• Title/Summary/Keyword: Adhesion performance

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Historical Trends of Micromechanical Testing Methods for Structural Fiber Reinforced Composites to Evaluate the Interfacial Adhesion (구조용 섬유강화복합재료의 계면접착 특성 평가를 위한 미세역학시험법의 연구동향 고찰)

  • Park, Joung-Man;Kim, Jong-Hyun;Kim, Dong-Uk;Kwon, Dong-Jun
    • Journal of Adhesion and Interface
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    • v.23 no.3
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    • pp.59-69
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    • 2022
  • In composite materials, the adhesion and interfacial properties were the most important factors to obtain high performance of mechanical properties. This review paper had been focused on the micromechanical evaluation methods for the interfacial property historically. The interfacial property of fiber-reinforced composites (FRC) could be evaluated using only a single fiber and matrix via various micromechanical testing methods. Self-sensing due to the fracture behavior of FRC could be determined and discussed more critically and clearly using electro-micromechanical evaluation. In this paper, the research trends for micro-mechanical evaluation of composites was summarized, and their practical applications would be suggested in the future.

Recent Research Trend in Synthesis of Two-Dimensional Graphene through Interface Engineering (계면 제어를 통한 2차원 그래핀 성장의 최근 연구 동향)

  • Lee, Seung Goo;Lee, Eunho
    • Journal of Adhesion and Interface
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    • v.22 no.3
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    • pp.79-84
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    • 2021
  • Graphene has been received a lot of attention as essential parts of future electronic and energy devices. Because of its extraordinary properties contributed from the atomic layer, the interface and surface engineering of graphene are promising approaches for realizing 2D materials-based high-performance devices. Herein, we summarize and introduce recent research trends of the synthesis of graphene through interface engineering for high-performance electronic and energy device applications, and then discuss the challenges and opportunities for achieving high-performance devices in next-generation electronics.

Overview of Interface Engineering for Organic Solar Cells (유기태양전지 계면 기술 동향)

  • Kim, Gi-Hwan
    • Journal of Adhesion and Interface
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    • v.22 no.4
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    • pp.113-117
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    • 2021
  • Among the next-generation solar cells, organic solar cells using organic materials are a key energy production device for the future energy generation devices, and have recently been receiving a lot of attention with rapid growth. To improve the efficiency of organic solar cells, interfacial engineering technology has been widely applied. In particular, it is widely used to improve device efficiency through energy level control by using interface engineering on the anode and cathode, which are positive electrodes, and to ultimately utilize interface engineering for tandem organic solar cells to derive excellent electrical and optical performance to produce high-performance devices. In this article, we will summarize and introduce recent research trends on interfacial engineering used in organic solar cells, and discuss the method of manufacturing high-performance organic solar cells.

Performance of Cemented Carbides in Cyclic Loading Wear Conditions

  • Kubarsepp, J.;Klaasen, H.;Sergejev, F.
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09b
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    • pp.887-888
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    • 2006
  • The present study describes the wear and mechanical behaviour of carbide composites in cyclic loading applications (blanking of sheet metal). Adhesive wear as well as fatigue endurance were tested, complemented by XRD studies. It was found that the blanking performance of a carbide composite is controlled by its resistance to adhesion wear and fatigue sensitivity. XRD studies revealed that fatigue damage is preceded by plastic strain in both phases of the composites

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Evaluation for Adhesion Characteristics of UV-curable Bump Shape Stamp for Transfer Process (전사공정을 위한 UV 경화성 범프형 스탬프의 점착특성 평가)

