
    • 한국표면공학회지
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    • 제37권1호
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    • pp.5-12
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    • 2004
  • The enhancement of adhesion for Cu film on polycarbonate (PC) surface with the $Ar/O_2$ gas plasma treatment and dc-bias sputtering was studied. The plasma treatment with this reactive mixture changes the chemical property of PC surface into hydrophllic one, which is shown by the variation of contact angle with surface modification. The micro surface roughness that also gives the high adhesive environment is increased by the $Ar/O_2$ gas plasma treatment. These results were observed distinctly from the atomic force microscopy (AFM). The negative substrate dc-bias effect for the Cu adhesion on PC was also investifated. Accelerated $Ar^{+}$ lons in sheath area of anode bombard the bare surface of PC during initial stage of dc bias sputtering. PC substrate. therefore, has severe roughen and hydrophilic surface due to the physical etching process with more activated functional group. As dc-bias sputtering process proceeds, morphology of Cu film shows better step coverage and dense layer. The results of peel test show the evidence of superiority of bias sputtering for the adhesion between metal Cu and PC.C.

Adhesion and Corrosion Resistance of Electrophoretic Paint on "Electroless" Paint Coated AZ31 Mg Alloy

  • Phuong, Nguyen Van;Kim, Donghuyn;Moon, Sungmo
    • 한국표면공학회지
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    • 제51권6호
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    • pp.405-414
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    • 2018
  • The present study investigated the adhesion and corrosion resistance of subsequent electrophoretic paint (E-paint) on "electroless" paint coated AZ31 Mg alloy, which was formed by immersion of AZ31 Mg alloy in E-painting solution. It was found that with increasing immersion time of AZ31 in E-painting solution, the amount of paint deposited by electroless process increased but it decreased the electrochemical equivalent of E-painting process and the adhesion of the subsequent E-paint layer. The E-paint on electroless paint coated AZ31 contained pores with the highest pore density and the largest pore size was obtained on the samples with electroless times of 2 and 5 minutes, respectively. Results of the salt-spray test showed an accelerated growth of blisters over the entire surface of the sample immersed for less than 5 minutes whereas blisters were observed only in the vicinity of the scratch in case of samples treated for 15 and 30 minutes. The E-paint on AZ31 with shorter electroless immersion time in E-painting solution was found to have good adhesion and better corrosion resistance.

자동차 구조용 접착제를 이용한 자동차용 Pre-primed 도료의 비용접식 접합공정 적용 (Automotive Pre-primed Coatings with Automotive Structural Adhesive for Non-weldable Binding Process)

  • 문제익;이용희;김현중;노승만;남준현;김민수;김준기;김종훈
    • 접착 및 계면
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    • 제12권3호
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    • pp.99-104
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    • 2011
  • 21세기 들어 자동차 도료산업은 엄격한 환경규제 및 생산 효율성 향상 및 더 낮은 생산비용으로 자동차용 도료를 생산하기 위하여 세정 및 전처리 과정을 삭제한 pre-primed 도장 시스템이 연구되고 있다. 이러한 pre-primed 도료 시스템의 경우, 차체 조립 전 단계에 강판이 유기 도막으로 도장되어있기 때문에 기존의 용접을 통한 조립이 힘들어 용접공정을 대체할 수 있는 새로운 비용접식 접합기술의 개발이 필요한 실정이다. 본 연구에서 비용접식 pre-primed 시스템에 적용하기 위하여 유연성과 성형성이 향상된 polyester계의 primer 1과 polyurethane계의 primer 2를 개발하였다. 개발된 도료의 물리적인 물성과 도장면의 부착력 평가 결과, primer 1이 primer 2에 비하여 연필경도, 내용제성, 유연성 및 접착제와의 부착력이 뛰어남을 알 수 있었으며, 용접공정을 대신한 비용접식 pre-primed 시스템의 가능성을 확인할 수 있었다.

플라즈마 질화처리한 사출금형소재의 비정질 탄소계 박막 증착에 따른 기계적 특성 향상 효과 (The effect of mechanical properties of carbon-based thin film on plasma nitrided injection mold steel )

  • 김혜민;김대욱
    • 한국표면공학회지
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    • 제56권5호
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    • pp.328-334
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    • 2023
  • The carbon-based films have various properties, which have been widely applied in industrial application. However, it has critical drawback for poor adhesion between films and metal substrate. In the present work, we have deposited carbon-based films on injection mold steel by plasma assisted chemical vapor deposition (PACVD). In order to improve adhesion, prior to film deposition, the substrate was nitriding-treated using PACVD. And its effect on the adhesion was investigated. Due to the pre-nitriding, the amorphous carbon nitride (a-CN:H) films presented 10 times higher adhesion (34.9 N) than that of un-nitirided. In addition, a friction coefficient was decreased from 0.29 to 0.15 for the amorphous carbon (a-C:H) due to improved adhesion. The obtained results demonstrated that pre-nitriding considerably improved the adhesion, and the relationship among adhesion, hardness, and surface roughness was discussed in detail.