  • Jeong, Yeon-Woo;Kim, Kyung-Shik;Lee, Chung-Woo;Lee, Jae-Hak;Kim, Jae-Hyun;Kim, Kwang-Seop
    • Tribology and Lubricants
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    • v.32 no.3
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    • pp.75-81
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    • 2016
  • Future electronics such as electronic paper and foldable cellphone are required to be flexible and transparent and should have a high performance. In order to fabricate the flexible electronics using flexibility transfer process, techniques for transferring various devices from rigid substrate onto flexible substrate by elastomeric stamp, have been developed. Adhesion between the elastomeric stamp and various devices is crucial for successful transfer process. The adhesion can be controlled by the thickness of the stamp, separation velocity, contact load, and stamp surface treatment. In this study, we fabricated the bump shape stamp consisting of a UV-curable polymer and investigated the effects of curing condition, separation velocity, and contact load on the adhesion characteristics of bumps. The bumps with hemispherical shape were fabricated using a dispensing process, which is one of the ink-jet printing techniques. Curing conditions of the bumps were controlled by the amount of UV irradiation energy. The adhesion characteristics of bumps are evaluated by adhesion test. The results show that the pull-off forces of bumps were increased and decreased as UV irradiation energy increased. For UV irradiation energies of 300 and 500 mJ/cm2, the pull-off forces were increased as the separation velocity increased. The pull-off forces also increased with the increase of contact load. In the case of UV irradiation energy above 600 mJ/cm2, however, the pull-off forces were not changed. Therefore, we believe that the bump shape stamp can be applied to roll-based transfer process and selective transfer process as an elastomeric stamp.

A Study on the Adhesion Properties of Polymer-Cement Composites for Repairing Cracks in RC Structures (RC 구조물의 균열 보수용 폴리머 시멘트 복합체의 접착특성에 관한 연구)

  • Jo, Young-Kug;Hong, Dae-Won;Kwon, Woo-Chan;Kim, Wan-Ki
    • Journal of the Korea Institute of Building Construction
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    • v.22 no.1
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    • pp.23-34
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    • 2022
  • The purpose of this study is to evaluate the adhesion properties of polymer cement composites for crack repair of an RC structure. Polymer cement composites are manufactured from cement, three types of polymers and silica fume, and the mixture is designed by adjusting the water cement ratio and AE reducing agent so that the viscosity target of the polymer cement composites is 700mPa·s or less. According to the test results, the Type-A adhesion in tension of the polymer cement composite exceeded the adhesion standard of 1.0MPa of the polymer finishing material, and furthermore, depending on the type of polymer, the adhesion in tension was highest for SAE, followed in descending order by EVA, and SBR. In addition, the adhesion in tension of Type-B is up to 1/4.5 lower than that of Type-A, but the incorporation of silica fume shows a significant improvement in terms of adhesion in tension. Based on this study, the basic mixing design of the polymer cement composites required for viscosity and adhesive performance required for crack repair of the RC structure was completed. It could be proposed as an optimal mixing design under conditions for intermixing polymer type EVA, SAE, and P/C 80%-100%.

Improvement of Interfacial Performances on Insulating and Semi-conducting Silicone Polymer Joint by Plasma-treatment

  • Lee, Ki-Taek;Huh, Chang-Su
    • Transactions on Electrical and Electronic Materials
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    • v.7 no.1
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    • pp.16-20
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    • 2006
  • In this paper, we investigated the effects of short-term oxygen plasma treatment of semiconducting silicone layer to improve interfacial performances in joints prepared with a insulating silicone materials. Surface characterizations were assessed using contact angle measurement and x-ray photoelectron spectroscopy (XPS), and then adhesion level and electrical performance were evaluated through T-peel tests and electrical breakdown voltage tests of treated semi-conductive and insulating joints. Plasma exposure mainly increased the polar component of surface energy from $0.21\;dyne/cm^2$ to $47\;dyne/cm^2$ with increasing plasma treatment time and then leveled off. Based on XPS analysis, the surface modification can be mainly ascribed to the creation of chemically active functional groups such as C-O, C=O and COH on semi-conductive silicone surface. This oxidized rubber layer is inorganic silica-like structure of Si bound with three to four oxygen atoms ($SiO_x,\;x=3{\sim}4$). The oxygen plasma treatment produces an increase in joint strength that is maximum for 10 min treatment. However, due to brittle property of this oxidized layer, the highly oxidized layer from too much extended treatment could be act as a weak point, decreasing the adhesion strength. In addition, electrical breakdown level of joints with adequate plasma treatment was increased by about $10\;\%$ with model samples of joints prepared with a semi-conducting/ insulating silicone polymer after applied to interface.

Vehicle Longitudinal Brake Control with Wheel Slip and Antilock Control (바퀴 슬립과 잠김 방지 제어를 고려한 차량의 종렬 브레이크 제어)

  • Liang Hong;Choi Yong-Ho;Chong Kil-To
    • Journal of Institute of Control, Robotics and Systems
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    • v.11 no.6
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    • pp.502-509
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    • 2005
  • In this paper, a 4-wheel vehicle model including the effects of tire slip was considered, along with variable parameter sliding control, in order to improve the performance of the vehicle longitudinal response. The variable sliding parameter is made to be proportional to the square root of the pressure derivative at the wheel, in order to compensate for large pressure changes in the brake cylinder. A typical tire force-relative slip curve for dry road conditions was used to generate an analytical tire force-relative slip function, and an antilock sliding control process based on the analytical tire force-relative slip function was used. A retrofitted brake system, with the pushrod force as the end control parameter, was employed, and an average decay function was used to suppress the simulation oscillations. The simulation results indicate that the velocity and spacing errors were slightly larger than those obtained when the wheel slip effect was not considered, that the spacing errors of the lead and follower were insensitive to the adhesion coefficient up to the critical wheel slip value, and that the limit for the antilock control under non-constant adhesion road conditions was determined by the minimum value of the equivalent adhesion coefficient.

The study on the influence of surface cleanness and water soluble salt on corrosion protection of epoxy resin coated carbon steel

  • Shon, MinYoung
    • Corrosion Science and Technology
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    • v.13 no.5
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    • pp.163-169
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    • 2014
  • The corrosion resistance of epoxy-coated carbon steel was evaluated. The carbon steel surface was subjected to different treatment methods such as steel grit blasting and power tool treatment as well as contamination of water soluble salt. To study the effect of the surface treatments and contamination, the topology of the treated surface was observed by confocal microscopy and a pull-off adhesion test was conducted. The corrosion resistance of the epoxy-coated carbon steel was further examined by electrochemical impedance spectroscopy (EIS) combined with immersion test of 3.5 wt% of NaCl solution. Consequently, the surface contamination by sodium chloride with $16mg/m^2$, $48mg/m^2$ and $96mg/m^2$ didn't affect the adhesion strength for current epoxy coated carbon steel and blister and rust were not observed on the surface of epoxy coating contaminated by various concentration of sodium chloride after 20 weeks of immersion in 3.5 wt% NaCl aqueous solutions. In addition, the results of EIS test showed that the epoxy-coated carbon steel treated with steel grit blasting and power tool showed similar corrosion protection performance and surface cleanness such as Sa 3 and Sa 2.5 didn't affect the corrosion protectiveness of epoxy coated carbon steel.

Effect of Desmear Treatment on the Interfacial Bonding Mechanism of Electroless-Plated Cu film on FR-4 Substrate (Desmear 습식 표면 전처리가 무전해 도금된 Cu 박막과 FR-4 기판 사이의 계면 접착 기구에 미치는 영향)

  • Min, Kyoung-Jin;Park, Young-Bae
    • Korean Journal of Materials Research
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    • v.19 no.11
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    • pp.625-630
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    • 2009
  • Embedding of active devices in a printed circuit board has increasingly been adopted as a future electronic technology due to its promotion of high density, high speed and high performance. One responsible technology is to embedded active device into a dielectric substrate with a build-up process, for example a chipin-substrate (CiS) structure. In this study, desmear treatment was performed before Cu metallization on an FR-4 surface in order to improve interfacial adhesion between electroless-plated Cu and FR-4 substrate in Cu via structures in CiS systems. Surface analyses using atomic force microscopy and x-ray photoemission spectroscopy were systematically performed to understand the fundamental adhesion mechanism; results were correlated with peel strength measured by a 90o peel test. Interfacial bonding mechanism between electrolessplated Cu and FR-4 substrate seems to be dominated by a chemical bonding effect resulting from the selective activation of chemical bonding between carbon and oxygen through a rearrangement of C-C bonding rather than from a mechanical interlocking effect. In fact, desmear wet treatment could result in extensive degradation of FR-4 cohesive strength when compared to dry surface-treated Cu/FR-4 structures.